Abstract: A system, method, and apparatus for implementing workflows across multiple differing systems and devices is provided herein. During operation, a workflow is automatically generated based upon a camera detecting denial of entry of an individual. The workflow can then be implemented or suggested as a newly-created workflow at other various entry points.

Abstract: A non-pneumatic tire includes a tread layer and a spoke layer including an inner cylinder and several spoke assemblies. The tread layer is annular and has a maximum outer diameter of the non-pneumatic tire and is adapted to be in contact with a ground. The spoke assemblies extend in a radial direction of the non-pneumatic tire and are arranged around an axial core of the non-pneumatic tire. An end of each spoke assembly is connected to the inner cylinder, and another end thereof is connected to the tread layer. Each spoke assembly includes a straight spoke, a bending spoke, and a connecting rib. Each bending spoke includes a first segment and a second segment, which are not connected in a straight line. Each connecting rib has a first end connected to the straight spoke and a second end opposite to the first end and connected to the bending spoke. When the non-pneumatic tire bears a weight and is squeezed, the spoke assemblies do not get in contact with one another.

Abstract: A method for processing a semiconductor wafer is provided. A semiconductor wafer includes a first main surface and a second main surface. Defects are generated inside the semiconductor wafer to define a detachment plane parallel to the first main surface. Processing the first main surface defines a plurality of electronic semiconductor components. A glass structure is provided which includes a plurality of openings. The glass structure is attached to the processed first main surface, each of the plurality of openings leaving a respective area of the plurality of electronic semiconductor components uncovered. A polymer layer is applied to the second main surface and the semiconductor wafer is split into a semiconductor slice and a remaining semiconductor wafer by cooling the polymer layer beneath its glass transition temperature along the detachment plane. The semiconductor slice includes the plurality of electronic semiconductor components.

Abstract: A system, method, and apparatus for implementing workflows across multiple differing systems and devices is provided herein. During operation, a workflow is automatically generated based upon a camera detecting denial of entry of an individual. The workflow can then be implemented or suggested as a newly-created workflow at other various entry points.

Abstract: The present invention discloses an apparatus (100) for tracing pile set during pile driving of a pile (150) comprising: a panel (110) for attaching to the pile (150); a rotatable holding mechanism (120) with remotely controllable function for holding a writing instrument (160) against the panel (110) to trace the pile set for at least a series of blows during the pile driving; a sliding mechanism (130) with remotely controllable function, which slides on a pair of bearing strips (131?, 131?) to provide lateral movement of the holding mechanism (120) across the panel (110) after each blow of the pile driving; and a platform (140) with groves for holding the bearing strips (131?, 131?) in place for allowing the sliding mechanism (130) to slide freely in multiple directions; characterized in that, the holding mechanism has a rotatable lever arm (126) which is secured by a resilient means (129?) to reduce excess vibration so that the writing instrument (160) is held in a still position while allowing the lever ar

Abstract: A method and apparatus for populating a form with text relevant to past digital-assistant queries is provided herein. During operation, a device will store text related to all digital-assistant queries during a particular incident, and text related to responses to the queries that are initiated during the particular incident. At a later time, when a form is being filled out by an officer, the form will be pre-populated with the text related to the digital-assistant queries and responses. In one embodiment the text related to the digital-assistant queries and responses comprises text of the actual query and text of the actual response.

Abstract: A semiconductor device and method is disclosed. The semiconductor device may include a semiconductor substrate including an active area, a metal layer structure over the active area, wherein the metal layer structure is configured to form an electrical contact, the metal layer structure including a solder area, a buffer area, and a barrier area between the solder area and the buffer area, wherein, in the barrier area, the metal layer structure is further away from the active area than in the solder area and in the buffer area, and wherein each of the solder area and the buffer area is in direct contact with the active area or with a wiring layer structure arranged between the active area and the metal layer structure.

Abstract: A method and apparatus for providing prior-caller location and/or identity into a public-safety answering point is provided herein. During operation, a device such as a smart phone will store location and identity information for recently-received calls. If the device places a call to a PSAP within a predetermined amount of time from when the prior call was received at the device, a flag is sent to the PSAP operator notifying the PSAP operator of the prior call. The PSAP operator can then inquire about the prior call. The caller is then allowed to electronically transfer location and identity information related to the prior call to the PSAP operator if they wish to do so.

Abstract: A method for processing a semiconductor wafer is provided. A semiconductor wafer includes a first main surface and a second main surface. Defects are generated inside the semiconductor wafer to define a detachment plane parallel to the first main surface. Processing the first main surface defines a plurality of electronic semiconductor components. A glass structure is provided which includes a plurality of openings. The glass structure is attached to the processed first main surface, each of the plurality of openings leaving a respective area of the plurality of electronic semiconductor components uncovered. A polymer layer is applied to the second main surface and the semiconductor wafer is split into a semiconductor slice and a remaining semiconductor wafer by cooling the polymer layer beneath its glass transition temperature along the detachment plane. The semiconductor slice includes the plurality of electronic semiconductor components.

Abstract: Disclosed herein are methods and systems for calculating genetic risk scores (GRS) representing the likelihood that an individual will develop a specific trait based on the ancestry of the individual. Also provided are methods and systems for providing a recommendation to the individual to modify a behavior related to a specific trait, based on the individual's GRS for that trait.

Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.

Abstract: Disclosed are an electric wheel assembly applicable for a parallelly mounted dual-tire wheel, an axle, and a vehicle. The electric wheel assembly includes a wheel and support axle assembly, an internal-rotor hub motor, a planetary gear reducer and a brake system. A planetary carrier is connected to a hub. The hub is connected to a spoke and a rim. The wheel support axle passes through a rotor sleeve and is provided with a hub bearing to support the hub and a whole wheel. A sun gear disposed at an end of the rotor sleeve of the internal-rotor hub motor is a power input of the planetary gear speed reducer, and the planetary carrier is a power output. A planetary gear of the planetary gear reducer is a tower-shaped gear and realizes a relatively high transmission ratio under a condition that an axial length is relatively small.

Abstract: A method and apparatus for providing two-step authentication is provided herein. During operation, the two parts of authentication comprise (1) something a user knows, for example, a password; and (2) a push-to-talk (PTT) communication over a predetermined talkgroup.

Abstract: An apparatus (100) to trace pile set during pile driving comprises a panel (110) for attachment to a pile (150); a holding mechanism (120) to hold a writing instrument (160) against the panel (110) to trace the pile set for series of blows during the pile driving; a sliding mechanism (130) to provide lateral movement across the panel (110) for the holding mechanism (120) after each blow during the pile driving; and a platform (140) to allow the sliding mechanism (130) to slide freely in horizontal direction.

Abstract: A non-pneumatic tire includes a tread layer and a spoke layer including an inner cylinder and several spoke assemblies. The tread layer is annular and has a maximum outer diameter of the non-pneumatic tire and is adapted to be in contact with a ground. The spoke assemblies extend in a radial direction of the non-pneumatic tire and are arranged around an axial core of the non-pneumatic tire. An end of each spoke assembly is connected to the inner cylinder, and another end thereof is connected to the tread layer. Each spoke assembly includes a straight spoke, a bending spoke, and a connecting rib. Each bending spoke includes a first segment and a second segment, which are not connected in a straight line. Each connecting rib has a first end connected to the straight spoke and a second end opposite to the first end and connected to the bending spoke. When the non-pneumatic tire bears a weight and is squeezed, the spoke assemblies do not get in contact with one another.

Abstract: A low-floor electric axle assembly including: an axle housing, hub motors, planetary gear reducers, hubs, a brake system, C-shaped beams, and a suspension system. Mechanical mounting of the suspension system is compatible with a conventional axle, and arrangement manners of the brake system, the hub motors, and the planetary gear reducers are capable of expanding a width of a coach aisle. Each of the hub motors is arranged coaxially with a rim; a first-stage cylindrical gear drive, bevel gear drive, or hypoid gear drive is removed; an unconventional-structure planetary gear reducer is provided to ensure a high transmission ratio and transmission efficiency; the brake system is arranged at two ends of the axle and at inner sides of the motors, thereby making full use of space at the two ends of the axle, and forming the low-floor electric axle assembly.

Abstract: A clip for a semiconductor package includes a first portion and a second portion. The first portion includes a first surface, a second surface opposite to the first surface and configured to contact a first electrically conductive component, and a stepped region between the first surface and the second surface such that the second surface has a smaller area than the first surface. The second portion is coupled to the first portion and configured to contact a second electrically conductive component. The second portion includes a third surface aligned with the first surface.

Abstract: A cleaning mechanism of a 3D printer including a cleaning module, a first wiper, a second wiper, and a carrier is provided. The cleaning module has a top plane. The first wiper is arranged corresponding to the cleaning module and protruding beyond the top plane. The second wiper is arranged on the cleaning module and protruding beyond the top plane. The carrier is connected to a rail and suspended above the cleaning module. A modeling nozzle corresponding to the first wiper and a painting pen corresponding to the second wiper are arranged on the carrier and movable. The modeling nozzle and the painting pen are arranged respectively aligned to the first wiper and the second wiper. The modeling nozzle is allowed to move pass the first wiper and bypass the second wiper. The painting pen is allowed to move pass the second wiper and bypass the first wiper.

Abstract: A printing head module for a 3-D printing apparatus includes a 3-D print head, an ink-jet print head and a baking module. The 3-D print head includes a melting module and a base-material nozzle to print a plurality of staking layers. The ink-jet print head is connected to the 3-D print head and includes an ink nozzle to dispense ink on each stacking layer. The baking module is disposed between the 3-D print head and the ink-jet print head and includes a fan, a discharge casing and a heating module. The fan includes an air-discharge side facing the base to provide an air flow. The discharge casing is disposed on the air-discharge side. The heating module is disposed between the fan and the discharge casing to heat the air flow and the heated air flow being blown out via the discharge casing for drying the ink layer.

Abstract: A semiconductor chip package includes an electrically conducting carrier and a semiconductor chip disposed over the electrically conducting carrier. The semiconductor chip has a first surface facing the electrically conducting carrier and a second surface opposite the first surface. A metal plate has a first surface mechanically connected to the second surface of the semiconductor chip and a second surface opposite the first surface of the metal plate. The metal plate completely overlaps the second surface of the semiconductor chip. The second surface of the metal plate is at least partially exposed at a periphery of the semiconductor chip package.