Patents by Inventor Jian-Yang He

Jian-Yang He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal-Bump Sidewall Protection
    Publication number: 20220367397
    Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
    Type: Application
    Filed: July 28, 2022
    Publication date: November 17, 2022
    Inventors: Jung-Hua Chang, Jian-Yang He, Chin-Fu Kao
  • CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220336400
    Abstract: A structure including a substrate having a conductive pad and a connecting structure disposed on the conductive pad and electrically connected to the conductive pad. The connecting structure includes a first metallic layer disposed on the conductive pad, a first intermetallic compound layer disposed on the first metallic layer, a second intermetallic compound layer disposed on the first intermetallic compound layer and a second metallic layer disposed on the second intermetallic compound layer. The first metallic layer comprises copper. The first intermetallic compound layer comprises a first intermetallic compound. The second intermetallic compound layer comprises a second intermetallic compound different from the first intermetallic compound. The second metallic layer comprises tin. The first intermetallic compound contains copper, tin and one of nickel and cobalt.
    Type: Application
    Filed: April 15, 2021
    Publication date: October 20, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Jian-Yang He, Ying-Ching Shih, Szu-Wei Lu
  • Metal-bump sidewall protection
    Patent number: 11476219
    Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 18, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Hua Chang, Jian-Yang He, Chin-Fu Kao
  • Metal-Bump Sidewall Protection
    Publication number: 20210005564
    Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: Jung-Hua Chang, Jian-Yang He, Chin-Fu Kao
  • Metal-bump sidewall protection
    Patent number: 10784222
    Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung-Hua Chang, Jian-Yang He, Chin-Fu Kao
  • Metal-Bump Sidewall Protection
    Publication number: 20200135677
    Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
    Type: Application
    Filed: October 31, 2018
    Publication date: April 30, 2020
    Inventors: Jung-Hua Chang, Jian-Yang He, Chin-Fu Kao