Abstract: A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe is U-shaped and includes an evaporative section attached to the heat receiver, a pair of condesative sections received in the holes of the fins, and a pair of curved sections connected between opposite ends of the evaporative section and the condensative sections respectively and received in the enlarged openings.

Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.

Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.

Abstract: Uniaxial magnetic anisotropy was found in the Fe/Co/Cu/Co magnetoresistive structures deposited on Si (100) substrates. Samples magnetized along an easy anisotropy axis showed extremely sharp magnetization and magnetoresistance switching at low fields and maximum giant magnetoresistance of 9.5% at 5K (5.5% at room temperature) for the samples with 5 nm of Fe,5 nm of Co, 2.5 nm of Cu and 2 nm of Co. These results were advantageous compared to Co/Cu/Co trilayers grown on Cr/Cu buffer which did not exhibit uniaxial anisotropy. Deposition on spinning wafers allowed excluding substrate related anisotropy. An existing magnetic field in the magnetron sputtering system with the strength of 32 Oe at the sample location was found the most probable source of the induced uniaxial anisotropy.

Abstract: Disclosed is a DNA amplification primer pair for the amplification of Sextolet 900 marker, which comprises R14B/264 primer having the sequence of SEQ ID NO:1 and a primer designed from the nucleic acid sequence of Sextolet 900 marker (SEQ ID NO:2). A method for the DNA fingerprinting identification of genetically related or unrelated individuals, which comprises the steps of performing DNA amplification of genomic DNA samples collected from individuals, using the primer pair R14B/264 and Sext.900E (SEQ ID NO:1 and SEQ ID NO:3, respectively) and separating the amplified DNA segments obtained whereby Sextolet 900 marker, having a heterozigosity of at least 0.97 and comprising more than 64 alleles, is amplified and serves as DNA fingerprinting of the individuals.

Abstract: There is provided a process for producing titanium composite, comprising the steps of: molding titanium powder, titanium alloy powder, or powder comprising titanium into a certain shape by a cold isostatic press or cold press; reacting the shape with hydrocarbon gas at its decomposition temperature or higher, to form TiC therein; and providing the shape with high density by vacuum sintering, hot isostatic pressing, hot forging, hot rolling and/or the combinations thereof. TiC a reinforcing material, is in-situ formed by reacting a cold-pressed body of the powder with hydrocarbon gas and cleaner than the externally added one and distributed more uniformly and finely in the Ti matrix, leading to a significant improvement in wear resistance and high temperature property.