Abstract: A thermoplastic polyolefin composition comprises: (A) a polypropylene polymer; (B) an elastomer component; (C) an additive component; and (D) a scavenger component comprising a polyacetoacetate compound having the Formula (I) defined herein and calcium carbonate. And an article is made from the thermoplastic polyolefin composition.

Abstract: The disclosed technology generally relates to quartz crystal devices and more particularly to quartz crystal devices configured to vibrate in torsional mode. In one aspect, a quartz crystal device configured for temperature sensing comprises a fork-shaped quartz crystal comprising a pair of elongate tines laterally extending from a base region in a horizontal lengthwise direction of the fork-shaped quartz crystal, wherein each of the tines has formed on one or both of opposing sides thereof a pair of vertically recessed groove structures laterally elongated in the horizontal lengthwise direction, wherein the pair of groove structures are separated in a horizontal widthwise direction by a line structure.

Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: A circuit includes a control circuit having a first control circuit input, a second control circuit input, a first control circuit output, and a second control circuit output, and a first transistor having a first current terminal, a second current terminal, and a control terminal, the control terminal coupled to the first control circuit output, the first current terminal coupled to the first control circuit input and to a second transistor, and the second current terminal adapted to be coupled to the second transistor, a logic circuit having a first logic input, a second logic input, and a logic output, the first logic input coupled to the second control circuit output and a switch having a first switch terminal, a second switch terminal, and a switch control terminal, the switch control terminal coupled to the logic output and the first switch terminal coupled to the second current terminal.

Abstract: Provided is an elliptical multi-mesa laser structure, including a substrate layer, an N-DBR, a functional layer and a P-DBR sequentially arranged from bottom to top. The substrate layer is fixedly connected with an N contact layer. The N-DBR is fixedly connected to a top of the substrate layer, and the N contact layer is arranged around the N-DBR. A space layer is inserted in the N-DBR. The functional layer is fixedly connected to a top of the N-DBR. The P-DBR is fixedly connected to a top of the functional layer, and a top of the P-DBR is fixedly connected with a P contact layer. Another space layer is inserted into the P-DBR.

Abstract: Embodiments of the present disclosure relate to method, device and computer program product for data backup. The method comprises: in response to receiving from a backup server a data stream to be backed up, dividing the data stream into a plurality of data segments; distributing the plurality of data segments to at least one computing node; in response to receiving an index of a corresponding data segment from a first computing node of the at least one computing node, looking up the index in a global index cache, the index being generated by the first computing node to uniquely identify the data segment, the global index cache storing indexes of data in a backup storage device; in response to the missing index in the global index cache, adding the index into the global index cache; and sending to the first computing node an indication to store the data segment in the backup storage device.

Abstract: A boost converter that provides a wide average current limiting range includes a switch coupled to an inductor output and a power input, a diode coupled to the inductor output and an output terminal load and configured to conduct current in only one direction away from the inductor output and toward the output terminal, a clamp circuit coupled to the diode and the switch, and a minimum time off module coupled to the diode and the switch. The clamp circuit is configured to clamp an inductor output current to a reference current while the converter is operating in a continuous conduction mode (CCM) of operation. The minimum time off module is configured to cause the inductor output current to be zero for at least a time Toff while the converter is operating in a pulse frequency modulation (PFM) mode of operation.

Abstract: Implementations of the present specification provide a method and an apparatus for managing a TLB cache in a virtualization platform, where the virtualization platform runs a plurality of virtual machines, each virtual machine is allocated with a unique VPID, and all virtual logical processors in the virtual machine share the VPID; and a guest process running in the virtual machine is allocated with a PCID. An identifier field of a TLB entry in the TLB cache includes a VPID and a PCID.

Abstract: The present disclosure relates to chimeric molecules which are fusion proteins comprising two components: an Ang-2 binding peptide linked to either a VEGF antibody or a VEGF receptor-Fc fusion protein. The Ang2 peptide, VEGF antibody, and VEGF receptor-Fc fusion proteins are each defined below with reference to percent identity to a reference sequence. The chimeric molecule is a fusion protein, dual antagonist of Ang2 and VEGF for treatment of cancers, proliferative retinopathies, neovascular glaucoma, macular edema, AMD, and rheumatoid arthritis.

Abstract: A method of promoting adhesion between a dielectric layer of a semiconductor device and a metal fill deposited within a trench in the dielectric layer, including performing an ion implantation process wherein an ion beam formed of an ionized dopant species is directed into the trench at an acute angle relative to a top surface of the dielectric layer to form an implantation layer in a sidewall of the trench, and depositing a metal fill in the trench atop an underlying bottom metal layer, wherein the metal fill adheres to the sidewall.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A cargo body, which may be found on a cargo vehicle, is provided. The cargo body includes a floor assembly that includes a first side and a second side. The cargo body further includes a slide rail assembly. The slide rail assembly includes one or more slide rails. The one or more slide rails are removably coupled to the floor assembly.

Abstract: A tuning method for a collimator of a CT machine, which, in each cycle of X-ray scan operation and stop, may include determining whether an X-ray is generated from the anode plate; calculating the Z-direction heating displacement of the slot plate during the current scan based on a detected X-ray, driving the slot plate to move by the heating displacement in the Z-direction, calculating the total Z-direction heating displacement of the slot plate at the end of the current scan, calculating the cooling displacement of the slot plate during the current stop based on the stop time of the X-ray, and driving the slot plate to move.

Abstract: A chip structure provided herein includes a bridge structure including an interconnect bridge, a dielectric layer laterally surrounding the interconnect bridge and through dielectric vias extending from a top of the dielectric layer to a bottom of the dielectric layer, wherein a thickness of the interconnect bridge is identical to a height of each of the through dielectric vias; semiconductor dies disposed on the bridge structure, wherein each of the semiconductor dies overlaps both the interconnect bridge and the dielectric layer and is electrically connected to the interconnect bridge and at least one of the through dielectric vias; and a die support, the semiconductor dies being disposed between the die support and the bridge structure, wherein a sidewall of the die support is coplanar with a sidewall of the bridge structure.

Abstract: Die structures and methods of forming the same are described. In an embodiment, a device includes: a lower integrated circuit die; a first upper integrated circuit die face-to-face bonded to the lower integrated circuit die, the first upper integrated circuit die including a first semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first upper integrated circuit die, a top surface of the gap-fill dielectric being substantially coplanar with a top surface of the first semiconductor substrate and with a top surface of the first through-substrate via; and an interconnect structure including a first dielectric layer and first conductive vias, the first dielectric layer disposed on the top surface of the gap-fill dielectric and the top surface of the first semiconductor substrate, the first conductive vias extending through the first dielectric layer to contact the top surface of the first through-substrate via.

Abstract: In an embodiment, a device includes: a first integrated circuit die comprising a semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first integrated circuit die, a surface of the gap-fill dielectric being substantially coplanar with an inactive surface of the semiconductor substrate and with a surface of the first through-substrate via; a dielectric layer on the surface of the gap-fill dielectric and the inactive surface of the semiconductor substrate; a first bond pad extending through the dielectric layer to contact the surface of the first through-substrate via, a width of the first bond pad being less than a width of the first through-substrate via; and a second integrated circuit die comprising a die connector bonded to the first bond pad.

Abstract: Provided is an elliptical multi-mesa laser structure, including a substrate layer, an N-DBR, a functional layer and a P-DBR sequentially arranged from bottom to top. The substrate layer is fixedly connected with an N contact layer. The N-DBR is fixedly connected to a top of the substrate layer, and the N contact layer is arranged around the N-DBR. A space layer is inserted in the N-DBR. The functional layer is fixedly connected to a top of the N-DBR. The P-DBR is fixedly connected to a top of the functional layer, and a top of the P-DBR is fixedly connected with a P contact layer. Another space layer is inserted into the P-DBR.

Abstract: A multiplexed display panel and device and a driving method for the multiplexed display panel are provided. At the moment when a switching switch is turned on, a potential of a fanout line corresponding to a data line connected to sub-pixels, into which an data signal is input, is adjusted to the same level as a potential of the data line as much as possible, and a potential difference between each fanout line and the corresponding data line is relatively small at the moment when the switching switch is turned on, so that an instantaneous current at this moment is greatly reduced without causing relatively large jump of the potential of the data line, a common electrode and back-plated indium tin oxide (ITO) greatly fluctuate, and then the surface noise generated by the display panel is turned on is greatly reduced.

Abstract: A voice coil motor held immobile by magnetic attraction when not in use for photography purposes includes a base, a magnet fixed thereto, a carrier, a magnetic member, and a coil. The magnetic member is fixed to the carrier and is attracted by a permanent magnetic field (first MF) of the magnet on the base. The coil is fixed to the carrier and the magnetic member. When the voice coil motor is powered on, the coil generates a second magnetic field (second MF) opposing the first MF. The second MF reduces or eliminates the attractive force of the first MF of the magnet, to separate the carrier and its fittings and allow them to work freely. A lens module and an electronic device are further provided.

Abstract: A system may include a memory and a processor in communication with the memory. The processor may be configured to perform operations. The operations may include synchronizing a policy between a primary node and a compute node and maintaining a resource registry on a client of the primary node. The operations may include communicating a direct communication between the client and the compute node, and the direct communication may include a first task. The operations may include returning a first result for the first task directly from the compute node to the client.