Patents by Inventor Jian Cheng

Jian Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11952676
    Abstract: A silicon carbide crystal includes a seed layer, a bulk layer and a stress buffering structure formed between the seed layer and the bulk layer. The seed layer, the bulk layer and the stress buffering structure are each formed with a dopant that cycles between high and low dopant concentration. The stress buffering structure includes a plurality of stacked buffer layers and a transition layer over the buffer layers. The buffer layer closest to the seed layer has the same variation trend of the dopant concentration as the buffer layer closest to the transition layer, and the dopant concentration of the transition layer is equal to the dopant concentration of the seed layer.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: April 9, 2024
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Ching-Shan Lin, Jian-Hsin Lu, Chien-Cheng Liou, Man-Hsuan Lin
  • Publication number: 20240101873
    Abstract: The present disclosure discloses a high-temperature fast-curing starch-based adhesive for particleboards and a preparation method thereof, belonging to the technical field of adhesive preparation. The low viscosity of the starch-based adhesive is ensured by selecting a crosslinking monomer which does not self-crosslink in a reaction process in the present disclosure, and a binary crosslinking agent matched with the crosslinking monomer is added before use to be quickly crosslinked with the crosslinking monomer at high temperature so as to ensure better thermosetting property and water resistance as well as faster curing speed of the starch-based adhesive at the same time, which meets the requirements of the particleboards for the adhesive, solves the problem of long curing time of the existing starch-based adhesives at high temperatures, further shortens the curing time of the starch-based adhesives to about 60 s, and improves the production efficiency of the particleboards.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Li CHENG, Zhengbiao GU, Yan HONG, Zhaofeng LI, Caiming LI, Xiaofeng BAN, Junnan JIN, Dongdong WU, Mengwei ZHANG, Jian YIN
  • Publication number: 20240107427
    Abstract: This application provides an access method and a communication apparatus, applied to the communication field, and in particular, to the field of short-range communication. The access method includes: sending first broadcast information based on a target access mode, where the first broadcast information indicates that a broadcast type is connectable; and if a first access request from a first device is received within first preset duration, sending first response information for the first access request, where the target access mode is an access mode in an access mode set, and the access mode set includes at least two access modes. Through configuration of the at least two access modes, access modes can be selected in different scenarios, to shorten time for subsequently establishing a connection between the first device and a second device, reduce power consumption of the first device or the second device.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 28, 2024
    Inventors: Xingqing CHENG, Lei GAO, Jian WANG, Changqing YANG
  • Publication number: 20240107895
    Abstract: A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, a gap between the array region and the ring of MTJ region, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, the array region includes a magnetic random access memory (MRAM) region and a logic region and the ring of MTJ region further includes a first MTJ region and a second MTJ region extending along a first direction and a third MTJ region and a fourth MTJ region extending along a second direction.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chung-Liang Chu, Jian-Cheng Chen, Yu-Ping Wang, Yu-Ruei Chen
  • Patent number: 11941514
    Abstract: The present disclosure discloses a method for execution of a computational graph in a neural network model and an apparatus thereof, including: creating task execution bodies on a native machine according to a physical computational graph compiled and generated by a deep learning framework, and designing a solution for allocating a plurality of idle memory blocks to each task execution body, so that the entire computational graph participates in deep learning training tasks of different batches of data in a pipelining and parallelizing manner.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 26, 2024
    Assignee: ZHEJIANG LAB
    Inventors: Hongsheng Wang, Hujun Bao, Guang Chen, Lingfang Zeng, Hongcai Cheng, Yong Li, Jian Zhu, Huanbo Zheng
  • Patent number: 11937948
    Abstract: This disclosure is directed to techniques for identifying false detection of asystole in a cardiac electrogram that include determining whether at least one of a plurality of false asystole detection criteria are satisfied. In some examples, the plurality of false asystole detection criteria includes a first false asystole detection criterion including a reduced amplitude threshold for detecting cardiac depolarizations in the cardiac electrogram, and a second false asystole detection criterion for detecting decaying noise in the cardiac electrogram.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: March 26, 2024
    Assignee: Medtronic, Inc.
    Inventors: Ya-Jian Cheng, Jerry D. Reiland
  • Publication number: 20240096857
    Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 21, 2024
    Applicant: Innolux Corporation
    Inventors: Jian-Jung Shih, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng
  • Patent number: 11936930
    Abstract: A data processing method, a server, and a data collection device are provided. The method includes: obtaining, by a server, first network key performance indicator KPI data and performance data of a first set-top box STB, where the first network KPI data is network KPI data of a first video service stream, and the first STB is an STB that receives the first video service stream; and calculating, by the server, first video quality of experience QoE of the first video service stream based on an associated model, the first network KPI data, and the performance data of the first STB, where the associated model is a model obtained through training based on historical data, and the associated model is used by the server to calculate video QoE based on network KPI data and performance data of an STB.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 19, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haonan Ye, Jian Cheng, Jian Chen, Gang Chen, Zhenhang Sun
  • Publication number: 20240087933
    Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: YOU-CHENG YEH, MAO-CHIH HUANG, YEN-CHING HUANG, YU HSUAN CHUANG, TAI-HSIANG LIN, JIAN-SHIAN LIN
  • Publication number: 20240079051
    Abstract: Disclosed is a memory cell including a first transistor having a first terminal coupled to a bit line; a second transistor having a first terminal coupled to a bit line bar; a weight storage circuit coupled between a gate terminal of the first transistor and a gate terminal of the second transistor, storing a weight value, and determining to turn on the first transistor or the second transistor according to the weight value; and a driving circuit coupled to a second terminal of the first transistor, a second terminal of the second transistor, and at least one word line, receiving at least one threshold voltage and at least one input data from the word line, and determining whether to generate an operation current on a path of the turned-on first transistor or the turned-on second transistor according to the threshold voltage and the input data.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 7, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Sheng Lin, Tuo-Hung Hou, Fu-Cheng Tsai, Jian-Wei Su, Kuo-Hua Tseng
  • Patent number: 11924965
    Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu, Jun He
  • Publication number: 20240071776
    Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
  • Patent number: 11914540
    Abstract: An on-chip integrated circuit, a data processing device and a method are provided. The on-chip integrated circuit includes: a processor circuit and an accelerator circuit. The processor circuit includes a processor and a data storage area, the processor is connected to the data storage area through a first bus in the processor circuit. The accelerator circuit includes an accelerator and a second bus, the accelerator is connected to the second bus, and the second bus is bridged with the first bus corresponding to the data storage area, to perform data interaction between the accelerator and the data storage area, which can reduce the congestion on a bus of the processor and improve the quality of service of the application.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: February 27, 2024
    Assignee: Lemon Inc.
    Inventors: Yimin Chen, Shan Lu, Chuang Zhang, Junmou Zhang, Yuanlin Cheng, Jian Wang
  • Patent number: 11877520
    Abstract: A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, a gap between the array region and the ring of MTJ region, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, the array region includes a magnetic random access memory (MRAM) region and a logic region and the ring of MTJ region further includes a first MTJ region and a second MTJ region extending along a first direction and a third MTJ region and a fourth MTJ region extending along a second direction.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: January 16, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chung-Liang Chu, Jian-Cheng Chen, Yu-Ping Wang, Yu-Ruei Chen
  • Patent number: 11876866
    Abstract: The disclosure provides a method for assisting an unregistered user device to access an end-to-end call service of a private network and a communication system. The method includes: determining whether the user device that is not registered on the private network wants to initiate a request of an emergency call; in response to determining that the user device that is not registered on the private network wants to initiate the request of the emergency call, assisting the user device to access the end-to-end call service without being registered on the private network.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: January 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Jian Cheng Chen, Tsun-Chieh Chiang, Kuo-Wei Wen
  • Publication number: 20230413304
    Abstract: A resource scheduling method implemented by a device, where the resource scheduling method includes determining a load characteristic of a frame drawing thread, where the frame drawing thread draws an image frame determining a target resource scheduling manner based on the load characteristic, and scheduling a resource for the frame drawing thread in the target resource scheduling manner.
    Type: Application
    Filed: August 15, 2023
    Publication date: December 21, 2023
    Inventors: Fei Wang, Zhenning Wang, Haibo Chen, Jian Cheng, Hongjiang Zhao, Shanxi Chen
  • Publication number: 20230394373
    Abstract: The technology of this disclosure relates to a method, an apparatus, a device, a storage medium, and a system for determining a collection period. The technology relates to the field of machine learning technologies. In this disclosure, a machine learning model is obtained by using a training dataset collected based on candidate collection periods of X features, and a candidate collection period of each of the X features is determined as a target collection period of each feature based on the obtained machine learning model and a first condition. Because the target collection period of each feature is greater than a minimum collection period of each feature, subsequently, if data is collected based on the target collection period of each feature, an amount of the collected data is reduced, to reduce collection load of a device and memory occupied by sampled data, thereby reducing time redundancy.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 7, 2023
    Inventors: Haonan YE, Weiwang XU, Li XUE, Jian CHENG
  • Publication number: 20230354892
    Abstract: An aerosolization module for an aerosol generating device includes a reservoir and a first cover made of a resilient material and fitted into an opening of the reservoir. The first cover forms a channel which extends from outside the reservoir to its inner volume. The channel makes it possible to fill the reservoir with vaporizable material. The aerosolization module further includes a second cover configured to be mounted on the first cover, the second cover including a protrusion configured to tightly plug the channel formed by the first cover and thereby close the reservoir when the second cover is mounted on the first cover. The aerosolization module is easy to fill and easy to assemble. A method of assembling the aerosolization module is also provided.
    Type: Application
    Filed: August 26, 2021
    Publication date: November 9, 2023
    Applicant: JT International SA
    Inventors: Zhihua Wen, Jian Cheng Luo
  • Publication number: 20230354904
    Abstract: An aerosolization module for an aerosol generating device includes a bottom end, an opposite top end provided with a mouthpiece, a first air path for the aerosol flow, and a second air path configured to be in fluidic communication with a puff sensor. The first air path includes a first section in which dry air sucked into a first air inlet flows from top to bottom, and a second section in which the aerosol formed by vaporization of the vaporizable material in the dry air flows from bottom to top. The aerosolization device is located inside the module, and the first air inlet is located above the aerosolization device in a bottom to top direction. The mouthpiece is at the top end of the module, and the first air inlet is made through a bottom portion of the mouthpiece. The position of the first air inlet can thus be optimized.
    Type: Application
    Filed: August 26, 2021
    Publication date: November 9, 2023
    Applicant: JT International SA
    Inventors: Pifa Shen, Jian Cheng Luo
  • Patent number: 11798292
    Abstract: A driving assistant method applied to a first moving vehicle is provided. The method includes capturing an image of a license plate of a second moving vehicle when the first moving vehicle is moving, and identifying a first area of the license plate in the captured image. Basic information of the second moving vehicle are obtained according to a size of the first area. Once a safe distance is determined according to driving information of the first moving vehicle and the basic information of the second moving vehicle, a warning message is transmitted when the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: October 24, 2023
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chih-Pu Hsu, Jian-Cheng Lin, Pei-Lin Chen, Tsung-Chun Tseng, Chien-Chun Chang