Abstract: A thermostable cellulase having increased enzyme activity is disclosed. The cellulase comprises a modified amino acid sequence of SEQ ID NO: 2, wherein the tyrosine at position 61 is substituted with an amino acid selected from the group consisting of phenylalanine, alanine and glycine.

Abstract: A base station apparatus adaptive for antenna arrays including at least one radio frequency (RF) header module, at least one data processing apparatus, and transceiving apparatus for transceiving data between the at least one radio frequency (RF) header module and the at least one data processing apparatus. The transceiving apparatus includes an uplink module to group data received by the RF header module according to grouping configuration information, and to transfer the grouped data to the data processing apparatus; and a downlink module to degroup the data from the data processing apparatus according to the grouping configuration information, and to transfer the degrouped data to the RF header module. Also provided are methods of receiving and sending data, and a computer readable article of manufacture tangibly embodying computer readable instructions for executing a computer implemented method of sending and receiving data for a base station.

Abstract: A slew rate control circuit is provided. The slew rate control circuit includes at least one switch and an inverter. A first end of the switch is coupled to a power terminal. A toggle end of the switch is coupled to a first control terminal. A second end of the switch is coupled to an output terminal. An output end of the inverter is coupled to the output terminal. An input end of the inverter is coupled to an input terminal. A voltage at the first control terminal conducts the switch to reduce the slew rate when a large voltage variation occurs at the output terminal. A method of controlling a slew rate and a slew rate control device are provided.

Abstract: A vacuum cleaner has a brush roll which has a housing. A motor is disposed within the housing and has a pulley mounted on a shaft of the motor. A roller is disposed within the housing and has a drive wheel. A belt couples the pulley to the drive wheel, so that the motor can drive the roller. The roller has bristles for sweeping a surface to be cleaned.

Abstract: A circuit for reducing popping sound comprises a waveform generator, a voltage accumulator, and a comparator. The waveform generator is configured for generating a periodic waveform, and the voltage accumulator is configured for generating an increased voltage. The comparator is configured for comparing the periodic waveform with the increased voltage for generating a successive pulse signal. A percentage of a duty cycle in the successive pulse signal is increased gradually.

Abstract: The present invention relates to a semiconductor device. The semiconductor device includes a substrate and a chip. The chip is electrically connected to the substrate. The chip includes a chip body, at least one chip pad, a first passivation, an under ball metal layer and at least one metal pillar structure. The chip pad is disposed adjacent to an active surface of the chip body. The first passivation is disposed adjacent to the active surface, and exposes part of the chip pad. The under ball metal layer is disposed adjacent to the chip pad. The metal pillar structure contacts the under ball metal layer to form a first contact surface having a first diameter. The metal pillar structure is electrically connected to a substrate pad of the substrate to form a second contact surface having a second diameter. The ratio of the first diameter to the second diameter is between 0.7 and 1.0.

Abstract: The present invention relates to a chip having a metal pillar structure. The chip includes a chip body, at least one chip pad, a first passivation layer, an under ball metal layer and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer, and includes a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer. The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar. Therefore, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.

Abstract: The present invention relates to the fabrication of a grafted, UV photo-polymerized silica-based monolithic column and the use of such column for the extraction of DNA. In one embodiment, a method is provided for fabricating a silica-based monolithic column, wherein a vessel is filled with a polymerization mixture that is formed into monolithic solid phase for DNA extraction through in situ photo-polymerization.

Abstract: A wireless communication transceiver and a mode switch device thereof. The transceiver includes: a first band transmission path; a first band reception path; a second band transmission path; a second band reception path; a path switch and a control unit. In a dual band time division duplexing mode, the control unit controls the path switch so that the path switch connects a received radio frequency signal from an antenna to the first band reception path, and connects a transmitted radio frequency signal from the second band transmission path to the antenna in an odd cycle or an even cycle; and controls the path switch so that the path switch connects a received radio frequency signal from the antenna to the second band reception path, and connects a transmitted radio frequency signal from the first band transmission path to the antenna in another odd cycle or another even cycle.

Abstract: Disclosed is a method for compensating an imaging defect in an image forming apparatus. The method includes generating a raster image. Further, the method includes determining a compensating profile representing the imaging defect in the image forming apparatus. Furthermore, the method includes forming a defect-compensated image based on the raster image and the compensating profile. Also, disclosed is the image forming apparatus capable of compensating the imaging defect thereof.

Abstract: An automatic vendor system used in hotels is provided, comprising: automatic vending machines each having a man-machine interaction interface, being used as vending and pickup platforms; a host being configurable for operation control, monitoring and storing information, which has a plurality of automatic vendor and management functions; a plurality of local shopping networks are formed and arranged in a hotel to generate a chain store network in an area through connection of computer network; through a information transfer link of production-direct marketing constructed with the sales information from the local networks, shortage of goods in a day is collected so as to supplement goods in the single vending machines; customers select goods through a touch screen after receiving an electronic cash card, then the host inquires cash amount through the reader and send an delivery instruction to the control board, the control board records and subtracts quantity of the purchased goods, and control a corresponding

Abstract: An animation embedded automatic vending machine is provided, comprising: a core board having a chip with high video playing capability; a 3D animation system for simulating the scene of a customer entering into a store to do shopping; a sales system supporting charge, computation, data storage and financial report printing; the 3D animation system is embedded into a shopping procedure control module; the sales system is connected to corresponding ports of the core board respectively, a display screen arranged on a man-machine interaction interface of the automatic vending machine, and a FPGA control bottom board, are connected to the core board of the automatic vending machine respectively, and the FPGA control bottom board instructs a delivery executing mechanism of the automatic vending machine to deliver the goods selected via the animation window.

Abstract: A circuit for reducing popping sound comprises a waveform generator, a voltage accumulator, and a comparator. The waveform generator is configured for generating a periodic waveform, and the voltage accumulator is configured for generating an increased voltage. The comparator is configured for comparing the periodic waveform with the increased voltage for generating a successive pulse signal. A percentage of a duty cycle in the successive pulse signal is increased gradually.

Abstract: A small size permanent magnet direct current motor has a housing accommodating a permanent magnet stator and a wound rotor. The rotor has a rotor core with a diameter of 23 mm±3 mm and 12 poles and a cylindrical commutator. The motor has an output power of more than 25 watts.

Abstract: The present invention relates to the fabrication of a grafted, UV photo-polymerized silica-based monolithic column and the use of such column for the extraction of DNA. In one embodiment, a method is provided for fabricating a silica-based monolithic column, wherein a vessel is filled with a polymerization mixture that is formed into monolithic solid phase for DNA extraction through in situ photo-polymerization.

Abstract: A method of making a three-dimensional package, including: (a) providing a wafer; (b) forming at least one blind hole; (c) forming an isolation layer; (d) forming a conductive layer; (e) forming a dry film; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and the isolation layer, so as to expose the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer is inserted into the solder of the lower wafer, so as to enhance the joint between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.

Abstract: The present application is directed to methods of operating a multi-color image forming device in a mono-color mode. The methods may include performing three basic loops during the printing in the mono-color mode. A first loop may include printing mono-color pages up to an initial preset maximum. The preset maximum may prevent a wear mark from forming on the non-operational PC members due to rubbing against the moving ITM. A second loop may occur when the mono-color pages exceeds the initial preset maximum. The second loop may include rotating the non-operational imaging stations to prevent wear. A third loop may occur when the number of mono-color images exceeds an overall maximum number. The third loop may include resetting the non-operational image forming stations to allow for continuing printing in the mono-color mode.

Abstract: A radioactive material containing chitosan for inhibiting cancer and a preparation method thereof are revealed. The adioactive material containing chitosan is formed by using SOCTA chelating agent to connect chitosan and radionuclides such as 188Re, and Tc-99m etc. The preparation method of the radioactive material containing chitosan includes the steps of: prepare SOCTA-Chitosan compound; and prepare M(radionuclide)-SOCTA-Chitosan compound. By biocompatibility and clotting in alkaline environment of human blood of chitosan, the radioactive material containing chitosan is injected into cancer and staying there for a long time so as to achieve effectively treatment.

Abstract: A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.

Abstract: A triangle wave generator with function of spreading frequency spectrum is provided. The triangle wave generator includes a switch control circuit, a current generator, an integrator, and a spread spectrum control circuit. The switch control circuit provides an internal clock and a switch control signal. The current generator is coupled to the switch control circuit and provides charge current according to the switch control signal. The integrator is coupled to the current generator and provides a triangle wave signal. The spread spectrum control circuit is coupled to the switch control circuit and the current generator for providing a current control signal according to the internal clock.