Abstract: A heat dissipation system and method for a data center are provided. The heat dissipation system includes a first heat exchanger, a second heat exchanger, a third heat exchanger, and a first controller. The first heat exchanger and the second heat exchanger form a first cooling circuit with a cooling medium outlet and a cooling medium inlet of the data center, and the second heat exchanger and the third heat exchanger form a second cooling circuit. The third heat exchanger is connected to a heat recovery system. The first controller is connected to the first heat exchanger and the second heat exchanger, and is configured to control a heat exchange ratio of the first heat exchanger to the second heat exchanger.

Abstract: Embodiments of the present disclosure provide an operating system startup method, apparatus and electronic device. A specific implementation of the method comprises: determining at least one target mirror server from a mirror server cluster based on a LinuxBoot on a diskless server, wherein a mirror file stored in a mirror server comprises a system kernel and a file system; downloading mirror file fragments from a target mirror server of the at least one target mirror server based on the LinuxBoot; assembling a plurality of downloaded mirror file fragments into a target mirror file; and booting an operating system of the diskless server based on a target system kernel and a target file system comprised in the target mirror file. Therefore, the efficiency and success rate of diskless boot-up of an operating system of the diskless server can be improved when booting the operating system based on the LinuxBoot.

Abstract: A drying apparatus is based on supercritical fluid. The drying apparatus includes: an upper cover; a base, arranged below the upper cover and the base and the upper cover; a substrate tray, arranged on the base; a first fluid supply tube, arranged on the top wall of the upper cover; a fluid disturbance plate, arranged below the first fluid supply tube; a second fluid supply tube, arranged on a first side wall of the upper cover; and a fluid discharge tube, arranged on a second side wall of the upper cover. The inner space of the closed chamber can be minimized by using the drying apparatus, thereby saving the usage amount of the supercritical fluid, and reducing the usage costs.

Abstract: A communication method includes communicating between a terminal device and a first network device via a first uplink capability. The terminal device includes a first communication card and a second communication card. The method also includes sending a first message to the first network device from the terminal device. The first message indicates a second uplink capability to communicate between the terminal device and the first network device. The method additionally includes communicating between the terminal device and a second network device via a third uplink capability.

Abstract: An apparatus to perform fast data access comprises a receiver, a processor, and a memory. The processor receives using the receiver a light signal from a light source. The light signal can be structured to generate a temporal code. The light source is an optical beacon that includes a Light-Emitting Diode (LED). The processor then decodes the light signal to generate a network address, and causes a display of a client device coupled to the apparatus to display information based on the network address. The network address can be a Uniform Resource Locator (URL) address and the information based on the network address includes a webpage associated with the URL. Other embodiments are described herein.

Abstract: An apparatus for cleaning semiconductor wafers includes a plurality of load ports; at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; and one or more single wafer cleaning modules. The apparatus further includes: a first turnover device, configured to rotate the one or more wafers from horizontal plane to vertical plane so that the one or more wafers can be vertically transferred to the at least one first tank; and a second turnover device, configured to rotate the one or more wafers from vertical plane to horizontal plane so that the one or more wafers can be horizontally transferred to the one or more single wafer cleaning modules.

Abstract: The present application provides an array base plate and a method for manufacturing the same, a display panel, the array base plate including a substrate; a first conducting layer located at one side of the substrate, and including a plurality of data lines arranged in an array; a second conducting layer located at one side of the first conducting layer away from the substrate, and in direct contact with a part of a region of the first conducting layer, and including a pixel electrode and a compensating electrode; wherein an orthographic projection of the compensating electrode on the substrate is located within orthographic projections of the data lines on the substrate. The embodiments of the present application provide an array base plate with low cost, high preparation yield, and good reliability.

Abstract: The disclosure relates to a data center, including: an IT equipment container provided with a server rack therein, an air-cooling equipment container, the IT equipment container having IT coolant inlet and outlet ports, and IT air inlet and outlet ports, the IT equipment container being prefabricated with a coolant inlet pipe connecting the IT coolant inlet port to a coolant inlet of a server rack, a coolant outlet pipe connecting the IT coolant outlet port to a coolant outlet of the server rack, and an air duct connecting the IT air outlet port to an air outlet of the server rack, and the IT air inlet port being in communication with interior of the IT equipment container; and having air-cooling air inlet and outlet ports, the air-cooling air inlet port and outlet ports being docked with the IT air outlet port and the IT air inlet port, respectively.

Abstract: This application provides a communication method and a communication apparatus. In the method, a source network device sends a request message to a target network device, where the request message is used to request to hand over a terminal device to the target network device. The source network device receives a response message from the target network device, where the response message indicates that handing over the terminal device to the target network device is allowed. The source network device sends first configuration information to the terminal device, where the first configuration information indicates artificial intelligence (artificial intelligence, AI) configuration information of the target network device. The source network device sends a first message to the terminal device, where the first message indicates to hand over the terminal device to the target network device.

Abstract: The disclosure relates to a data center cooling system including a cooling tower, an air cooling unit, a liquid cooling unit and a cabinet, the air cooling unit including a first heat exchanger, a fan and an air returning channel, the liquid cooling unit including a second heat exchanger, the cabinet including a server. A coolant outlet of the cooling tower is connected to a coolant inlet of the first heat exchanger and a first coolant inlet of the second heat exchanger, a coolant outlet of the first heat exchanger and a first coolant outlet of the second heat exchanger are connected to a coolant inlet of the cooling tower, a second coolant outlet of the second heat exchanger is connected to a coolant inlet of the server, and a coolant outlet of the server is connected to a second coolant inlet of the second heat exchanger.

Abstract: Embodiments of this application disclose a communication method and a communication apparatus. The method includes: A transmit end performs first encoding processing on first data by using an encoder neural network, to obtain a first sent feature, where the first sent feature is related to a channel distribution dimension of an environment in which the transmit end is located. The transmit end performs second encoding processing on the first sent feature by using a matching layer, to obtain a first feature, where the encoder neural network and the matching layer are obtained through independent training. The transmit end sends the first feature to a receive end, where the first feature is used by the receive end to obtain the first data.

Abstract: A method and a system for performing a matrix multiplication operator using a unit supporting convolution operator operation, an electronic device, and a non-transitory storage medium are provided. The method includes: transforming a first matrix of the matrix multiplication operator to an input data matrix of a convolution operator; transforming a second matrix of the matrix multiplication operator to a weight matrix of the convolution operator, matrix multiplication being performed on the first matrix and the second matrix; and performing a convolution operation on the input data matrix and the weight matrix, which are obtained through transforming, of the convolution operator using the unit supporting convolution operator operation to obtain an operation result of the matrix multiplication operator.

Abstract: A scan circuit is provided. The scan circuit includes a plurality of stages. A respective stage of the scan circuit includes a respective scan unit configured to provide a control signal to one or more rows of subpixels. A respective scan unit includes a first subcircuit, a second subcircuit, a third subcircuit, a fourth subcircuit. A pull-up node is coupled to the second subcircuit, the third subcircuit, and the fourth subcircuit. A pull-down node is coupled to the second subcircuit, the third subcircuit. The denoising subcircuit is coupled to a pull-up node and the input terminal, or coupled between a third power supply voltage terminal and the pull-down control node.

Abstract: This application provides a communication method and a communication apparatus. Therefore, in a scenario in which a network device provides an artificial intelligence (artificial intelligence, AI) service for a terminal device, AI performance information of the network device is used as a basis for determining whether to access the network device, so that the terminal device subsequently accesses a network device with excellent AI performance information, and obtains an excellent AI service. In the method, the terminal device obtains AI model information of a first network device; and the terminal device determines AI performance information of the first network device based on the AI model information of the first network device.

Abstract: The present disclosure belongs to the technical field of display, and provides an array substrate, a handwriting tablet, a tablet eraser, a handwriting tablet system and a method for erasing a pattern. The array substrate is provided with a handwriting area, and a peripheral area surrounding the handwriting area. The array substrate includes erasing electrodes, which are arranged in an array, and a driving circuit for driving the erasing electrodes, wherein the driving circuit is configured to load, under the irradiation of preset light, an erasing voltage to the erasing electrodes. The array substrate is further provided with an NFC coil, which is used for sending an NFC signal, wherein a sensing range of the NFC coil covers the handwriting area.

Abstract: An under-screen camera is provided. A camera is positioned behind a see-through display screen and positioned to capture scene image data of objects in front of the display screen. The camera captures scene image data of a real-world scene including a user. The scene image data is processed to remove artifacts in the scene image data created by capturing the scene image data through the see-through display screen such as blur, noise, backscatter, wiring effect, and the like.

Abstract: This application relates to a method for reporting UDC information by UE, and a device. The method includes: A terminal device receives request information sent by a network device, where the request information is used to request the terminal device to report first information; and the terminal device sends the first information to the network device, where the first information is used to indicate that the terminal device supports a UDC capability, and indicate a maximum quantity of DRBs that can be simultaneously supported by the terminal device and for which UDC is activated.

Abstract: An electronic paper display screen and a manufacturing method therefor, and a display device. The electronic paper display screen includes a first electronic paper screen and a second liquid crystal display layer which are stacked; the first electronic paper screen is an electrophoretic electronic paper screen, the second liquid crystal display layer is a cholesteric liquid crystal display screen, and the second liquid crystal display layer includes a first substrate, a second substrate and a control drive circuit; the first substrate is provided with multiple first electrodes arranged in a first direction, and the second substrate is provided with multiple second electrodes arranged in a second direction; and at least one of the first substrate and the second substrate is further provided with multiple metal wires, the metal wires are respectively connected to the control drive circuit and the electrodes of the substrate to which the metal wires belong.

Abstract: A method for packaging chips includes: flip-chip bonding a plurality of filter chips to be packaged on a substrate to be packaged; applying a first mold material layer on the filter chips to be packaged; applying a second mold material layer on a side of the first mold material layer away from the filter chip to be packaged, the first mold material layer and the second mold material layer forming a first mold layer; thinning the first mold material layer and the second mold material layer to expose substrates of the filter chips to be packaged, and thinning the substrates of the filter chips to be packaged to a preset thickness; applying a second mold layer on the exposed substrates of the filter chips to be packaged to obtain a mold structure; and cutting the mold structure into a plurality of particle chips.