Patents by Inventor Jian Wen

Jian Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8979098
    Abstract: A foldable platform truck includes a platform, two wheel-connecting bars rotatably attached to the platform, a handle assembly, a handle release and locking mechanism for controlling the handle assembly, a pair of first gear members and a pair of second gear members. The handle release and locking mechanism has an actuator to be operated to allow the handle assembly to pivot between an upright position and a horizontal position. When the handle assembly is in the horizontal position, the wheels are folded up underneath the platform and lie horizontally with respect thereto. And, when the handle assembly is pulled away from the platform to the upright position, the first gear members engage and turn the second gear members, resulting in the wheel-connecting bars rotating to fold out the wheels from underneath the platform toward an eventual perpendicular position with respect to the underside of the platform.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: March 17, 2015
    Inventors: Wen-Fa Wang, Jian-Wen Deng, Jia-Chao Chen
  • Publication number: 20150031110
    Abstract: A phytase having improved enzymaic activity is disclosed. The phytase has a modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of Valine at position 90 with Threonine. Alternatively, the phytase has a modified amino acid sequence of SEQ ID NO: 6, wherein the modification is a substitution of Asparagine at position 204 with Alanine or a substitution of Serine at position 206 with Alanine.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 29, 2015
    Inventors: Rey-Ting Guo, Tzu-Hui Wu, Ya-Shan Cheng, Jian-Wen Huang, Hui-Lin Lai, Cheng-Yen Lin, Ting-Yung Huang
  • Publication number: 20140315273
    Abstract: A ?-mannanase having increased enzymaic activity is disclosed. The ?-mannanase has a modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of Tyrosine at position 216 with Tryptophan.
    Type: Application
    Filed: September 5, 2013
    Publication date: October 23, 2014
    Applicant: Dongguan APAC Biotechnology CO., Ltd.
    Inventors: Rey-Ting Guo, Jian-Wen Huang, Ya-Shan Cheng, Tzu-Hui Wu, Hui-Lin Lai, Cheng-Yen Lin, Ting-Yung Huang
  • Patent number: 8865444
    Abstract: A ?-mannanase having increased enzymaic activity is disclosed. The ?-mannanase has a modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of Tyrosine at position 216 with Tryptophan.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 21, 2014
    Assignee: Dongguan APAC Biotechnology Co., Ltd.
    Inventors: Rey-Ting Guo, Jian-Wen Huang, Ya-Shan Cheng, Tzu-Hui Wu, Hui-Lin Lai, Cheng-Yen Lin, Ting-Yung Huang
  • Publication number: 20140264793
    Abstract: A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Inventors: Kai Yun Yow, Alexander M. Arayata, Jian Wen
  • Patent number: 8836091
    Abstract: A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: September 16, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Kai Yun Yow, Alexander M. Arayata, Jian Wen
  • Patent number: 8811389
    Abstract: A base station apparatus, methods of receiving and sending data, and a computer readable article of manufacture. A computer implemented method includes the following for receiving and sending data: receiving the data by an RF header module; grouping data received; transferring the grouped data to a data processing apparatus; distributing the grouped data into an uplink sub-channel; merging the distributed data using at least one downlink sub-channel; transferring the merged data to a transceiving apparatus; degrouping the merged data; and sending the merged data by RF header module. A method of receiving data, a method of sending data, and computer readable non-transitory articles of manufacture are also provided.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: August 19, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jian Wen Chen, Yonghua Lin, Ravinder Kumar Sabhikhi, Qing Wang, Zhen Bo Zhu
  • Publication number: 20140222871
    Abstract: Techniques for data assignment from an external distributed file system (DFS) to a database management system (DBMS) are provided. Data blocks from the DFS are represented as first nodes and access module processors of the DBMS are represented as second nodes. A graph is produced with the first and second nodes. Assignments are made for the first nodes to the second nodes based on evaluation of the graph to integrate the DFS with the DBMS.
    Type: Application
    Filed: March 18, 2014
    Publication date: August 7, 2014
    Applicant: Teradata US, Inc.
    Inventors: Yan Qi, Yu Xu, Olli Pekka Kostamaa, Jian Wen
  • Publication number: 20140215412
    Abstract: A method, system, and/or computer program product adjust values of a plurality of conditions. A processor receives a user input, which is a movement across a user interface. A tendency of the movement, which describes a direction and velocity of the movement, is determined. According to the tendency of the movement, a processor adjusts a value of at least one of the plurality of conditions by using a plurality of graphs representing the plurality of conditions, where the plurality of conditions describe search criteria, where the user input describes the search criteria, and where the plurality of graphs representing the plurality of conditions have a common starting point and are radial.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 31, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: JIAN WEN CHI, FANG LIANG DONG, RONG RONG GONG, LIN YING YING
  • Patent number: 8780886
    Abstract: A wireless communication system base station, and a remote radio head (RRH) and a computer-implemented synchronization method for the wireless communication system base station. The RRH is communicably coupled to a baseband unit (BBU) of the wireless communication system base station through a network, and the BBU processes and transmits downlink data to the RRH. The RRH includes: a time-delay measurement unit for measuring a time-delay for the downlink data to arrive at the RRH from the BBU; and a time-delay notification unit for notifying from the RRH to the BBU of time-delay data on the time-delay measured by the time-delay measurement unit, wherein the time-delay data is used to advance the starting time for the BBU to process and transmit the downlink data by an amount of time obtained based on the time-delay data.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: July 15, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jian Wen Chen, Lin Chen, Yonghua Lin, Qing Wang, Rong Yan, Zhen Bo Zhu
  • Publication number: 20140183832
    Abstract: A foldable platform truck includes a platform, two wheel-connecting bars rotatably attached to the platform, a handle assembly, a handle release and locking mechanism for controlling the handle assembly, a pair of first gear members and a pair of second gear members. The handle release and locking mechanism has an actuator to be operated to allow the handle assembly to pivot between an upright position and a horizontal position. When the handle assembly is in the horizontal position, the wheels are folded up underneath the platform and lie horizontally with respect thereto. And, when the handle assembly is pulled away from the platform to the upright position, the first gear members engage and turn the second gear members, resulting in the wheel-connecting bars rotating to fold out the wheels from underneath the platform toward an eventual perpendicular position with respect to the underside of the platform.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 3, 2014
    Inventors: Wen-Fa Wang, Jian-Wen Deng, Jia-Chao Chen
  • Patent number: 8767710
    Abstract: A wireless communication system base station, and a remote radio head (RRH) and a computer-implemented synchronization method for the wireless communication system base station. The RRH is communicably coupled to a baseband unit (BBU) of the wireless communication system base station through a network, and the BBU processes and transmits downlink data to the RRH. The RRH includes: a time-delay measurement unit for measuring a time-delay for the downlink data to arrive at the RRH from the BBU; and a time-delay notification unit for notifying from the RRH to the BBU of time-delay data on the time-delay measured by the time-delay measurement unit, wherein the time-delay data is used to advance the starting time for the BBU to process and transmit the downlink data by an amount of time obtained based on the time-delay data.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jian Wen Chen, Lin Chen, Yonghua Lin, Qing Wang, Rong Yan, Zhen Bo Zhu
  • Patent number: 8742555
    Abstract: A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: June 3, 2014
    Inventors: Jian Wen, Darrel R. Frear, William G. McDonald
  • Patent number: 8722382
    Abstract: A xylanase having increased enzymaic activity is disclosed. The xylanase has a modified amino acid sequence of SEQ ID NO: 2, wherein Tryptophan at position 125 is substituted with Phenylalanine and Phenylalanine at position 163 is substituted with Tryptophan.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 13, 2014
    Assignee: Dongguan APAC Biotechnology Co., Ltd.
    Inventors: Rey-Ting Guo, Ya-Shan Cheng, Jian-Wen Huang, Tzu-Hui Wu, Hui-Lin Lai, Cheng-Yen Lin, Ting-Yung Huang
  • Patent number: 8722156
    Abstract: An embodiment of the disclosure provides a liquid crystal compound having the following formula: wherein A1, A2, and A3 are independently hydrogen, halogen, cyano, thiocyanato, or —OCF3; R1 is hydrogen, halogen, C1-C12 alkyl, C1-C12 alkoxy, C1-C12 haloalkly, C2-C12 alkenyl, or C2-C12 alkynyl; R2 and R3 are independently hydrogen, halogen, C1-C6 alkyl, C1-C6 haloalkly, cyano, thiocyanato, or —OCF3; and Z is a single bond, —O—, —CH2O—, —C(O)O—, —OCO—, —C(O)NH—, or —CH?CH—. In another embodiment, a liquid crystal display including the liquid crystal compound is also provided.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: May 13, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Jian-Wen Lin, Chun-Ming Wu, Shih-Hsien Liu, Kung-Lung Cheng, Chih-Lung Chin
  • Publication number: 20140118679
    Abstract: Disclosed is a liquid-crystal compound with negative dielectric anisotropy, having the chemical formula: wherein A1, A2, and A3 are independently selected from cyclohexyl group, cyclohexenyl group, or phenyl group; L1 and L2 are independently selected from H or F; R is selected from H, F, Cl, C1-10 alkyl group, C1-10 alkenyl group, C1-10 alkoxy group, or C1-10 ether group; Y is fluorinated methyl group; m and n are independently selected from an integer of 0-2; and 1?m+n?3.
    Type: Application
    Filed: February 20, 2013
    Publication date: May 1, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Wu LIAW, Shih-Hsien LIU, Kung-Lung CHENG, Jian-Wen LIN, Kuo-Chang WANG
  • Patent number: 8713057
    Abstract: Techniques for data assignment from an external distributed file system (DFS) to a database management system (DBMS) are provided. Data blocks from the DFS are represented as first nodes and access module processors of the DBMS are represented as second nodes. A graph is produced with the first and second nodes. Assignments are made for the first nodes to the second nodes based on evaluation of the graph to integrate the DFS with the DBMS.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: April 29, 2014
    Assignee: Teradata US, Inc.
    Inventors: Yan Qi, Yu Xu, Olli Pekka Kostamaa, Jian Wen
  • Publication number: 20140033814
    Abstract: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Inventors: Jian Wen, William G. McDonald
  • Patent number: 8638819
    Abstract: A wireless communication transceiver and a mode switch device thereof. The transceiver includes: a first band transmission path; a first band reception path; a second band transmission path; a second band reception path; a path switch and a control unit. In a dual band time division duplexing mode, the control unit controls the path switch so that the path switch connects a received radio frequency signal from an antenna to the first band reception path, and connects a transmitted radio frequency signal from the second band transmission path to the antenna in an odd cycle or an even cycle; and controls the path switch so that the path switch connects a received radio frequency signal from the antenna to the second band reception path, and connects a transmitted radio frequency signal from the first band transmission path to the antenna in another odd cycle or another even cycle.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: January 28, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jian Wen Chen, Lin Chen, Yong Hua Lin, Qing Wang, Rong Yan, Zhen Bo Zhu
  • Patent number: 8552553
    Abstract: The present invention relates to a semiconductor device. The semiconductor device includes a substrate and a chip. The chip is electrically connected to the substrate. The chip includes a chip body, at least one chip pad, a first passivation, an under ball metal layer and at least one metal pillar structure. The chip pad is disposed adjacent to an active surface of the chip body. The first passivation is disposed adjacent to the active surface, and exposes part of the chip pad. The under ball metal layer is disposed adjacent to the chip pad. The metal pillar structure contacts the under ball metal layer to form a first contact surface having a first diameter. The metal pillar structure is electrically connected to a substrate pad of the substrate to form a second contact surface having a second diameter. The ratio of the first diameter to the second diameter is between 0.7 and 1.0.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: October 8, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Jian-Wen Lo, Chien-Fan Chen