Patents by Inventor Jia Yuan
Jia Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12159479Abstract: An electronic device includes a light source and an optical sensor. The light source emits a light having a maximum light intensity at a first wavelength A. The optical sensor has a maximum response value at a second wavelength B, and receives a reflected portion of the light that is reflected by an object. The integral value of the light intensity of the light from the wavelength 380 nm to the first wavelength A is I1. The integral value of the light intensity of the light from the first wavelength A to the wavelength 780 nm is I2. The first wavelength A, the second wavelength B, the integral value I1, and the integral value I2 satisfy the following equation: (B?A)*(I2?I1)>0.Type: GrantFiled: October 18, 2023Date of Patent: December 3, 2024Assignee: INNOLUX CORPORATIONInventors: Jia-Yuan Chen, Tsung-Han Tsai
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Patent number: 12159912Abstract: An integrated circuit includes a nanosheet transistor having a plurality of stacked channels, a gate electrode surrounding the stacked channels, a source/drain region, and a source/drain contact. The integrated circuit includes a first dielectric layer between the gate metal and the source/drain contact, a second dielectric layer on the first dielectric layer, and a cap metal on the first gate metal and on a hybrid fin structure. The second dielectric layer is on the hybrid fin structure between the cap metal and the source/drain contact.Type: GrantFiled: January 21, 2022Date of Patent: December 3, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Hao Chang, Jia-Chuan You, Chu-Yuan Hsu, Kuo-Cheng Chiang, Chih-Hao Wang
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Publication number: 20240387387Abstract: An electronic device and a manufacturing thereof are disclosed. The electronic device includes a first conductive layer, a first insulating layer, a second insulating layer, a second conductive layer, a plurality of semiconductor elements and a covering layer. The first insulating layer is disposed on the first conductive layer. In a cross-sectional view of the electronic device, the first insulating layer has two side-surfaces which are opposite to each other. The second insulating layer is disposed on the first insulating layer and in contact with the two side-surfaces of the first insulating layer. The second conductive layer is disposed on the second insulating layer and electrically connected to the first conductive layer. The plurality of semiconductor elements are disposed on the second conductive layer and electrically connected to the second conductive layer. The covering layer is disposed on the plurality of semiconductor elements.Type: ApplicationFiled: April 12, 2024Publication date: November 21, 2024Applicant: InnoLux CorporationInventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE
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Publication number: 20240381989Abstract: A bulletproof, stab-proof, and cut-proof bag comprising a pair of connecting members and two bulletproof, stab-proof, and cut-proof panels. The pair of connecting members are connected to each other via a buckle strap set and are located at the edge of the two panels, allowing the two panels to switch between a closing state and an opening state. The pair of connecting members combine the two panels to form an accommodating space and create a bag-shaped structure under the closing state. The two panels can be separated from the bag-shaped structure by releasing the pair of connecting members and are used as a vest under the opening state. Ideally, a second buckle strap set (e.g., a shoulder strap set with a buckle) is connected and positioned between the two panels, which may be located on the upper or top edge of the two panels.Type: ApplicationFiled: May 31, 2023Publication date: November 21, 2024Inventor: JIA-YUAN LEE
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Publication number: 20240378873Abstract: Embodiments of the present disclosure relate to methods, apparatuses, electronic devices, and media for processing multi-modal data. The method comprises dividing a source image into a set of source pixel blocks and generating a sequence of masked source pixel blocks by masking one or more source pixel blocks in the set of source pixel blocks. The method further comprises generating one or more target pixel blocks corresponding to the one or more source pixel blocks based on the sequence of masked source pixel blocks and a source text corresponding to the source image. The method further comprises generating a multi-modal model based on the one or more source pixel blocks and the one or more target pixel blocks. The method can effectively reduce the training cost, reduce the complexity of training the multi-modal model, and improve the stability and accuracy of the model.Type: ApplicationFiled: May 8, 2024Publication date: November 14, 2024Inventors: Longteng GUO, Junyi CHEN, Jia SUN, Zehuan YUAN
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Publication number: 20240371845Abstract: An electronic device includes a substrate structure, an insulating layer, a semiconductor unit and a first electromagnetic signal adjusting unit. The insulating layer is disposed on the substrate structure and has a recess. The semiconductor unit is disposed in the recess. The first electromagnetic signal adjusting unit is disposed on the insulating layer and configured for adjusting an electromagnetic signal, wherein the first electromagnetic signal adjusting unit is overlapped with the semiconductor unit. In a top view of the electronic device, a first distance is between a defined center of the recess and a defined center of the semiconductor unit, a second distance is between a defined center of the first electromagnetic signal adjusting unit and the defined center of the semiconductor unit, and the first distance is greater than 0 and the second distance is less than or equal to the first distance.Type: ApplicationFiled: April 8, 2024Publication date: November 7, 2024Applicant: InnoLux CorporationInventors: Yu-Jhou GONG, Tsung-Han TSAI, Kuan-Feng LEE, Jia-Yuan CHEN
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Patent number: 12132150Abstract: An electronic device includes: a semiconductor layer; and a protecting layer disposed on the semiconductor layer, wherein the protecting layer has a region in which oxygen atomic percentages decrease toward the semiconductor layer.Type: GrantFiled: March 24, 2022Date of Patent: October 29, 2024Assignee: INNOLUX CORPORATIONInventors: Jia-Yuan Chen, Kuan-Feng Lee, Tsung-Han Tsai, Hsiao-Lang Lin, Jui-Jen Yueh
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Patent number: 12114588Abstract: An operation monitoring system and monitoring method are provided, the operation monitoring system is used for monitoring at least one agricultural machine, so as to control an operating range of the agricultural machine, the operation monitoring system includes a storage device and a processor, the processor recognizes at least one operating area and at least one non-operating area of an operation environment, and generates at least one boundary between the operating area and the non-operating area, the processor further generates least one electronic fence at the at least one boundary, the processor further acquires the position of the electronic fence and monitors a position of the agricultural machine, so as to monitor whether the agricultural machine is operating in the operating area on a side of the electronic fence, thereby controlling the operating range of the agricultural machine.Type: GrantFiled: July 13, 2021Date of Patent: October 15, 2024Assignee: FJ Dynamics Technology Academy (Chang zhou) Co., LtdInventors: Shuo Qin, Jia-yuan Qi, Bing Xu, Yi-Chao Wu
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Patent number: 12119382Abstract: A heterostructure, includes: a substrate; and a buffer layer that includes a plurality of layers having a composition AlxInyGa1-x-yN, where x?1 and y?0; wherein the buffer layer has a first region that includes at least two layers, a second region that includes at least two layers, and a third region that includes at least two layers.Type: GrantFiled: March 9, 2023Date of Patent: October 15, 2024Assignee: GlobalWafers Co., Ltd.Inventors: Jia-Zhe Liu, Yen Lun Huang, Chih-Yuan Chuang, Che Ming Liu, Wen-Ching Hsu, Manhsuan Lin
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Patent number: 12113094Abstract: An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.Type: GrantFiled: March 2, 2023Date of Patent: October 8, 2024Assignee: INNOLUX CORPORATIONInventors: Jia-Yuan Chen, Tsung-Han Tsai, Kuan-Feng Lee, Yuan-Lin Wu
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Publication number: 20240332004Abstract: A method includes forming a gate dielectric on a semiconductor region, depositing an aluminum nitride layer on the gate dielectric, depositing an aluminum oxide layer on the aluminum nitride layer, performing an annealing process to drive aluminum in the aluminum nitride layer into the gate dielectric, removing the aluminum oxide layer and the aluminum nitride layer, and forming a gate electrode on the gate dielectric.Type: ApplicationFiled: July 3, 2023Publication date: October 3, 2024Inventors: Chi On Chui, Cheng-Hao Hou, Da-Yuan Lee, Pei Ying Lai, Yi Hsuan Chen, Jia-Yun Xu
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Publication number: 20240319977Abstract: A system and method for deploying software packages for end devices that communicate through a mobile network is disclosed. A deployment orchestrator is coupled to the mobile network. End devices communicate with each other through the mobile network. At least one of end devices includes a support package repository storing software packages. When a new end device requires software package deployment, the deployment orchestrator locates at least one of the end devices with the support package repository. The new end device receives software packages from the end device including the support package repository through the mobile network.Type: ApplicationFiled: March 22, 2023Publication date: September 26, 2024Inventors: Yen-Hsun Chen, Jia-Yu Juang, Chi-Yuan Yen, Tong-Pai Huang, Chia-Jui Lee
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Publication number: 20240322040Abstract: A first n-type transistor includes a first channel component, an undoped first gate dielectric layer disposed over the first channel component, and a first gate electrode disposed over the undoped first gate dielectric layer. A second n-type transistor includes a second channel component and a doped second gate dielectric layer disposed over the second channel component. The second gate dielectric layer is doped with a p-type dipole material. A second gate electrode is disposed over the second gate dielectric layer. At least one of the first n-type transistor or the second n-type transistor further includes an aluminum-free conductive layer. The aluminum-free conductive layer is disposed between the first gate dielectric layer and the first gate electrode or between the second gate dielectric layer and the second gate electrode.Type: ApplicationFiled: September 29, 2023Publication date: September 26, 2024Inventors: Pei Ying Lai, Yi Hsuan Chen, Yen-Fu Chen, Jia-Yun Xu, Cheng-Hao Hou, Da-Yuan Lee, Chi On Chui
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Publication number: 20240313187Abstract: A manufacturing method of an electronic device is provided. The method includes providing a substrate, providing a plurality of signal lines on the substrate, providing a first pad on the substrate, providing a second pad on the substrate, and providing a first electronic component. The first electronic component includes a first electrode. One of the plurality of signal lines is connected to the first pad, and the first electrode of the first electronic component is connected to the first pad. The method further includes removing the first electronic component from the substrate when the first electronic component is dysfunctional, and providing a second electronic component on the substrate and connected to the second pad.Type: ApplicationFiled: May 28, 2024Publication date: September 19, 2024Inventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE, Yuan-Lin WU
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Publication number: 20240311205Abstract: The present disclosure provides a private network and edge application provisioning management system and a method thereof, which provides a construction of enterprise private cloud platform and a process of management standardization, so that a dedicated cloud operating environment can be provided for enterprise customers, and special software application services can further be established and managed. A remote registration mechanism, an enterprise private network establishment mechanism, and an edge application activation mechanism be proposed in the present disclosure. In this way, edge computing capabilities in the enterprise private network environment can be provided, which can not only reduce application service latency time, but also network transmission does not need to go through the Internet, thus having the advantages of avoiding data leakage and improving security. The present disclosure also provides a computer-readable medium for executing the method of the present disclosure.Type: ApplicationFiled: June 28, 2023Publication date: September 19, 2024Inventors: Wen-Sheng LI, Hung-Yuan WANG, Wei-Chih LU, Jia-An TSAI, Chun-Hao CHEN
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Patent number: 12094845Abstract: An electronic device includes a substrate, a plurality of connecting pads, a plurality of conductive portions overlapped with the plurality of connecting pads, a plurality of conductive lines, an insulating layer, and an integrated chip. At least one of the conductive lines is overlapped with at least one of the conductive portions, and at least one of the connecting pads is electrically connected to the at least one of the conductive lines through the at least one of the conductive portions. The insulating layer is disposed between the at least one of the connecting pads and the at least one of the conductive portions, wherein the insulating layer directly contacts a top surface and a lateral surface of the at least one of the conductive portions. The integrated chip is electrically connected to the at least one of the conductive lines.Type: GrantFiled: October 31, 2023Date of Patent: September 17, 2024Assignee: InnoLux CorporationInventors: Jia-Yuan Chen, Tsung-Han Tsai
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Publication number: 20240305462Abstract: The present invention relates to an authentication information manager computer program product, which is executed by a processing unit. The computer program product includes: a physical private key acquisition module configured to receive an identity information to form an initialization authentication information including a part of the identity information; an authentication information management module configured to record a first set of authentication information for logging into a first networking application; and a multiparty multifactor dynamic strong encryption authentication transmission module configured to implement a multiparty multifactor dynamic digital authentication method with strong encryption to transmit the transfigurated initialization authentication information to a network application serving device including an authentication information manager back end and a third-party security serving equipment to be verified.Type: ApplicationFiled: September 25, 2023Publication date: September 12, 2024Inventors: Tsu-Pin WENG, Wu-Hsiung HUANG, Jia-You JIANG, Yi-Yuan HO, Hung-Ming CHEN, Yuan-Sheng CHEN
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Publication number: 20240290913Abstract: An electronic device is provided by the present disclosure. The electronic device includes a substrate and at least one electronic unit. The substrate has at least one recess, and the at least one electronic unit is disposed in the at least one recess. The at least one electronic unit has N1 signal connecting points, wherein N1 is greater than or equal to 1. In a top view direction of the electronic device, the at least one recess has a maximum size D1, the at least one electronic unit has a maximum size C1, and the maximum size D1 and the maximum size C1 satisfies: 0<D1?C1<C1/N1.Type: ApplicationFiled: January 18, 2024Publication date: August 29, 2024Applicant: InnoLux CorporationInventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE
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Publication number: 20240269298Abstract: Provided are the compound shown in general formula (I) or a stereoisomer, a deuterated compound, a solvate, a prodrug, a metabolite, a pharmaceutically acceptable salt, or co-crystal thereof, an intermediate thereof, and a use thereof in EGFR-related diseases such as cancer.Type: ApplicationFiled: April 29, 2022Publication date: August 15, 2024Inventors: Chen ZHANG, Jianmin WANG, Chenfei ZHAO, Guofei QIAN, Junjie MA, Zhenggang HUANG, Shuai YUAN, Anbang HUANG, Shaolong ZHENG, Kai LI, Yan YU, Fei YE, Pingming TANG, Yao LI, Jia NI, Pangke YAN
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Patent number: D1047886Type: GrantFiled: August 22, 2023Date of Patent: October 22, 2024Inventors: Ye Yuan, Jia Li, Zequn Yu, Songlin Yang, Yue Ma