Patents by Inventor Jian an Wang

Jian an Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120314489
    Abstract: Systems and methods that enable direct communications between magnetic tunnel junctions are provided. In one embodiment, a device includes multiple input magnetic tunnel junctions and an output magnetic tunnel junction. The multiple input magnetic tunnel junctions are connected in parallel, and the output magnetic tunnel junction is connected in series to the input magnetic tunnel junctions. In another embodiment, a device includes a first magnetic tunnel junction, a second magnetic tunnel junction, and a nano-magnetic channel. Each of the first and the second magnetic tunnel junctions has a free layer, a nonmagnetic layer, and a fixed layer. The nano-magnetic channel connects the free layer of the first magnetic tunnel junction to the free layer of the second magnetic tunnel junction.
    Type: Application
    Filed: May 18, 2012
    Publication date: December 13, 2012
    Applicant: Regents of the University of Minnesota
    Inventors: David J. Lilja, Jian-Ping Wang, Andrew P. Lyle, Shruti R. Patil, Jonathan D. Harms, Xiaofeng Yao
  • Patent number: 8310500
    Abstract: A storage method for a gamma value look-up table comprises storing gamma values corresponding to grays exceeding or equaling a 33rd gray in the gamma value look-up table, and calculating gamma values corresponding to a 1st gray to a 32nd gray by a formula.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: November 13, 2012
    Assignee: Chimei Innolux Corporation
    Inventor: Jian-Feng Wang
  • Publication number: 20120273968
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Application
    Filed: July 9, 2012
    Publication date: November 1, 2012
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar
  • Patent number: 8285072
    Abstract: In a method and apparatus for improving the brightness uniformity in an image, signals are acquired using a radio frequency receiving coil, and noise in the acquired signals is normalized so as to produce an image, then the brightness of various pixels in the image is determined according to the sensitivity of the radio frequency receiving coil. The brightness of the image is then made uniform by compensating the brightness of the various pixels in the image.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: October 9, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hua Bin Zhu, Jian Min Wang, Cai Xia Fu, Yan Hong Chen
  • Publication number: 20120244534
    Abstract: The invention is directed to systems, methods, and apparatus for carrying out multi-stage amplification reactions, especially under fluidly closed conditions. In one aspect, methods of the invention are carried out in a fluidly closed reaction system that permits the isolation of a portion of a first (or prior) reaction mixture and its use as a sample or specimen in a second (or subsequent) reaction mixture, thereby substantially avoiding interfering effects that first reaction components may have in the second reaction if both reaction mixtures were simply combined together. In this aspect, systems, methods, and apparatus of the invention may be used with any amplification reaction that permits multiple stages of amplification based on the use of nested primers.
    Type: Application
    Filed: February 15, 2012
    Publication date: September 27, 2012
    Applicant: Cephied
    Inventors: Jesus Ching, Ronald Chang, Douglas Dority, Jian Ping Zhang, James Jian Quan Wang, Wendy Wingkei Wong, Kendra Lara Paul, Reuel Van Atta
  • Patent number: 8269323
    Abstract: Methods, systems, and apparatuses for integrated circuit packages, and for package stacking, are provided. An electrically conductive frame is attached to a first surface of a substrate. The electrically conductive frame includes a perimeter ring portion, a plurality of leads, and a plurality of interconnect members positioned within a periphery formed by the perimeter ring portion. Each interconnect member is coupled to the perimeter ring portion by a respective lead. A first end of each interconnect member is coupled to the first surface of the substrate. An encapsulating material is applied to the first surface of the substrate, without covering a second end of each interconnect member with the encapsulating material. The perimeter ring portion is removed from the electrically conductive frame to isolate the plurality of interconnect members. A first integrated circuit package is formed in this manner. A second integrated circuit package may be mounted to the first package.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: September 18, 2012
    Assignee: Broadcom Corporation
    Inventors: Rezaur Rahman Khan, Ken Jian Ming Wang
  • Patent number: 8269321
    Abstract: According to one exemplary embodiment, a lead frame package includes a number of leads and a number of contacts, where each of the contacts is situated over one of the leads. The lead frame package further includes a semiconductor die including a number of bond pads. Each of the contacts is directly attached and bonded to one of the bond pads on the semiconductor die. Each of the contacts is situated over a top portion of one of the leads, where the top portion has a shorter length than a middle portion of each of the leads. Each of the contacts is connected to one of the bond pads on the semiconductor die without a wire bond. The semiconductor die does not include a redistribution layer situated over an active surface of the semiconductor die.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: September 18, 2012
    Assignee: Broadcom Corporation
    Inventors: Ken Jian Ming Wang, Matthew Vernon Kaufmann
  • Patent number: 8250188
    Abstract: A method and devices for restoring at least one setting are provided, the client device receives a code generated by a management device based on a time value and a parameter value that uniquely identifies the client device; the client device determines whether the code is valid; and if the code is valid the client device restores the at least one setting of the client device. It provides a convenient way to restore at least one setting of a client device.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: August 21, 2012
    Assignee: Thomson Licensing
    Inventors: Jian Qiang Hu, Jian Jun Wang, Ya Fei Shao
  • Publication number: 20120208103
    Abstract: A carbon nanosphere has at least one opening. The carbon nanosphere is obtained by preparing a carbon nanosphere and treating it with an acid to form the opening. The carbon nanosphere with at least one opening has higher utilization of a surface area and electrical conductivity and lower mass transfer resistance than a conventional carbon nanotube, thus allowing for higher current density and cell voltage with a smaller amount of metal catalyst per unit area of a fuel cell electrode.
    Type: Application
    Filed: April 10, 2012
    Publication date: August 16, 2012
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Hyuk CHANG, Chan-Ho PAK, Jian Nong WANG
  • Patent number: 8233853
    Abstract: A transmission circuit for radio frequency signals has a power mixer and includes a radio frequency input port, a first radio frequency output port, a second radio frequency output port, and a dummy load port. The transmission circuit also has a first switch unit and a second switch unit. The first switch unit is connected to the first radio frequency output port and outputs the radio frequency signals which are emitted from the first radio frequency output port or reflects the radio frequency signals which are emitted from the first radio frequency output port back to the first radio frequency output port. The second switch unit is connected to the second radio frequency output port and outputs the radio frequency signals which are emitted from the second radio frequency output port, or reflects the radio frequency signals which are emitted from the second radio frequency output port back to the second radio frequency output port.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: July 31, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jian Min Wang, Wei Dong Wang, Yao Xing
  • Publication number: 20120187545
    Abstract: Methods, systems, and apparatuses are described for improved integrated circuit packages. An integrated circuit package includes a semiconductor substrate and a semiconductor die. The semiconductor substrate has opposing first and second surfaces, a plurality of vias through the semiconductor substrate, and routing one or both surfaces of the semiconductor substrate. The die is mounted to the first surface of the semiconductor substrate. An encapsulating material encapsulates the die on the first surface of the semiconductor substrate.
    Type: Application
    Filed: June 30, 2011
    Publication date: July 26, 2012
    Applicant: BROADCOM CORPORATION
    Inventors: Rezaur Rahman Khan, Edward Law, Ken Jian Ming Wang
  • Publication number: 20120181171
    Abstract: Nanoparticle deposition systems including one or more of: a hollow target of a material; at least one rotating magnet providing a magnetic field that controls movement of ions and crystallization of nanoparticles from released atoms; a nanoparticle collection device that collects crystallized nanoparticles on a substrate, wherein relative motion between the substrate and at least a target continuously expose new surface areas of the substrate to the crystallized nanoparticles; a hollow anode with a target at least partially inside the hollow anode; or a first nanoparticle source providing first nanoparticles of a first material and a second nanoparticle source providing second nanoparticles of a second material.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 19, 2012
    Applicant: Regents of the University of Minnesota
    Inventors: Jian-Ping Wang, Shihai He
  • Publication number: 20120182012
    Abstract: A superconducting magnet assembly comprising a plurality of superconducting magnet coil portions forming a coil series circuit to provide a magnetic field, a power supply to supply power to the plurality of superconducting magnet coil portions during a magnet ramp mode of operation, and a ramp switch coupled to the superconducting magnet coil portions, wherein the ramp switch is configured to be open during a magnet ramp mode and closed during a persistent mode. A dump resistor is disposed externally to the vessel and is connectable by the ramp switch to the superconducting magnet coil portions. Further, a controller is coupled to at least one superconducting magnet coil portion and the ramp switch and is configured to detect a quench onset condition in the at least one superconducting magnet coil portion and to open the ramp switch upon detection of the quench onset condition in order to dump magnet energy.
    Type: Application
    Filed: January 19, 2011
    Publication date: July 19, 2012
    Inventors: Yuri Lvovsky, Weijun Shen, Jian-She Wang
  • Patent number: 8217522
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: July 10, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar
  • Patent number: D665936
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: August 21, 2012
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Jian-Gang Wang
  • Patent number: D665937
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: August 21, 2012
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Jian-Gang Wang
  • Patent number: D666345
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: August 28, 2012
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Jian-Gang Wang
  • Patent number: D666348
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: August 28, 2012
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Jian-Gang Wang
  • Patent number: D666352
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: August 28, 2012
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Jian-Gang Wang
  • Patent number: D673434
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: January 1, 2013
    Assignee: Apex Tool (HK) Limited Taiwan Branch
    Inventor: Jian Ren Wang