Abstract: The present invention provides a packaging structure of an OLED device and a packaging method thereof. The packaging structure of the OLED device includes a substrate (1), an OLED device (2) arranged on the substrate (1), a first barrier layer (3) formed on the OLED device (2), a buffer layer (4) formed on the first barrier layer (3), and a second barrier layer (5) formed on the buffer layer (4). The buffer layer (4) includes water-absorbent particles (41) mixed therein. The present invention uses the buffer that includes water-absorbent particles mixed therein to improve the capability of the packaging structure for blocking moisture so as to effectively extend the lifespan of the OLED device. The packaging method of the OLED device according to the present invention effectively blocks the invasion of moisture, improve the effect of packaging, and effectively extend the lifespan of the OLED device. The method is simple and has good operability.

Abstract: The present invention provides an OLED package structure and a packaging method. The structure includes a substrate (1), a package lid (2) opposite to the substrate (1), an OLED device (12) located between the substrate (1) and the package lid (2) and mounted on the substrate (1), a solid resin film (22) located between the substrate (1) and the package lid (2) and arranged on the package lid (2) to completely cover the OLED device (12), an inorganic protective frame (11) arranged on the substrate (1) and located outside an outer circumference of the solid resin film (22), adhesive (23) applied on the package lid (2) to bond the inorganic protective frame (11) and the package lid (2) to each other, and fritted glass (21) arranged outside an outer circumference of the inorganic protective frame (11) to bond the substrate (1) and the package lid (2) to each other.

Abstract: The present invention provides an OLED packaging method and an OLED packaging structure. The OLED packaging method includes the following steps: providing a TFT substrate (1) and a package lid (2); forming air channels (21) on the package lid (2); forming an OLED device (11) on the TFT substrate (1); coating a loop of desiccant (12) on the TFT substrate (1) along an outer circumference of the OLED device (11) and coating a loop of a dam (13) along an outer circumference of the desiccant (12); laminating the TFT substrate (1) and the package lid (2) together; and pressing the TFT substrate (1) and the package lid (2) together and applying irradiation of ultraviolet light to cure the dam (13).

Abstract: The present invention provides an OLED package structure and an OLED packaging method. The OLED package structure includes a substrate (1), a package lid (2) arranged opposite to the substrate (1), an OLED device (11) arranged between the substrate (1) and the package lid (2) and mounted to the substrate (1), and enclosure rein (3) located between the substrate (1) and the package lid (2) and bonding the substrate (1) and the package lid (2) together. The package lid (2) includes a recess (21) formed therein at a location corresponding to the OLED device (11). The recess (21) includes therein a plurality of corrugation projection structures (212) arranged therein and extending outwards from a bottom of the recess (21). Desiccant (211) is attached to the bottom of the recess (21) in an area between two adjacent ones of the corrugation projection structures (212).

Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).