Abstract: Disclosed are a method and an astrophotographic apparatus for acquiring images of targets in a sky area. The method includes: step 1, an image acquisition device is driven through a controlled rotatable component to point to the position near a target in a sky area, and images of the sky area are acquired through the image acquisition device; step 2, the images of the sky area are analyzed to obtain the right ascension coordinates and the declination coordinates of the center point of images for synchronizing the coordinates to the controlled rotatable component; step 3, the image acquisition device is driven by the controlled rotatable component to point to a target position of the target right ascension coordinates and the target declination coordinates corresponding to the target celestial body to acquire the images; and step 4, an image processing is performed on the images to obtain the processed images.

Abstract: An animated emoticon generation method, a computer-readable storage medium, and a computer device are provided. The method includes: displaying an emoticon input panel on a chat page; detecting whether a video shooting event is triggered in the emoticon input panel; acquiring video data in response to detecting the video shooting event; obtaining an edit operation for the video data; processing video frames in the video data according to the edit operation to synthesize an animated emoticon; and adding an emoticon thumbnail corresponding to the animated emoticon to the emoticon input panel, the emoticon thumbnail displaying the animated emoticon to be used as a message on the chat page based on a user selecting the emoticon thumbnail in the emoticon input panel.

Abstract: The present disclosure discloses a swashplate-type axial plunger pump with multi-channel oil feed and full-flow self-cooling and double-end-face flow distribution. The cooling oil suctioned by the plunger pump firstly cools the friction pair of the cylinder block and the plunger; then, one part of the cooling oil passes through a gap between the pump case and the cylinder block and enters the control chamber by passing by the friction pair of the oil distribution plate and the cylinder block to cool the friction pair of the oil distribution plate and the cylinder block; and the other part of the cooling oil passes through a gap between the pump case and the cylinder block and enters the control chamber by passing by the friction pair of the slipper and the swashplate to cool the friction pair of the slipper and the swashplate.

Abstract: A marketing analytics pipeline includes an opportunity detection analytics hub and a marketing platform, wherein the opportunity detection analytics hub is configured to use trend data reports from a consumption database to fit statistical models based on streaming consumption and interaction patterns of social media UGC (user generated content) and to send growth and re-engagement opportunities to a marketing action analytics hub, and wherein the marketing platform is configured to interact with the marketing action analytics hub to create targeted marketing campaigns based around high growth potential audiences.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first interconnect layer including first interconnects is formed above a first substrate. A first bonding layer including first bonding contacts is formed above the first interconnect layer, such that each first interconnect is in contact with a respective first bonding contact. A second interconnect layer including second interconnects is formed above a second substrate. A second bonding layer including second bonding contacts is formed above the second interconnect layer, such that at least one second bonding contact is in contact with a respective second interconnect, and at least another second bonding contact is separated from the second interconnects. The first and second substrates are bonded in a face-to-face manner, such that each first bonding contact is in contact with one second bonding contact at a bonding interface.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a bonded structure includes a first bonding layer including a first bonding contact and a first bonding alignment mark, a second bonding layer including a second bonding contact and a second bonding alignment mark, and a bonding interface between the first bonding layer and the second bonding layer. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface. The first bonding alignment mark includes a plurality of first repetitive patterns. The second bonding alignment mark includes a plurality of second repetitive patterns different from the plurality of first repetitive patterns.

Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and including a first bonding contact and a first bonding alignment mark. The second semiconductor structure includes a second device layer, and a second bonding layer disposed below the second device layer and including a second bonding contact and a second bonding alignment mark. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface.

Abstract: The disclosure relates to a magnetic resonance imaging device configured to exert a high-frequency electromagnetic field on an object under test in a static magnetic field and to reconstruct an image based on magnetic resonance signals. The magnetic resonance imaging device comprises a receiving coil comprising a plurality of receiving coil elements and configured to receive magnetic resonance signals and feed the magnetic resonance signals to a receiver, and a coupler configured to be coupled with at least a first receiving coil element of the receiving coil, the coupler being directionally coupled with at least the receiver, the first receiving coil element being configured to receive a high-frequency electromagnetic wave signal through the coupler. The directional coupling between the coupler and the receiver is so regulated that the first receiving coil element transmits the high-frequency electromagnetic wave signal to the object under test to sense a physiological movement signal.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.

Abstract: Big data health service method and system based on remote fundus screening are provided. The method includes steps of: acquiring information to be analyzed sent by remote terminal agency; pre-interpreting information to be analyzed, and judging whether information to be analyzed is qualified; extracting characteristic data from information to be analyzed if it is qualified, and forming structured quantitative index; sorting and analyzing characteristic data and quantitative index according to knowledge calculation model to obtain analysis conclusion; and storing information to be analyzed, characteristic data, quantitative index, and analysis conclusion into pre-designed database.

Abstract: The present invention relates to fundus image processing field, especially a preprocessing method for quantitative analysis of fundus image, and storage device. A preprocessing method for quantitative analysis of fundus image, wherein the step includes, acquiring a to-be-processed fundus image; performing optic disk positioning on the to-be-processed fundus image; performing macular fovea positioning on the to-be-processed image; and calculating a quantization parameter of a distance between a center of the macular fovea and a bitamporal edge of the optic disk. Through this method, the data obtained is converted from absolute representation to relative representation, and through normalization, a meaningful and comparable quantification is formed between people, between different people, and even between inspection results of different instruments. analyze data. It ensures that fundus images from different sources can form meaningful and comparable quantitative indicators.

Abstract: A quality control method for remote fundus screening includes acquiring a fundus image of an examinee through a fundus camera by terminal application institution and transmitting the fundus image as well as personal information and inquiry data which are carried by the examinee to a remote interpretation and consultation center. The remote interpretation consultation center determines whether the fundus image, personal information, and consultation data are qualified; if the fundus image, personal information, and consultation data are unqualified, the remote interpretation consultation center terminates the interpretation.

Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.

Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.

Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.

Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.

Abstract: A marketing analytics pipeline that receives transaction-level trend reporting of media IP assets distributed on digital service providers (DSPs), the marketing analytics pipeline including a marketing action analytics hub configured to receive the growth and re-engagement opportunities from an opportunity detection analytics hub or from a marketing platform directly and to identify high growth potential audiences using predictive models of engagement; and a marketing platform configured to interact with the marketing action analytics hub and to create marketing campaigns based around the high growth potential audiences and suggest marketing actions to media IP asset managers and owners to deliver to the high growth potential audiences on appropriate marketing channels via targeted marketing campaigns. The marketing action analytics hub uses a geodemographic and interest-based targeting method of generating descriptions of high growth potential audiences.

Abstract: The present disclosure discloses a swashplate-type axial plunger pump with multi-channel oil feed and full-flow self-cooling and double-end-face flow distribution. The cooling oil suctioned by the plunger pump firstly cools the friction pair of the cylinder block and the plunger; then, one part of the cooling oil passes through a gap between the pump case and the cylinder block and enters the control chamber by passing by the friction pair of the oil distribution plate and the cylinder block to cool the friction pair of the oil distribution plate and the cylinder block; and the other part of the cooling oil passes through a gap between the pump case and the cylinder block and enters the control chamber by passing by the friction pair of the slipper and the swashplate to cool the friction pair of the slipper and the swashplate.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. The second semiconductor structure further includes a second bonding layer including second bonding contacts. At least one second bonding contact is in contact with a respective second interconnect. At least another second bonding contact is separated from the second interconnects. The semiconductor device further includes a bonding interface between the first and second bonding layers.