Abstract: A wireless communication system base station, and a remote radio head (RRH) and a computer-implemented synchronization method for the wireless communication system base station. The RRH is communicably coupled to a baseband unit (BBU) of the wireless communication system base station through a network, and the BBU processes and transmits downlink data to the RRH. The RRH includes: a time-delay measurement unit for measuring a time-delay for the downlink data to arrive at the RRH from the BBU; and a time-delay notification unit for notifying from the RRH to the BBU of time-delay data on the time-delay measured by the time-delay measurement unit, wherein the time-delay data is used to advance the starting time for the BBU to process and transmit the downlink data by an amount of time obtained based on the time-delay data.

Abstract: A base station apparatus, methods of receiving and sending data, and a computer readable article of manufacture. A computer implemented method includes the following for receiving and sending data: receiving the data by an RF header module; grouping data received; transferring the grouped data to a data processing apparatus; distributing the grouped data into an uplink sub-channel; merging the distributed data using at least one downlink sub-channel; transferring the merged data to a transceiving apparatus; degrouping the merged data; and sending the merged data by RF header module. A method of receiving data, a method of sending data, and computer readable non-transitory articles of manufacture are also provided.

Abstract: The present invention relates to a software radio system and a decoding apparatus and method thereof. According to an embodiment of the present invention, there is provided a forward error correction decoding apparatus for a software radio system, including: a receiving module for receiving decoding tasks from a plurality of uplink channels; and a decoder matrix for executing the decoding tasks, wherein the decoder matrix is shared by the plurality of uplink channels. The decoding apparatus and method as well as the software radio system according to the embodiments of the present invention can be well adapted to the high computing capabilities, sufficient flexibility and scalability as required by base station systems for next-generation wireless communication systems.

Abstract: A base station apparatus adaptive for antenna arrays including at least one radio frequency (RF) header module, at least one data processing apparatus, and transceiving apparatus for transceiving data between the at least one radio frequency (RF) header module and the at least one data processing apparatus. The transceiving apparatus includes an uplink module to group data received by the RF header module according to grouping configuration information, and to transfer the grouped data to the data processing apparatus; and a downlink module to degroup the data from the data processing apparatus according to the grouping configuration information, and to transfer the degrouped data to the RF header module. Also provided are methods of receiving and sending data, and a computer readable article of manufacture tangibly embodying computer readable instructions for executing a computer implemented method of sending and receiving data for a base station.

Abstract: A slew rate control circuit is provided. The slew rate control circuit includes at least one switch and an inverter. A first end of the switch is coupled to a power terminal. A toggle end of the switch is coupled to a first control terminal. A second end of the switch is coupled to an output terminal. An output end of the inverter is coupled to the output terminal. An input end of the inverter is coupled to an input terminal. A voltage at the first control terminal conducts the switch to reduce the slew rate when a large voltage variation occurs at the output terminal. A method of controlling a slew rate and a slew rate control device are provided.

Abstract: A circuit for reducing popping sound comprises a waveform generator, a voltage accumulator, and a comparator. The waveform generator is configured for generating a periodic waveform, and the voltage accumulator is configured for generating an increased voltage. The comparator is configured for comparing the periodic waveform with the increased voltage for generating a successive pulse signal. A percentage of a duty cycle in the successive pulse signal is increased gradually.

Abstract: A wireless communication transceiver and a mode switch device thereof. The transceiver includes: a first band transmission path; a first band reception path; a second band transmission path; a second band reception path; a path switch and a control unit. In a dual band time division duplexing mode, the control unit controls the path switch so that the path switch connects a received radio frequency signal from an antenna to the first band reception path, and connects a transmitted radio frequency signal from the second band transmission path to the antenna in an odd cycle or an even cycle; and controls the path switch so that the path switch connects a received radio frequency signal from the antenna to the second band reception path, and connects a transmitted radio frequency signal from the first band transmission path to the antenna in another odd cycle or another even cycle.

Abstract: A circuit for reducing popping sound comprises a waveform generator, a voltage accumulator, and a comparator. The waveform generator is configured for generating a periodic waveform, and the voltage accumulator is configured for generating an increased voltage. The comparator is configured for comparing the periodic waveform with the increased voltage for generating a successive pulse signal. A percentage of a duty cycle in the successive pulse signal is increased gradually.

Abstract: A radioactive material containing chitosan for inhibiting cancer and a preparation method thereof are revealed. The adioactive material containing chitosan is formed by using SOCTA chelating agent to connect chitosan and radionuclides such as 188Re, and Tc-99m etc. The preparation method of the radioactive material containing chitosan includes the steps of: prepare SOCTA-Chitosan compound; and prepare M(radionuclide)-SOCTA-Chitosan compound. By biocompatibility and clotting in alkaline environment of human blood of chitosan, the radioactive material containing chitosan is injected into cancer and staying there for a long time so as to achieve effectively treatment.

Abstract: A triangle wave generator with function of spreading frequency spectrum is provided. The triangle wave generator includes a switch control circuit, a current generator, an integrator, and a spread spectrum control circuit. The switch control circuit provides an internal clock and a switch control signal. The current generator is coupled to the switch control circuit and provides charge current according to the switch control signal. The integrator is coupled to the current generator and provides a triangle wave signal. The spread spectrum control circuit is coupled to the switch control circuit and the current generator for providing a current control signal according to the internal clock.

Abstract: A base station apparatus adaptive for antenna arrays including at least one radio frequency (RF) header module, at least one data processing apparatus, and transceiving apparatus for transceiving data between the at least one radio frequency (RF) header module and the at least one data processing apparatus. The transceiving apparatus includes an uplink module to group data received by the RF header module according to grouping configuration information, and to transfer the grouped data to the data processing apparatus; and a downlink module to degroup the data from the data processing apparatus according to the grouping configuration information, and to transfer the degrouped data to the RF header module. Also provided are methods of receiving and sending data, and a computer readable article of manufacture tangibly embodying computer readable instructions for executing a computer implemented method of sending and receiving data for a base station.

Abstract: A triangle wave generator with function of spreading frequency spectrum is provided. The triangle wave generator includes a switch control circuit, a current generator, an integrator, and a spread spectrum control circuit. The switch control circuit provides an internal clock and a switch control signal. The current generator is coupled to the switch control circuit and provides charge current according to the switch control signal. The integrator is coupled to the current generator and provides a triangle wave signal. The spread spectrum control circuit is coupled to the switch control circuit and the current generator for providing a current control signal according to the internal clock.

Abstract: A decoding method of CABAC is proposed. A CABAC decoder comprises an arithmetic engine performing two arithmetic decodings for a coefficient or reading contexts at the same time in a clock cycle. The arithmetic decoding for a coefficient comprises the steps of: (1) providing a residual block comprising Significant_flags, Last_significant_flags, coefficients and the corresponding contexts; (2) sequentially resolving the Significant_flag and the Last_significant_flag of a non-zero coefficient; and (3) decoding the non-zero coefficient to obtain regular bins and bypass bins, wherein the arithmetic decoding is conducted twice in a clock cycle.

Abstract: A method of making a wire connection in a semiconductor device, the method comprising: (a) forming an under bump metallurgy (UBM) over a chip including the bonding pad formed thereon; (b) forming a gold bump on the UBM at a location corresponding to the bonding pad; (c) etching the UBM with the gold bump as a mask; and (d) connecting one end of a bonding wire to a conductive lead by ball bonding and the other end thereof to the gold bump on the bonding pad of the chip by stitch bonding. The conductive lead is located external to the chip as a part of a lead frame or a substrate. Alternatively, the semiconductor chip having bumps may be formed by electroless plating a nickel layer on the bonding pads of the chip, and followed by electroless plating a gold layer on the nickel layer. It is noted that the semiconductor chip having metal bumps is formed by wafer bumping process.

Abstract: A stacked chip scale package. The stacked chip scale package has a substrate having mounting pads arranged to lie close to the rectangular sides. A smaller silicon chip is stacked on the active surface of a larger silicon chip and the larger silicon chip rest on the substrate. The mounting pads on the substrate are distributed around the periphery of the lower silicon chip. Both the upper silicon chip and the lower silicon chip have only one pair of opposite sides having bonding pads. The pair of edges of the upper silicon chip with bonding pads nearby is parallel to the pair of edges of the lower silicon chip without bonding pads. The bonding pads on the upper chip and the lower chip are electrically connected to their neighboring mounting pads through conductive wires. The conductive wires, the upper silicon chip, the lower silicon chip and a portion of the substrate are enclosed by packaging material.

Abstract: A multichip module has at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. In some embodiments, the semiconductor chips may have a plurality of bonding pads along only two mutually perpendicular side edges thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bonding pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.

Abstract: This invention moves at least one outer via outwardly to a location under the edge of the chip so as to form an offset via. Since the via is made of copper, the offset via provides sufficient supporting strength for the chip edge during molding process. Further, this invention also disposes a copper mesh on the substrate at the area without vias and traces so as to enhance the substrate strength for supporting the chip. According to another aspect of this invention, dummy via holes are provided for the substrate at the area under the chip edge for supporting the chip. Since the copper mesh, offset via, the dummy via hole are made of copper having sufficient supporting strength for the chip, the crack problem during molding process can be eliminated.