Abstract: A lighting module for a refrigeration appliance has a housing provided with a light outlet. The housing includes a supporting edge surrounding the light outlet and an inner frame disposed along the supporting edge. The inner frame protrudes from the supporting edge in a direction away from the light outlet. The housing further has a light source. The light source includes a light emitting element and a substrate bearing the light emitting element. The light guide plate is supported on the supporting edge and includes a first end surface protruding toward the inner frame. The housing includes a mounting portion located in a space defined by the first end surface of the light guide plate, the supporting edge, and the inner frame. The substrate is mounted on the mounting portion, so that the light emitting element and the first end surface of the light guide plate face each other.

Abstract: A lighting module is provided for a refrigeration appliance. The lighting module includes: a housing, provided with a light outlet; a light source, located in the housing; a light guide plate, adapted to guide light from the light source toward the light outlet; and an elastic member, adapted to deform to maintain a position of the light guide plate with respect to the light source and/or the light outlet.

Abstract: A refrigeration appliance has a storage compartment provided with a front opening. The storage compartment further has a top wall and a mounting slot located in the top wall. A lighting module is fastened in the mounting slot. The lighting module includes a front wall facing the front opening. The front wall includes a main part and a decorative strip connected to the main part. An upper end of the decorative strip extends into the mounting slot.

Abstract: The present disclosure provides a cover plate for a flexible substrate which includes a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than that of the second hardened layer, a hardness of the polymer thin film layer is less than that of the first hardened layer, and a bending radius of the first hardened layer is greater than that of the second hardened layer.

Abstract: The present application provides a display device that includes a flexible display panel and a panel support device. The panel can be rolled up or stretched out along a first direction, and the support device includes an elastic member and movable members. The elastic member includes protrusion portions and groove portions alternately arranged along the first direction, the protrusion portion is fixed on a back surface of the panel, the groove portion and the back surface forms a strip-shaped cavity, and the width of the groove portion in an initial state gradually decreases along a direction approaching the panel. The movable members respectively and movably arranged in the cavities. When the movable member moves in the cavity, towards a side of the cavity close to the panel, the movable member supports and separates ends of two side walls of the groove portion close to the panel more apart.

Abstract: The present disclosure relates to a rollable display panel. The rollable display panel includes a first structure layer, a second structure layer, and a first adhesive layer stacked between the first structure layer and the second structure layer. The rollable display panel is divided into a rollable area, a strain accumulation area, and a flat area distributed in sequence along a rolling direction. A thickness of a part of the first adhesive layer located in the strain accumulation area is greater than a thickness of a part of the first adhesive layer located in the rollable area or the flat area.

Abstract: A device measures a frictional force and a film thickness of a lubricating oil film in different surface velocity directions. The device includes an experiment bench. A translation stage is mounted to the experiment bench, and is linearly movable. A main shaft system is mounted to the experiment bench. A glass disc is mounted to the main shaft system and is rotatable. An arcuate guide rail is disposed on the translation stage. A rotary base is mounted to the arcuate guide rail and is movable along the arcuate guide rail. A loading system is mounted to the rotary base. A steel ball of the loading system and the glass disc are movable relative to each other. A rotary bearing in the rotary base is configured to convert a frictional force generated from the relative movement to a pressure allowed to be collected by a pressure sensor on the rotary base.

Abstract: A method for making a semiconductor substrate includes: cutting an ingot to obtain a plurality of substrates, each of the substrates including a first surface and a second surface opposite to the first surface; performing a surface treatment on at least one of the first surface and the second surface of each of the substrates using a surface-treating agent; annealing the substrates; and abrasing each of the annealed substrates. A method for making a semiconductor device is also disclosed.

Abstract: A cover plate includes a transparent elastomer layer, a spacer layer and a low surface energy layer. The transparent elastomer layer is made of at least one elastomer material. The low surface energy layer is disposed at a side of the transparent elastomer layer. A surface energy of the low surface energy layer is less than a surface energy of the transparent elastomer layer. The spacer layer is disposed between the transparent elastomer layer and the low surface energy layer.

Abstract: A substrate for epitaxial growth includes a central region that has a center of the substrate and that serves as a non-modified region, and a peripheral region that surrounds the central region in a manner to be spaced apart from the center of the substrate by a distance and that serves as a modified region having a plurality of modified points. A method for manufacturing a substrate for epitaxial growth includes providing a substrate and forming a plurality of modified points in an interior of the substrate in position corresponding to the modified region. A semiconductor device including the substrate and a method for manufacturing the semiconductor device are also disclosed.

Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.

Abstract: A flexible display module includes a back film, and a flexible display screen and a protective cover plate that are sequentially stacked on a side of the back film. The protective cover plate includes a cover plate body and at least one arc-shaped extension portion. An end of an arc-shaped extension portion is connected to a side face of the cover plate body. An end of the arc-shaped extension portion away from the cover plate body extends beyond an edge of the flexible display screen and an edge of the back film. An arc-shaped concave surface of the arc-shaped extension portion faces a side face of the flexible display screen and a side face of the back film that are proximate to the arc-shaped extension portion.

Abstract: A support structure, a manufacturing method thereof and a display device are provided. The support structure includes a metal substrate, and a buffer layer provided on the metal substrate; the support structure includes a bending region and a non-bending region; a portion of the metal substrate located in the bending region has a recess so that a thickness of the portion of the metal substrate located in the bending region is smaller than a thickness of a portion of the metal substrate located in the non-bending region; and the buffer layer is provided on a side of the metal substrate having the recess, and is at least located in the recess.

Abstract: An optical adhesive, a method for manufacturing an optical adhesive, and a display device are provided. The optical adhesive includes a first, adhesive Layer, a second adhesive layer, and a third adhesive layer that are sequentially stacked, a storage modulus of the first adhesive layer is greater than a storage modulus of the third adhesive laver; and the storage modulus of the first adhesive layer and the storage modulus pf the third adhesive layer are both greater than a storage modulus of the second adhesive layer.

Abstract: A transparent laminated film, a display device, and a method for manufacturing a transparent laminated film are disclosed. The transparent laminated film includes a first film layer, a central film layer, and a second film layer which are sequentially stacked, each of a material of the first film layer and a material of the second film layer includes a thermoplastic plastic, and a material of the central film layer includes a thermosetting plastic.

Abstract: An optical adhesive, a method for manufacturing an optical adhesive, and a display device are provided. The optical adhesive includes a first adhesive layer, a second adhesive layer, and a third adhesive layer that are sequentially stacked, a storage modulus of the first adhesive layer is greater than a storage modulus of the third adhesive layer, and the storage modulus of the first adhesive layer and the storage modulus of the third adhesive layer are both greater than a storage modulus of the second adhesive layer.

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.

Abstract: The present disclosure provides a cover plate for a flexible substrate which includes a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than that of the second hardened layer, a hardness of the polymer thin film layer is less than that of the first hardened layer, and a bending radius of the first hardened layer is greater than that of the second hardened layer.

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.

Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.