Abstract: A method for manufacturing a display device is disclosed. The method includes providing a plurality of first light-emitting units and a plurality of second light-emitting units, the first light-emitting units and the second light-emitting units configured to emit light with different colors; obtaining an optical character of each of the first light-emitting units and the second light-emitting units; predetermining a target color point for the display device; and transferring a portion of the first light-emitting units and a portion of the second light-emitting units to a target substrate based on the obtained optical characters for aligning a color point of the display device with the target color point.

Abstract: An electronic device includes a light emitting structure, a light conversion structure and an electrode. The light conversion structure is disposed on the light emitting structure. The electrode forms a mesh structure, and the mesh structure surrounds the light conversion structure in a top view of the electronic device.

Abstract: A method of manufacturing an electronic device, comprising: providing a carrier substrate with a plurality of light-emitting units disposed thereon, the plurality of light-emitting units being spaced with a first pitch (P1) in a first direction and a second pitch (P2) in a second direction that is perpendicular to the first direction; providing a driving substrate; and transferring at least a portion of the plurality of light-emitting units to the driving substrate to form a transferred portion of the plurality of light-emitting units on the driving substrate, the transferred portion being spaced with a third pitch (P3) in a third direction and a fourth pitch (P4) in a fourth direction that is perpendicular to the third direction; wherein the first pitch (P1), the second pitch (P2), the third pitch (P3), and the fourth pitch (P4) are satisfied following relations: P3=mP1; and P4=nP2, m and n are positive integers.

Abstract: Gold (I) complexes that can absorb light in the near-UV and/or visible regions and methods of making and using thereof are described. These gold (I) complexes have photochemical reactivities, such as strong absorption of near-UV and/or visible light, quenching rate constants ?3.5×105 s?1, etc., that allow them to catalyze photoredox reactions, such as homocoupling of organic halides (e.g. alkyl halides and aryl halides), alkylation of 2-phenyl-1,2,3,4-tetrahydroisoquinoline, cyclization of indoles, reductive dehalogenation of aryl halides, and/or C—H bonds cleavage, under near-UV and/or visible light. The product of a photo-induced organic reaction catalyzed by the gold (I) complexes described herein can have a yield that is higher than the yield of the same product formed from the same reaction under the same reaction conditions, using the same loading or a higher loading of [Au2(?-dppm)2](Cl)2, [Ru(bpy)3](Cl)2, and/or [fac-Ir(ppy)3] compared to the loading of the one or more gold (I) complex(es).

Abstract: A perovskite optical element includes a light guiding unit and a luminescent layer. The light guiding unit is configured to conduct light and serves as a resonant cavity. The luminescent layer is a thin film made of perovskite material and clads the light guiding unit. The luminescent layer is configured to be excited by an excitation module to emit light. The light is conducted and output by the light guiding unit. A manufacturing method of a perovskite optical element includes preparing a dip coating solution; dipping a single crystal optical fiber in the dip coating solution for one hour, removing the single crystal optical fiber out of the dip coating solution, and drying the single crystal optical fiber; and placing the single crystal optical fiber into a tube furnace, heating the crystal optical fiber, and introducing synthetic molecules into the tube furnace.

Abstract: A medical device having an elongate body with a proximal portion, a distal portion, and defining a lumen therethrough. The medical device has an expandable element coupled to the distal portion of the elongate body, the expandable element defining a proximal portion, a distal portion opposite the proximal portion and an intermediate portion disposed between the proximal portion and the distal portion. The expandable element also has an inner surface and an outer surface opposite the inner surface. The medical device has a plurality of cutting members, each cutting member being coupled with the outer surface of the expandable element, each cutting member having a proximal end and a distal end opposite the proximal end, the proximal end being proximate the proximal portion of the expandable element and the distal end being proximate to the intermediate portion of the expandable element.

Abstract: An electronic device including a substrate and at least one light emitting unit is provided. The at least one light emitting unit is disposed on the substrate. The at least one light emitting unit includes a light emitting diode and a protective layer. The protective layer includes a portion overlapped with the light emitting diode, and the portion has a concave part adjacent to an edge of the light emitting diode in a top view of the electronic device.

Abstract: A display device includes a display unit. The display unit includes a light emitting unit and a light converting layer disposed on the light emitting unit. The display unit emits a green output light under an operation of a highest gray level. The green output light has an output spectrum, wherein an intensity integral of the output spectrum from 380 nm to 489 nm is defined as a first intensity integral, an intensity integral of the output spectrum from 490 nm to 780 nm is defined as a second intensity integral, a ratio of the first intensity integral over the second intensity integral is defined as a first ratio, and the first ratio is greater than 0% and less than or equal to 7.5%.

Abstract: A method for manufacturing an electronic device includes transferring a plurality of light emitting units from a carrier substrate to an object substrate through steps of: picking the plurality of light emitting units from the carrier substrate by a pick-and-place tool, and placing the plurality of light emitting units onto the object substrate. The steps are both performed under a protection by at least one electrostatic discharge protective unit.

Abstract: A display device includes a substrate, a first light-emitting unit, a second light-emitting unit, a first light conversion unit, a second light conversion unit, a first buffer layer, a second buffer layer, and a sidewall buffer layer. The first light-emitting unit and the second light-emitting unit are disposed on the substrate. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit and has a first curved bottom surface. The second buffer layer is disposed between the second light conversion unit and the second light-emitting unit and has a second curved bottom surface. The sidewall buffer layer directly contacts the first light conversion unit and the second light conversion. A width of the first curved bottom surface is different from a width of the second curved bottom surface.

Abstract: A display device is provided, which includes a first substrate, a first display structure, a second display structure, a first optical film, a second optical film, a first adhesive layer and a second adhesive layer. The first and second display structures are disposed on the first substrate. The first display structure is disposed between the first substrate and the first optical film. The second display structure is disposed between the first substrate and the second optical film. The first and second optical films are separated. The first adhesive layer is disposed between the first display structure and first optical film. The second adhesive layer is disposed between the second display structure and second optical film. The first and second display structures are different from each other and are selected from a liquid-crystal display, an organic light-emitting diode display, an inorganic light-emitting diode display or a laser display.

Abstract: A display device and another display device are provided. The display device includes a substrate, multiple light emitting units, a first and a second structures. The light emitting units are disposed on the substrate and generate heat. The first structure is disposed on the substrate. The second structure is disposed outside of the substrate. The heat is transferred from the light emitting units to the second structure through the first structure. Another display device includes a substrate, multiple light emitting units, a first and a second structures. The light emitting units are disposed on the substrate and generate heat. The first structure is disposed on the substrate and transfers the heat. In a top view of another display device, an area of a portion of the first structure is greater than an area of a portion of the light emitting units in a predetermined square region of the substrate.

Abstract: The present disclosure provides a lighting device and a manufacturing method thereof. The lighting device includes a substrate, a light emitting unit, a light adjusting layer and at least one electrode connecting element. The light emitting unit is disposed on the substrate and includes a light output surface and a plurality of top electrodes. The light adjusting layer is disposed on the light emitting unit, and the light adjusting layer includes a first portion and a second portion connected to the first portion. Wherein the top electrodes are electrically connected to each other through the electrode connecting element, the first portion only partially covers the light output surface, and the second portion does not cover the light output surface.

Abstract: A manufacturing method of an electronic device is provided by the present disclosure, wherein the manufacturing method includes providing a carrier substrate, forming a light emitting module on the carrier substrate, and transferring the light emitting module to a target substrate. The step of forming a light emitting module on the carrier substrate includes transferring a light emitting unit to the carrier substrate, forming a circuit layer on the carrier substrate, and forming a patterned light absorbing layer on the carrier substrate, wherein the patterned light absorbing layer includes an opening through which the light emitting unit is electrically connected to the circuit layer.

Abstract: A method for manufacturing an electronic device includes: providing a base layer; forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening; placing an electronic element on the patterned circuit layer; and patterning the base layer to form a second opening which is at least partially overlapped with the first opening. The step of placing the electronic element is performed after the step of forming the patterned circuit layer.

Abstract: A display device includes a first display unit and a second display unit. The first display unit emits a red light having a first output spectrum corresponding to a highest gray level of the display device. The second display unit emits a blue light having a second output spectrum corresponding to the highest gray level of the display device. An intensity integral of the first output spectrum within a range from 380 nm to 780 nm is defined as a first intensity integral, an intensity integral of the second output spectrum within a range from 511 nm to 597 nm is defined as a second intensity integral, and a ratio of the second intensity integral to the first intensity integral is greater than 0% and less than or equal to 29.0%.

Abstract: A method of manufacturing an electronic device, comprising: providing a carrier substrate with a plurality of light-emitting units disposed thereon, the plurality of light-emitting units being spaced with a first pitch (P1) in a first direction and a second pitch (P2) in a second direction that is perpendicular to the first direction; providing a driving substrate; and transferring at least a portion of the plurality of light-emitting units to the driving substrate to form a transferred portion of the plurality of light-emitting units on the driving substrate, the transferred portion being spaced with a third pitch (P3) in a third direction and a fourth pitch (P4) in a fourth direction that is perpendicular to the third direction; wherein the first pitch (P1), the second pitch (P2), the third pitch (P3), and the fourth pitch (P4) are satisfied following relations: P3=mP1; and P4=nP2, m and n are positive integers.

Abstract: An electronic device includes a light emitting structure, at least one touch structure and at least two adjacent light conversion structures. The at least one touch structure is disposed on the light emitting structure, and the at least one touch structure is between two adjacent light conversion structures.

Abstract: A method for manufacturing an electronic device includes: providing a substrate; forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate; forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, and an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and bonding a plurality of light emitting units to the plurality of connecting pads.

Abstract: The present disclosure provides an electronic device including a substrate and at least one light emitting unit. The light emitting unit includes a light emitting diode, a protective layer, and a light conversion layer. The protective layer includes a portion having a ripped section and not overlapped with the light emitting diode in a top view direction of the electronic device. The electronic device of the present disclosure may provide an electronic device that may reduce the influence from the outside or a subsequent process on the light emitting diode and improve luminance performance and reliability.