Abstract: A recombinant collagen and a preparation method and use thereof, and in particular, a full-length collagen a1 chain produced through recombinant expression, and a preparation method and use thereof are provided. When a variant (which is denoted as a1 (I) M1) of a human type I collagen a1 chain (a1 (I) chain) and a variant (which is denoted as a1 (II) M6) of a human type II collagen a1 chain (a1 (II) chain) constructed in the present disclosure are produced through recombinant expression in Pichia pastoris, a main degradation product (a main degradation band) in substantially the same proportion as a target product (a target band) of a full-length a1 chain occurring during the recombinant expression of native full-length a1 (I) chain and a1 (II) chain is eliminated, and a yield of the target product is improved.

Abstract: An embodiment of the application discloses a display panel motherboard and a method for manufacturing a display panel. The display panel motherboard includes a plurality of panel areas and a cutting area located between the panel areas. The display panel motherboard further includes a substrate, a display function layer, a peeling film layer, and an encapsulation layer. In particular, the display function layer is disposed on the substrate and includes a plurality of display unit sections, of which one display unit section is formed within one panel area. The peeling film layer is located within the cutting area. The encapsulation layer can be patterned as a consequence of peeling off the pre-formed peeling film layer without a photomask.

Abstract: A manufacturing method of an organic light-emitting diode (OLED) display panel and an OLED display panel are provided. In embodiments of the manufacturing method of the OLED display panel, no mask is used in processes of forming a first light-emitting layer, a second light-emitting layer, a third light-emitting layer, a first cathode, a second cathode, a third cathode, a first inorganic encapsulation layer, a second inorganic encapsulation layer, and a third inorganic encapsulation layer, so that a manufacturing cost of the OLED display panel can be reduced.

Abstract: An embodiment of the application discloses a display panel motherboard and a method for manufacturing a display panel. The display panel motherboard includes a plurality of panel areas and a cutting area located between the panel areas. The display panel motherboard further includes a substrate, a display function layer, a peeling film layer, and an encapsulation layer. In particular, the display function layer is disposed on the substrate and includes a plurality of display unit sections, of which one display unit section is formed within one panel area. The peeling film layer is located within the cutting area.

Abstract: A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of: step S1, providing a rigid substrate on which a flexible base is formed; step S2, forming a thin film transistor array layer on the flexible base; step S3, forming an OLED display unit on the thin film transistor array layer; step S4, forming an encapsulation layer on the OLED display unit; step S5, forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive; step S6, peeling off the rigid substrate, and completing a support film to be attached under the flexible base; step S7, removing the protective layer; and step S8, forming a protective cover on the encapsulation layer.

Abstract: A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of: step S1, providing a rigid substrate on which a flexible base is formed; step S2, forming a thin film transistor array layer on the flexible base; step S3, forming an OLED display unit on the thin film transistor array layer; step S4, forming an encapsulation layer on the OLED display unit; step S5, forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive; step S6, peeling off the rigid substrate, and completing a support film to be attached under the flexible base; step S7, removing the protective layer; and step S8, forming a protective cover on the encapsulation layer.

Abstract: The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer.

Abstract: The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer.

Abstract: The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer.

Abstract: An OLED packaging method and an OLED package structure are disclosed. The OLED packaging method combines a dam packaging technology and a thin film encapsulation technology. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs. The OLED packaging structure combines a dam packaging structure and a thin film encapsulation structure. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs.

Abstract: The present invention provides an OLED encapsulation method, which comprises frit coated on a cover plate to correspond to an outer circumference of an OLED device and a water-contact-to-release-heat layer formed on a backing plate to correspond to the frit. The cover plate and the backing plate are laminated together to make the frit contacting the water-contact-to-release-heat layer. Afterwards, a water-contained gas is introduced to cause reaction of the water-contact-to-release-heat layer to release heat so as to heat and melt the frit for bonding the cover plate and the backing plate, and compared to the prior art, there is no need of a laser based operation so that the cost of laser facility can be saved, the manufacturing cost can be reduced, and also, the heat generated by the water-contact-to-release-heat layer is controllable and uniform, so that the effect of encapsulation is good and product yield is high.

Abstract: The present invention provides an OLED encapsulation method, which comprises frit coated on a cover plate to correspond to an outer circumference of an OLED device and a water-contact-to-release-heat layer formed on a backing plate to correspond to the frit. The cover plate and the backing plate are laminated together to make the frit contacting the water-contact-to-release-heat layer. Afterwards, a water-contained gas is introduced to cause reaction of the water-contact-to-release-heat layer to release heat so as to heat and melt the frit for bonding the cover plate and the backing plate, and compared to the prior art, there is no need of a laser based operation so that the cost of laser facility can be saved, the manufacturing cost can be reduced, and also, the heat generated by the water-contact-to-release-heat layer is controllable and uniform, so that the effect of encapsulation is good and product yield is high.

Abstract: An OLED packaging method and an OLED package structure are disclosed. The OLED packaging method combines a dam packaging technology and a thin film encapsulation technology. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs. The OLED packaging structure combines a dam packaging structure and a thin film encapsulation structure. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs.

Abstract: An OLED packaging method includes providing a substrate on which an OLED device is formed and a package lid that comprises a trough formed to correspond to the OLED device and receive a solid resin film therein, forming a loop of fritted glass on the package lid and outside the trough, forming a loop of inorganic protective frame made of silicon nitride on the substrate and at a location that is outside the trough and inside the fritted glass, forming a loop of adhesive on the package lid to correspond to the inorganic protective frame, and laminating the package lid and the substrate to each other such that the OLED device is covered by the solid resin film and the inorganic protective frame is adhered to the adhesive to form a combined circumferential wall, which surrounds, together with the fritted glass, the OLED device covered by the solid resin film.

Abstract: An OLED packaging method includes providing a substrate on which an OLED device is formed and a package lid that comprises a trough formed to correspond to the OLED device and receive a solid resin film therein, forming a loop of fritted glass on the package lid and outside the trough, forming a loop of inorganic protective frame made of silicon nitride on the substrate and at a location that is outside the trough and inside the fritted glass, forming a loop of adhesive on the package lid to correspond to the inorganic protective frame, and laminating the package lid and the substrate to each other such that the OLED device is covered by the solid resin film and the inorganic protective frame is adhered to the adhesive to form a combined circumferential wall, which surrounds, together with the fritted glass, the OLED device covered by the solid resin film.

Abstract: The present invention provides an OLED packaging method and an OLED packaging structure. The OLED packaging method includes the following steps: providing a TFT substrate (1) and a package lid (2); forming air channels (21) on the package lid (2); forming an OLED device (11) on the TFT substrate (1); coating a loop of desiccant (12) on the TFT substrate (1) along an outer circumference of the OLED device (11) and coating a loop of a dam (13) along an outer circumference of the desiccant (12); laminating the TFT substrate (1) and the package lid (2) together; and pressing the TFT substrate (1) and the package lid (2) together and applying irradiation of ultraviolet light to cure the dam (13).

Abstract: The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer.

Abstract: The present invention provides an OLED package structure and a packaging method. The structure includes a substrate (1), a package lid (2) opposite to the substrate (1), an OLED device (12) located between the substrate (1) and the package lid (2) and mounted on the substrate (1), a solid resin film (22) located between the substrate (1) and the package lid (2) and arranged on the package lid (2) to completely cover the OLED device (12), an inorganic protective frame (11) arranged on the substrate (1) and located outside an outer circumference of the solid resin film (22), adhesive (23) applied on the package lid (2) to bond the inorganic protective frame (11) and the package lid (2) to each other, and fritted glass (21) arranged outside an outer circumference of the inorganic protective frame (11) to bond the substrate (1) and the package lid (2) to each other.

Abstract: An OLED package structure includes a substrate, a package lid arranged opposite to the substrate, an OLED device arranged between the substrate and the package lid and mounted to the substrate, and enclosure resin located between the substrate and the package lid and bonding the substrate and the package lid together. The package lid includes a recess formed therein at a location corresponding to the OLED device. The recess includes therein a plurality of corrugation projection structures arranged therein and extending outwards from a bottom of the recess. Desiccant is attached to the bottom of the recess in an area between two adjacent ones of the corrugation projection structures.

Abstract: An OLED package structure includes a substrate, a package lid arranged opposite to the substrate, an OLED device arranged between the substrate and the package lid and mounted to the substrate, and enclosure resin located between the substrate and the package lid and bonding the substrate and the package lid together. The package lid includes a recess formed therein at a location corresponding to the OLED device. The recess includes therein a plurality of corrugation projection structures arranged therein and extending outwards from a bottom of the recess. Desiccant is attached to the bottom of the recess in an area between two adjacent ones of the corrugation projection structures.