Patents by Inventor Jian Lin

Jian Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905221
    Abstract: A dispersant for premixed fluidized solidified soil includes the following raw materials in parts by weight: 5 parts to 15 parts of an anti-adhesion water reducer, 0.5 parts to 0.8 parts of a stabilizer, and 85 parts to 95 parts of water. The anti-adhesion water reducer is compounded by an inorganic dispersant and an aminosulfonic acid-based superplasticizer (ASP), and the inorganic dispersant is at least one selected from the group consisting of sodium silicate, sodium hexametaphosphate, and sodium pyrophosphate. In the present disclosure, on the premise of improving fluidity of mucky cohesive soil slurry, a strength of the fluidized solidified soil at each stage is adjusted through a water-reducing effect of the anti-adhesion water reducer. Moreover, rapid dispersion of the mucky cohesive soil slurry is realized, thus providing key technical support for preparation of the premixed fluidized solidified soil from undisturbed soil in non-dry conditions.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: February 20, 2024
    Assignees: WUHAN INSTITUTE OF TECHNOLOGY, THE COLLEGE OF POST AND TELECOMMUNICATION OF WIT
    Inventors: Zunqun Xiao, Caiyun Xu, Hui Wang, Fuqi Wang, Zhentao Lv, Yanbin Chang, Haitao Liu, Yinlei Shi, Keqi Luo, Jian Lin, Minghui Deng, Puyu Li, Yuepeng Zheng
  • Publication number: 20240047589
    Abstract: An interconnected electrode structure, a method of manufacturing same, and a use of same are provided. The interconnected electrode structure includes an insulating base material, a through hole, a first conductive body, and a second conductive body. The insulating base material includes a first surface and a second surface which face away from each other. The through hole penetrates through the insulating base material in a thickness direction. The first conductive body is formed by conductive slurry that enters the through hole from an opening of the through hole on the first surface. The second conductive body is formed by a second conductive material that enters the through hole from an opening of the through hole on the second surface, and the second conductive body is electrically combined with the first conductive body to form a conductive channel in the insulating base material.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 8, 2024
    Applicant: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO) , CHINESE ACADEMY OF SCIENCES
    Inventors: Jian LIN, Hao ZHANG, Jing WANG, Zhenguo WANG, Qun LUO, Chao GONG, Changqi MA
  • Publication number: 20240039165
    Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 1, 2024
    Inventors: Hsuan-Jui CHANG, Nai-Chen LIU, Shih-Huang YEH, Chung-Hsin CHIANG, Wun-Jian LIN
  • Publication number: 20240018058
    Abstract: A dispersant for premixed fluidized solidified soil includes the following raw materials in parts by weight: 5 parts to 15 parts of an anti-adhesion water reducer, 0.5 parts to 0.8 parts of a stabilizer, and 85 parts to 95 parts of water. The anti-adhesion water reducer is compounded by an inorganic dispersant and an aminosulfonic acid-based superplasticizer (ASP), and the inorganic dispersant is at least one selected from the group consisting of sodium silicate, sodium hexametaphosphate, and sodium pyrophosphate. In the present disclosure, on the premise of improving fluidity of mucky cohesive soil slurry, a strength of the fluidized solidified soil at each stage is adjusted through a water-reducing effect of the anti-adhesion water reducer. Moreover, rapid dispersion of the mucky cohesive soil slurry is realized, thus providing key technical support for preparation of the premixed fluidized solidified soil from undisturbed soil in non-dry conditions.
    Type: Application
    Filed: May 11, 2023
    Publication date: January 18, 2024
    Applicants: WUHAN INSTITUTE OF TECHNOLOGY, THE COLLEGE OF POST AND TELECOMMUNICATION OF WIT
    Inventors: Zunqun XIAO, Caiyun XU, Hui WANG, Fuqi WANG, Zhentao LV, Yanbin CHANG, Haitao LIU, Yinlei SHI, Keqi LUO, Jian LIN, Minghui DENG, Puyu LI, Yuepeng ZHENG
  • Publication number: 20230416262
    Abstract: The present invention provides compounds, pharmaceutically acceptable compositions thereof, and methods of using the same.
    Type: Application
    Filed: August 6, 2021
    Publication date: December 28, 2023
    Inventors: Andrew Thomas Maynard, Erik Lee Meredith, Jeffrey Owen Saunders, Jian Lin, Jorge Garcia Fortanet
  • Patent number: 11850703
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: December 26, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20230382795
    Abstract: A fluidized solidified soil based on gold tailings includes the following raw materials in parts by mass: 75 parts to 80 parts of gold tailings, 5.2 parts to 13 parts of a dispersant solution, and 9 parts to 16 parts of a solidifying material. A preparation method includes the following steps: mixing the gold tailings with the dispersant solution, and then stirring to obtain a suspension slurry of the gold tailings; and adding the solidifying material, and stirring to obtain the fluidized solidified soil. In the present disclosure, the gold tailings are used as a main material, combined with a special dispersant solution and a special solidifying material, and a fluidized solidified soil is prepared with fluidity suitable for pumping and a certain strength after hardening. The fluidized solidified soil prevents the pollution caused by gold tailings landfilling, and can be used as a filling material for various construction projects.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 30, 2023
    Applicants: WUHAN INSTITUTE OF TECHNOLOGY, The College of Post and Telecommunication of WIT
    Inventors: Zunqun XIAO, Caiyun XU, Fuqi WANG, Jian LIN, Hui WANG, Zhentao LV, Yanbin CHANG, Haitao LIU, Yinlei SHI, Keqi LUO, Minghui DENG, Puyu LI, Yuepeng ZHENG
  • Publication number: 20230363911
    Abstract: An implantable device is configured to be positioned within a native heart valve to allow the native heart valve to form a more effective seal. The implantable device includes a cover. The cover can be attached to one or more sleeves, can have a portion that has a lower coefficient of friction, and/or can have separate pieces that cover different portions of the implantable device.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 16, 2023
    Inventors: Florian Georg Deuschl, Chris J. Okos, Waina Michelle Chu, Jian Lin Phan, Lauren R. Freschauf, Wen Yan Chen
  • Publication number: 20230346753
    Abstract: The present invention relates to compounds and compositions for the inhibition of NAMPT, their synthesis, applications and antidotes.
    Type: Application
    Filed: December 2, 2022
    Publication date: November 2, 2023
    Inventors: Kenneth W. Bair, Timm R. Baumeister, Alexandre J. Buckmelter, Karl H. Clodfelter, Peter Dragovich, Francis Gosselin, Bingsong Han, Jian Lin, Dominic J. Reynolds, Bruce Roth, Chase C. Smith, Zhongguo Wang, Po-Wai Yuen, Xiaozhang Zheng
  • Publication number: 20230338345
    Abstract: Provided is a drug combination for prevention and/or treatment of tumors. The drug combination includes: a) an ascorbic acid or a derivative thereof in an amount effective for prevention and/or treatment, and b) a selective PDE4 inhibitor in an amount effective for prevention and/or treatment.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 26, 2023
    Inventors: Nuo XU, Jian LIN
  • Publication number: 20230345746
    Abstract: A flexible photoelectric device module and a method for preparing same are provided. The module includes a plurality of photoelectric device units. One photoelectric device unit includes a bottom electrode, a functional layer and a top electrode. The bottom electrode includes a light-transmittance insulating base, and a first electrode, a second electrode and a third electrode which are arranged on two side surfaces of the base. The first electrode is a transparent electrode. The second electrode and the first electrode are in electric contact with each other. The second electrode and the third electrode are electrically connected through a conducting channel. The conducting channel runs through the base along a thickness direction. The third electrode in one photoelectric device unit is electrically connected to the top electrode or the first electrode in another photoelectric device unit, so that the two photoelectric device units are disposed in series or in parallel.
    Type: Application
    Filed: December 27, 2021
    Publication date: October 26, 2023
    Applicant: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO) , CHINESE ACADEMY OF SCIENCES
    Inventors: Lingpeng YAN, Yunfei HAN, Hao ZHANG, Chao GONG, Jian LIN, Qun LUO, Changqi MA
  • Publication number: 20230291127
    Abstract: An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 14, 2023
    Applicant: MEDIATEK INC.
    Inventors: Wun-Jian Lin, Chung-Hsin Chiang, Shyh-Tirng Fang, Shih-Huang Yeh
  • Patent number: 11756329
    Abstract: A fingerprint detection array substrate is provided. The fingerprint detection array substrate includes a plurality of touch electrode blocks in a plurality of touch detection regions configured to detect a touch position, wherein touch electrode blocks in a respective one of the plurality of touch detection regions are inter-connected through bridges, forming a touch electrode unit, and the touch electrode unit is isolated from touch electrode blocks in adjacent touch detection regions of the plurality of touch detection regions; a plurality of touch signal lines configured to respectively transmit touch signals to a plurality of touch detection regions, wherein a respective one of the plurality of touch signal lines is electrically connected to the touch electrode unit limited in the respective one of the plurality of touch detection regions; and a fingerprint sensor configured to perform fingerprint sensing limited in a fingerprint scanning region.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: September 12, 2023
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Gang Hua, Yong Zhang, Haobo Fang, Jian Lin, Limin Zhang, Zhichao Yang, Yawei Zhang, Xianglei Qin, Zepeng Sun
  • Publication number: 20230265315
    Abstract: Two-part silane modified polymer/free radically curable adhesive systems demonstrating improved strength and percent elongation are provided.
    Type: Application
    Filed: January 3, 2023
    Publication date: August 24, 2023
    Inventors: Chih-Min Cheng, Jian Lin, Christopher J. Verosky, James M. Murray, Daniel Yi, Richard Corrao, Zachary S. Bauman, Ling Li
  • Publication number: 20230265183
    Abstract: Provided is an antibody molecule that binds to human Nectin-4 or a fragment thereof. The antibody is obtained by means of hybridoma screening and humanization techniques, and is used for the prevention or treatment of a cancer, and may be used as a clinical lead drug molecule.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 24, 2023
    Inventors: Hongyuan REN, Jian ZHU, Jian LIN, Lichun WANG, Xiaohong XU, Xiaofang DENG, Jianjun BI, Jin WANG, Jian WU
  • Publication number: 20230250168
    Abstract: Embodiments of the present disclosure provide an antibody that binds to human Claudin 18.2 or a fragment thereof, as well as encoded nucleic acids and the like thereof. The anti-human Claudin 18.2 antibody of embodiments of the present disclosure has strong affinity to an antigen Claudin 18.2 and significant complement-dependent cytotoxicity (CDC) activity and antibody-dependent cytotoxicity (ADCC) activity to target expression cells, and exhibits high specificity to human CLDN 18.2.
    Type: Application
    Filed: September 28, 2020
    Publication date: August 10, 2023
    Inventors: Jian LIN, Xiaofang DENG, Pan GAO, Xiaohong XU, Lichun WANG, Hongyuan REN, Jianjun BI, Jin WANG
  • Publication number: 20230236222
    Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
  • Patent number: 11707833
    Abstract: A robotic arm device includes a robotic arm including a base, a first arm and a second arm, a wire set adjacent to the first arm and the second arm, and a wire take-up module set in the first arm and including a rail, a sliding block and an elastic member. The sliding block is vertically slidably set on the rail and connected with the wire set and the elastic member. With the configuration of the wire take-up module, the robotic arm device can achieve the effects of improving wiring convenience, reducing wiring interference and saving wiring time.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: July 25, 2023
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Made Rama Pradipta Arya, Jian-An Lin
  • Publication number: 20230219213
    Abstract: A robotic arm device includes a robotic arm including a base, a first arm and a second arm, a wire set adjacent to the first arm and the second arm, and a wire take-up module set in the first arm and including a rail, a sliding block and an elastic member. The sliding block is vertically slidably set on the rail and connected with the wire set and the elastic member. With the configuration of the wire take-up module, the robotic arm device can achieve the effects of improving wiring convenience, reducing wiring interference and saving wiring time.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 13, 2023
    Inventors: Made Rama Pradipta ARYA, Jian-An LIN
  • Publication number: 20230207499
    Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.
    Type: Application
    Filed: December 16, 2022
    Publication date: June 29, 2023
    Inventors: Wun-Jian LIN, Shih-Huang YEH, Chen-Hao HSU