Patents by Inventor Jian Yi

Jian Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250107189
    Abstract: The semiconductor device includes a substrate, an epitaxial layer and a transistor structure. The substrate is a hexagonal crystal structure and has a top surface perpendicular to a c-axis. The top surface of the substrate includes a lattice plane that is parallel to the c-axis, in which the lattice plane is etched by using a developed photoresist, and an included angle between the top surface of the developed photoresist and the substrate is in a range from 30 degree to 60 degree. The epitaxial axis is located on the lattice plane. The transistor structure is located in the epitaxial layer, on the epitaxial layer and on a surface facing away from the epitaxial layer.
    Type: Application
    Filed: February 15, 2024
    Publication date: March 27, 2025
    Inventor: Jian-Yi WU
  • Patent number: 12248407
    Abstract: A page swap method, a storage system, and an electronic device as applied to the field of memory management technologies are provided. The method includes determining, from a least recently used LRU linked list, a to-be-swapped-out first swap-out page of a memory device, determining a second swap-out page from the LRU linked list based on the first swap-out page, and when the first swap-out page is swapped out of the memory device, swapping out the first swap-out page and the second swap-out page to a swap device.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: March 11, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Changlong Li, Jian Yi, Weilai Zhou, Wei Du, Jiaxin Li
  • Patent number: 12028976
    Abstract: The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: July 2, 2024
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Jian-Yi Hao, Yan-Lu Li
  • Patent number: 11945885
    Abstract: A vinyl-containing copolymer is copolymerized from (a) first compound, (b) second compound, and (c) third compound. (a) First compound is an aromatic compound having a single vinyl group. (b) Second compound is polybutadiene or polybutadiene-styrene having side vinyl groups. (c) Third compound is an acrylate compound. The vinyl-containing copolymer includes 0.003 mol/g to 0.010 mol/g of benzene ring, 0.0005 mol/g to 0.008 mol/g of vinyl group, and 1.2*10?5 mol/g to 2.4*10?4 mol/g of ester group.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: April 2, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Po Kuo, Shin-Liang Kuo, Shu-Chuan Huang, Yan-Ting Jiang, Jian-Yi Hang, Wen-Sheng Chang
  • Publication number: 20230270246
    Abstract: A tabletop assembly, a lifting frame assembly and a height adjustable table are disclosed. The assembling operation of the height adjustable table is simplified by using a supporting part rotatably connected to a table board support and a first terminal block and a second terminal block which are arranged in pairs. During transportation, the height adjustable table may be disassembled into a tabletop assembly and a lifting frame assembly to be packaged and transported, respectively, thus reducing the size of the package. Meanwhile, the lifting frame assembly may be folded, the second terminal block on the lifting frame assembly in a folded state forms an approximate fan-shaped region with the table board support, so that the second terminal block may be protected during transportation. After receiving the goods, the consumer may assemble the tabletop assembly and the lifting frame assembly through a simple process.
    Type: Application
    Filed: January 3, 2023
    Publication date: August 31, 2023
    Applicant: G-Youth TECHNOLOGIES (Shenzhen) CO. LTD
    Inventors: Rongzheng Lin, Jian Yi
  • Publication number: 20230243024
    Abstract: A Mg—Li—Al—Zn alloy is disclosed. The Mg—Li—Al—Zn alloy comprises, in weight percent: 5-15% Li, 1.5-9.0% Al, 0.5-1.5% Zn, 0.4-1.3% Y, 0.18-1.01% Nd, 0.09-0.65% Ce, and the balance Mg and incidental impurities. Experimental data have proved that, this novel Mg—Li—Al—Zn alloy has a flashover temperature in a range between 620° C. and 700° C., such that the flashover temperature of the specifically-designed Mg—Li—Al—Zn alloy is greater than that of commercial LAZ521, LAZ721, LAZ771, LAZ921, and LAZ1491 alloys. Therefore, the Mg—Li—Al—Zn alloy of the present invention can be processed to be a structural article through air melt and casting process.
    Type: Application
    Filed: January 4, 2023
    Publication date: August 3, 2023
    Applicant: AMLI MATERIALS TECHNOLOGY CO., LTD.
    Inventors: CHUN-KAI LIN, JIAN-YI GUO, CHIN-TING FAN
  • Publication number: 20230237391
    Abstract: A nesting and shear cutting preprocessing method for a defective plate, comprising the following steps: acquiring plate information of a plate, wherein the plate information includes defect information and plate dimension information; making an electronic defect map according to the defect information and the plate dimension information, and partitioning out a region available for nesting and shear cutting; and partitioning the plate to obtain small plates according to the region available for nesting and shear cutting. A nesting and shear cutting layout method for a defective plate, a nesting and shear cutting production optimization method for a defective plate, and a system, a computing device, a storage medium therefor. The preprocessing method and the system can reduce the scrap rate of plate processing.
    Type: Application
    Filed: June 22, 2021
    Publication date: July 27, 2023
    Applicant: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Jian YI, Limin WANG, Shujin JIA, Bin DU, Liangqi GE
  • Patent number: 11684981
    Abstract: An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer?diamond grain size?20 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 27, 2023
    Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING. CHINESE ACADEMY OF SCIENCES
    Inventors: Nan Jiang, He Li, Bo Wang, Jian Yi, Yang Cao
  • Publication number: 20230176980
    Abstract: A page swap method, a storage system, and an electronic device as applied to the field of memory management technologies are provided. The method includes determining, from a least recently used LRU linked list, a to-be-swapped-out first swap-out page of a memory device, determining a second swap-out page from the LRU linked list based on the first swap-out page, and when the first swap-out page is swapped out of the memory device, swapping out the first swap-out page and the second swap-out page to a swap device.
    Type: Application
    Filed: March 24, 2021
    Publication date: June 8, 2023
    Inventors: Changlong Li, Jian Yi, Weilai Zhou, Wei Du, Jiaxin Li
  • Publication number: 20230141271
    Abstract: An oligomer includes a repeating unit and a repeating unit or a combination thereof. The repeating number of the repeating unit (a) and the repeating number of the repeating unit (b1), (b2), or a combination thereof have a ratio of 1:1 to 20:1. Each Q is independently substituted or unsubstituted aliphatic group, cycloaliphatic group, aromatic group, or siloxane group. X can be and Y can be or a combination thereof, and Z can be or a combination thereof.
    Type: Application
    Filed: September 8, 2022
    Publication date: May 11, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Po KUO, Kuan-Han WU, Shin-Liang KUO, Shu-Chuan HUANG, Wen-Sheng CHANG, Jian-Yi HANG
  • Publication number: 20230120862
    Abstract: A storage system, a file storage and reading method, and a terminal device are provided. A storage system including a UFS is used as an example. The storage system configures different medium forms of the UFS, for example, configures persistent storage space of the UFS including SLC and TLC medium forms, to implement hybrid medium multi-disk storage. Based on the storage system, a hot file related to an application running rate is preferentially selected and stored in an SLC storage area of the UFS, and files on a mapped multi-disk are mounted on a same directory of a file system, so that files can be migrated between the SLC storage area and a TLC storage area without user perception, to improve performance of the storage system.
    Type: Application
    Filed: March 24, 2021
    Publication date: April 20, 2023
    Inventors: Enbo Gao, Juanjuan Tong, Xiyu Zhou, Wei Du, Zhiwei Zhang, Jian Yi, Weilai Zhou, Jiaxin Li
  • Publication number: 20230000244
    Abstract: A liftable table leg includes a bushing, a second fixing piece, a lift assembly, a fixing base and a drive assembly. A first fixing piece is sleeved on a first end of the bushing. The second fixing piece includes a fixing flange and an accommodation groove. The first end is fixed to a bottom end of the accommodation groove through the first fixing piece. A nut of the lift assembly is fixedly disposed at a second end of the bushing. A lead screw of the lift assembly is rotatably disposed in the bushing and threaded into the nut. The second fixing piece is fixedly disposed at the fixing base through the fixing flange. The drive assembly includes a fixing frame. An end of the lead screw is rotatably connected to the fixing frame, and the drive assembly is capable of driving the lead screw to rotate.
    Type: Application
    Filed: March 17, 2022
    Publication date: January 5, 2023
    Applicant: LUXSHARE PRECISION INDUSTRY CO., LTD.
    Inventors: Rongzheng LIN, Jian YI
  • Publication number: 20230000247
    Abstract: Provided is a lift desk. The lift desk includes a support base, a first desk board, a second desk board and an adjustment support assembly, where the first desk board is connected to the support base by a lift mechanism; the second desk board is connected to the first desk board and positioned between the support base and the first desk board, and the second desk board is provided with a groove at a side of the second desk board facing towards the first desk board. The adjustment support assembly includes a support block. The support block is slidably disposed in the groove and configured to cooperate with the second desk board to support a supported object.
    Type: Application
    Filed: February 23, 2022
    Publication date: January 5, 2023
    Applicant: LUXSHARE PRECISION INDUSTRY CO., LTD.
    Inventors: Rongzheng LIN, Jian YI
  • Publication number: 20220338350
    Abstract: The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.
    Type: Application
    Filed: April 23, 2020
    Publication date: October 20, 2022
    Inventors: JIAN-YI HAO, YAN-LU LI
  • Patent number: 11359276
    Abstract: A self-supporting ultra-fine nanocrystalline diamond thick film, the thickness being 100-3000 microns, wherein 1 nanometer?diamond grain size?20 nanometers. A method for using chemical vapor deposition to grow ultra-fine nanocrystalline diamond on a silicon substrate, and separating the silicon substrate and the diamond to acquire the self-supporting ultra-fine nanocrystalline diamond thick film. The chemical vapor deposition method is simple and effective, and prepares a high-quality ultra-fine nanocrystalline diamond thick film.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 14, 2022
    Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES
    Inventors: Nan Jiang, He Li, Bo Wang, Jian Yi, Yang Cao
  • Publication number: 20220080684
    Abstract: The present invention is directed to a method for post processing a 3D printed part, to a three-dimensional part fabricated in a method according to the present invention, and further to the use of a liquid in the post processing of a three-dimensional part fabricated in a 3D printing method.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 17, 2022
    Inventors: Michael Paul Levandoski, AiFu Che, Jenny Jian Yi Cheng, Jessica Bo Xu
  • Publication number: 20210140038
    Abstract: A self-supporting ultra-fine nanocrystalline diamond thick film, the thickness being 100-3000 microns, wherein 1 nanometer?diamond grain size?20 nanometers. A method for using chemical vapor deposition to grow ultra-fine nanocrystalline diamond on a silicon substrate, and separating the silicon substrate and the diamond to acquire the self-supporting ultra-fine nanocrystalline diamond thick film. The chemical vapor deposition method is simple and effective, and prepares a high-quality ultra-fine nanocrystalline diamond thick film.
    Type: Application
    Filed: April 18, 2018
    Publication date: May 13, 2021
    Inventors: Nan JIANG, He LI, Bo WANG, Jian YI, Yang CAO
  • Publication number: 20210079408
    Abstract: The technology relates in part to biological methods for producing terpenes and to engineered cells and microorganisms capable of such production.
    Type: Application
    Filed: July 11, 2018
    Publication date: March 18, 2021
    Applicant: Radici Chimica S.p.A.
    Inventors: Kimberly Ann Aeling, Pierre-Yves De Wals, Eric Scott, Eric Knight, Jian Yi, Michael Waldbridge, Thomas Beardslee
  • Patent number: 10913865
    Abstract: A modified metal nanoplate and a conductive paste including the same are provided. The modified metal nanoplate includes a metal nanoplate, a first protecting agent, and a second protecting agent. The metal nanoplate has an average width of 0.3-20 ?m and an average thickness of 10-35 nm. The first protecting agent is disposed on a surface of the metal nanoplate and includes an oxygen-containing polymer. The second protecting agent is disposed on the surface of the metal nanoplate and includes a C6-C12 alkylamine.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: February 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shin-Liang Kuo, Hung Ming Chang, Shu-Jiuan Huang, Jian-Yi Hang
  • Patent number: D1058038
    Type: Grant
    Filed: July 19, 2024
    Date of Patent: January 14, 2025
    Inventor: Jian Yi