Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.

Abstract: A flexible display module includes a back film, and a flexible display screen and a protective cover plate that are sequentially stacked on a side of the back film. The protective cover plate includes a cover plate body and at least one arc-shaped extension portion. An end of an arc-shaped extension portion is connected to a side face of the cover plate body. An end of the arc-shaped extension portion away from the cover plate body extends beyond an edge of the flexible display screen and an edge of the back film. An arc-shaped concave surface of the arc-shaped extension portion faces a side face of the flexible display screen and a side face of the back film that are proximate to the arc-shaped extension portion.

Abstract: A support structure, a manufacturing method thereof and a display device are provided. The support structure includes a metal substrate, and a buffer layer provided on the metal substrate; the support structure includes a bending region and a non-bending region; a portion of the metal substrate located in the bending region has a recess so that a thickness of the portion of the metal substrate located in the bending region is smaller than a thickness of a portion of the metal substrate located in the non-bending region; and the buffer layer is provided on a side of the metal substrate having the recess, and is at least located in the recess.

Abstract: An optical adhesive, a method for manufacturing an optical adhesive, and a display device are provided. The optical adhesive includes a first, adhesive Layer, a second adhesive layer, and a third adhesive layer that are sequentially stacked, a storage modulus of the first adhesive layer is greater than a storage modulus of the third adhesive laver; and the storage modulus of the first adhesive layer and the storage modulus pf the third adhesive layer are both greater than a storage modulus of the second adhesive layer.

Abstract: A transparent laminated film, a display device, and a method for manufacturing a transparent laminated film are disclosed. The transparent laminated film includes a first film layer, a central film layer, and a second film layer which are sequentially stacked, each of a material of the first film layer and a material of the second film layer includes a thermoplastic plastic, and a material of the central film layer includes a thermosetting plastic.

Abstract: An optical adhesive, a method for manufacturing an optical adhesive, and a display device are provided. The optical adhesive includes a first adhesive layer, a second adhesive layer, and a third adhesive layer that are sequentially stacked, a storage modulus of the first adhesive layer is greater than a storage modulus of the third adhesive layer, and the storage modulus of the first adhesive layer and the storage modulus of the third adhesive layer are both greater than a storage modulus of the second adhesive layer.

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.

Abstract: The present disclosure provides a cover plate for a flexible substrate which includes a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than that of the second hardened layer, a hardness of the polymer thin film layer is less than that of the first hardened layer, and a bending radius of the first hardened layer is greater than that of the second hardened layer.

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.

Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.

Abstract: A display substrate, a method for preparing the same, and a display device are provided in the embodiments of the disclosure. The display substrate comprises: a flexible substrate, the flexible substrate defining a connection region thereon; an inorganic structure layer on a side of the flexible substrate and in the connection region; a plurality of connection terminals on the inorganic structure layer and in the connection region; and a flexible filling layer in the inorganic structure layer and between two adjacent connection terminals of the plurality of connection terminals.

Abstract: A ripple pre-amplification based fully integrated LDO pertains to the technical field of power management. The positive input terminal of a transconductance amplifier is connected to a reference voltage Vref, and the negative input terminal of the transconductance amplifier is connected to the feedback voltage Vfb. The output terminal of the transconductance amplifier is connected to the negative input terminal of a transimpedance amplifier and the negative input terminal of an error amplifier. The positive input terminal of the transimpedance amplifier is connected to the ground GND, and the output terminal of the transimpedance amplifier is connected to the positive input terminal of the error amplifier. The gate terminal of the power transistor MP is connected to the output terminal of the error amplifier, the source terminal of the power transistor MP is connected to an input voltage VIN, and the drain terminal of the power transistor MP is grounded.

Abstract: A display substrate, a method for preparing the same, and a display device are provided in the embodiments of the disclosure. The display substrate comprises: a flexible substrate, the flexible substrate defining a connection region thereon; an inorganic structure layer on a side of the flexible substrate and in the connection region; a plurality of connection terminals on the inorganic structure layer and in the connection region; and a flexible filling layer in the inorganic structure layer and between two adjacent connection terminals of the plurality of connection terminals.

Abstract: A ripple pre-amplification based fully integrated LDO pertains to the technical field of power management. The positive input terminal of a transconductance amplifier is connected to a reference voltage Vref, and the negative input terminal of the transconductance amplifier is connected to the feedback voltage Vfb. The output terminal of the transconductance amplifier is connected to the negative input terminal of a transimpedance amplifier and the negative input terminal of an error amplifier. The positive input terminal of the transimpedance amplifier is connected to the ground GND, and the output terminal of the transimpedance amplifier is connected to the positive input terminal of the error amplifier. The gate terminal of the power transistor MP is connected to the output terminal of the error amplifier, the source terminal of the power transistor MP is connected to an input voltage VIN, and the drain terminal of the power transistor MP is grounded.

Abstract: A low-dropout regulator with super transconductance structure relates to the field of power management technology. The super-transconductance structure refers to the circuit structure in which the voltage signal is converted into a current signal and amplified with a high magnification. The error amplifier EA in the present invention uses the super transconductance structure. The differential input pair of the error amplifier EA samples the difference between the feedback voltage VFB and the dynamic reference voltage VREF1. The difference is converted into a small signal current, which goes through a first-stage of current mirror to be amplified by K1, and through a second-stage of current mirror to be amplified by K2. The amplified signal is used to regulate the gate of the adjustment transistor MP. The error amplifier EA with the super transconductance structure is used to expand the bandwidth of the error amplifier EA.

Abstract: A low-dropout regulator with super transconductance structure relates to the field of power management technology. The super-transconductance structure refers to the circuit structure in which the voltage signal is converted into a current signal and amplified with a high magnification. The error amplifier EA in the present invention uses the super transconductance structure. The differential input pair of the error amplifier EA samples the difference between the feedback voltage VFB and the dynamic reference voltage VREF1. The difference is converted into a small signal current, which goes through a first-stage of current mirror to be amplified by K1, and through a second-stage of current mirror to be amplified by K2. The amplified signal is used to regulate the gate of the adjustment transistor MP. The error amplifier EA with the super transconductance structure is used to expand the bandwidth of the error amplifier EA.

Abstract: A method for connecting a terminal to a server is disclosed, the method includes: a domain name request message is sent to a domain name server by a terminal according to a software identifier of launched application software; a domain name response message sent by the domain name server is received by the terminal, where the domain name response message includes a server domain name matching the software identifier; and a corresponding service server is accessed by the terminal according to the server domain name.

Abstract: Disclosed are a packaging cover plate for an organic light-emitting device (OLED), an OLED, and a display device. The packaging cover plate may comprise a packaging surface bonded with a substrate using a packaging adhesive, wherein a groove structure for accommodating the packaging adhesive is formed on a periphery of the package surface of the packaging cover plate.