Patents by Inventor Jian You
Jian You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11947137Abstract: A composite membrane, including a base plate; the base plate is used for corresponding to a light source, and an emergent surface of the base plate is provided thereon with multiple dispersive prism areas and multiple diffusion plates, wherein the dispersive prism areas correspond to lamp bead shadow areas, and the diffusion plates correspond to non-lamp bead shadow areas; the dispersive prism areas are provided in areas in which light energy is distributed unevenly, while only the diffusion plates are laid in areas in which light energy is distributed evenly, and the dispersive prisms need not be laid, thereby reducing production costs while improving the phenomenon of a visual effect being uneven. Further provided is a design method for a composite membrane.Type: GrantFiled: June 28, 2019Date of Patent: April 2, 2024Assignee: SHENZHEN SKYWORTH-RGB ELECTRONIC CO., LTDInventors: Xin Liu, Junping You, Jian Li
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Publication number: 20240092729Abstract: The present invention relates to a method for purifying key intermediates of Citalopram, i.e. 4-[4-(dimethylamino)-1-(4-fluorophenyl)-1-hydroxybutyl]-3-hydroxymethylbenzonitrile and a salt thereof. The method comprises dissolving crude 4-[4-(dimethylamino)-1-(4-fluorophenyl)-1-hydroxybutyl]-3-hydroxymethylbenzonitrile (compound of formula I containing formaldehyde impurity) with an organic solvent, adding a washing solution, controlling the temperature, stirring, leaving to stand for layering, and removing the aqueous layer, so as to obtain a purified organic solution of 4-[4-(dimethylamino)-1-(4-fluorophenyl)-1-hydroxybutyl]-3-hydroxymethylbenzonitrile. The method provided by the present invention can effectively remove aldehyde group-containing impurities in the intermediate. The method of the present invention has the advantages of simple operation, cheap raw materials and mild conditions, and is suitable for large-scale industrial production.Type: ApplicationFiled: December 28, 2021Publication date: March 21, 2024Applicants: ZHEJIANG HUAHAI PHARMACEUTICAL CO., LTD., Zhejiang Huahai LiCheng Pharmaceutical Co., Ltd.Inventors: Jian ZHANG, Jichao WANG, Xiangqian YOU, Liangwei QIAN, Tao ZHOU, Jiaxing HU, Wenfeng HUANG
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Publication number: 20240067788Abstract: Provided is a method for preparing a crosslinked polyvinyl chloride structure foamed material by using a physical foaming agent, comprising: melting and mixing a polyvinyl chloride resin, a modified resin, an isocyanate, an anhydride, a nucleating agent and a heat stabilizer to obtain a blank; immersing the blank into a foaming gas for foaming to obtain a foamed body; and subjecting the foamed body to crosslinking curing to obtain a crosslinked polyvinyl chloride structure foamed material. According to the present invention, the crosslinked polyvinyl chloride structure foamed material is prepared by means of a brand-new process route, and the composition and proportion of the PVC resin and other raw materials can be adjusted in a wide range; and carbon dioxide or nitrogen is used for foaming. Further provided is a crosslinked polyvinyl chloride structure foamed material.Type: ApplicationFiled: November 2, 2021Publication date: February 29, 2024Applicant: CHANGCHUN INSTITUTE OF APPLIED CHEMISTRY, CHINESE ACADEMY OF SCIENCEInventors: Tao TANG, Jiangan YOU, Zhiwei JIANG, Jian XUE, Hanqing JIANG, Jian QIU, Haiping XING, Minggang LI
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Publication number: 20240071849Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
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Publication number: 20240066522Abstract: An apparatus for forming a plurality of microdroplets from a droplet includes a substrate, a dielectric layer on the substrate and having a plurality of hydrophilic surface regions spaced apart from each other by a hydrophobic surface, and a plurality of electrodes covered by the dielectric layer. The electrodes are configured to form an electric field across the droplet in response to voltages provided by a control circuit to move the droplet across the dielectric layer in a lateral direction while leaving portions of the droplet on the hydrophilic surface regions to form the plurality of microdroplets on the hydrophilic surface regions.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Inventors: Jian Gong, Liang Wang, Yan-You Lin, Cheng Frank Zhong
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Patent number: 11869700Abstract: An inductor device includes first trace, second trace, third trace, fourth trace, first capacitor, and second capacitor. One terminal of each of the at least two sub-traces of first trace are coupled to each other at first node. One terminal of each of the at least two sub-traces of second trace are coupled to each other at second node. One terminal of third trace is coupled to second trace, and another terminal of third trace is coupled to first input/output terminal. One terminal of fourth trace is coupled to first trace, and another terminal of fourth trace is coupled to second input/output terminal. First capacitor is coupled to first node and second node. Second capacitor is coupled between first node and first input/output terminal, or coupled between first node and second input/output terminal, or coupled between first input/output terminal and second input/output terminal.Type: GrantFiled: September 9, 2020Date of Patent: January 9, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Jian-You Chen, Ka-Un Chan
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Publication number: 20230050926Abstract: A radio frequency apparatus includes a power amplifier circuit, a signal coupling circuit, an extraction circuit, and a harmonic filter circuit. The power amplifier circuit is configured to amplify a differential signal to output a to-be-filtered signal. The signal coupling circuit includes a primary side inductor and a secondary side inductor. The signal coupling circuit is configured to convert the to-be-filtered signal received by the primary side inductor into a single-ended signal outputted from the secondary side inductor. The extraction circuit has a center tap. The extraction circuit is configured to inductively couple to the primary side inductor and output a common mode signal from the center tap. The harmonic filter circuit is configured to perform a harmonic filtering on the single-ended signal according to the common mode signal, such that the secondary side inductor of the signal coupling circuit outputs a filtered signal.Type: ApplicationFiled: August 11, 2022Publication date: February 16, 2023Applicant: REALTEK SEMICONDUCTOR CORP.Inventors: Hung-Han CHEN, Hsiao-Tsung YEN, Jian-You CHEN, Po-Chih WANG
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Patent number: 11406526Abstract: This invention provides devices and systems and methods therefrom for properly controlling negative pressure applied to oral cavity, facilitating breathing and treating sleep apnea and snoring. The systems comprise a negative pressure system providing a vacuum source and an oral device comprising a shield, a tube passing through the shield, a flexible negative pressure deliverable part connected to the shield or the tube, an optional tongue protector, where the negative pressure deliverable part is conformable to the contour of the upper palate. Negative pressure is delivered to the front and back zones inside the oral cavity via the negative pressure deliverable part to eliminate air space in the oral cavity.Type: GrantFiled: January 13, 2014Date of Patent: August 9, 2022Assignee: Somnics, Inc.Inventors: Chung-Chu Chen, Yin-Ruei Chen, Ming-Jian You, Wen-Yen Huang
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Publication number: 20220076872Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a first node. The second trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a second node. The capacitor is coupled to the firs node and the second node.Type: ApplicationFiled: November 14, 2021Publication date: March 10, 2022Inventors: Hsiao-Tsung Yen, Jian-You Chen, Ka-Un Chan
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Patent number: 11246742Abstract: This invention provides devices and systems and methods therefrom for properly controlling negative pressure applied to oral cavity, facilitating breathing and treating sleep apnea and snoring. The systems comprise a negative pressure system providing a vacuum source and an oral device comprising a shield, a tube passing through the shield, a flexible negative pressure deliverable part connected to the shield or the tube, an optional tongue protector, where the negative pressure deliverable part is conformable to the contour of the upper palate. Negative pressure is delivered to the front and back zones inside the oral cavity via the negative pressure deliverable part to eliminate air space in the oral cavity.Type: GrantFiled: January 10, 2014Date of Patent: February 15, 2022Inventors: Chung-Chu Chen, Yin-Ruei Chen, Ming-jian You, Wen-Yen Huang
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Publication number: 20210358681Abstract: A transformer device includes a first coil, a second coil, and a third coil. The first coil includes a first ring structure, a second ring structure, a first connecting portion, and a first terminal, in which the first terminal is arranged on the first connecting portion and is located at a central location between the first ring structure and the second ring structure, the first terminal is connected to the first ring structure through the first connecting portion in a first direction, and connected to the second ring structure through the first connecting portion in a second direction, and the first direction is the opposite of the second direction. The second coil is configured to couple the first ring structure. The third coil is configured to couple the second ring structure, in which the second coil and the third coil have the same structure.Type: ApplicationFiled: May 6, 2021Publication date: November 18, 2021Inventors: HSIAO-TSUNG YEN, JIAN-YOU CHEN, KA-UN CHAN
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Patent number: 11095324Abstract: A wireless transmission circuit includes a first induction circuit, a second induction circuit, a detection circuit, a first signal adjustment circuit, and a third induction circuit. The first induction circuit is configured to receive a first signal outputted from a power amplifier. The second induction circuit is configured to output the received first signal as a second signal. The detection circuit is configured to detect a common mode signal associated with the first signal. The first signal adjustment circuit is configured to adjust a phase or an amplitude of the common mode signal to generate a third signal. The third induction circuit is configured to receive the third signal and be coupled to the second induction circuit to reduce a second harmonic in the second signal.Type: GrantFiled: March 13, 2020Date of Patent: August 17, 2021Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Jian-You Chen, Hsiao-Tsung Yen, Beng-Meng Chen
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Publication number: 20210074465Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a first node. The second trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a second node. The capacitor is coupled to the firs node and the second node.Type: ApplicationFiled: September 8, 2020Publication date: March 11, 2021Inventors: Hsiao-Tsung YEN, Jian-You CHEN, Ka-Un CHAN
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Publication number: 20210074466Abstract: An inductor device includes first trace, second trace, third trace, fourth trace, first capacitor, and second capacitor. One terminal of each of the at least two sub-traces of first trace are coupled to each other at first node. One terminal of each of the at least two sub-traces of second trace are coupled to each other at second node. One terminal of third trace is coupled to second trace, and another terminal of third trace is coupled to first input/output terminal. One terminal of fourth trace is coupled to first trace, and another terminal of fourth trace is coupled to second input/output terminal. First capacitor is coupled to first node and second node. Second capacitor is coupled between firs node and first input/output terminal, or coupled between first node and second input/output terminal, or coupled between first input/output terminal and second input/output terminal.Type: ApplicationFiled: September 9, 2020Publication date: March 11, 2021Inventors: Hsiao-Tsung YEN, Jian-You CHEN, Ka-Un CHAN
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Publication number: 20210044309Abstract: A wireless transmission circuit includes a first induction circuit, a second induction circuit, a detection circuit, a first signal adjustment circuit, and a third induction circuit. The first induction circuit is configured to receive a first signal outputted from a power amplifier. The second induction circuit is configured to output the received first signal as a second signal. The detection circuit is configured to detect a common mode signal associated with the first signal. The first signal adjustment circuit is configured to adjust a phase or an amplitude of the common mode signal to generate a third signal. The third induction circuit is configured to receive the third signal and be coupled to the second induction circuit to reduce a second harmonic in the second signal.Type: ApplicationFiled: March 13, 2020Publication date: February 11, 2021Inventors: Jian-You CHEN, Hsiao-Tsung YEN, Beng-Meng CHEN
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Patent number: 10504812Abstract: A heating-cooling module is disposed on an electronic component and includes a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer. The heat-dissipation element is arranged over the electronic component. The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element. The heater is arranged over the electronic component, in which the heater and the heat-dissipation element are located above the same side of the electronic component, and the heater and the heat-dissipation element are separated from each other. The second thermal conductive layer is arranged between the electronic component and the heater and is separated from the first thermal conductive layer.Type: GrantFiled: December 20, 2018Date of Patent: December 10, 2019Assignee: Chicony Electronics Co., Ltd.Inventor: Jih-Jian You
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Patent number: 10483937Abstract: A transceiver circuit including: a substrate; a signal coupler configured on the substrate and including a coiled first conductive layer pattern; and a notch filter configured on the substrate and including a coiled second conductive layer pattern; wherein each of the first conductive layer pattern and the second conductive layer pattern is arranged as a substantially symmetrical pattern with respect to a first virtual axis.Type: GrantFiled: September 27, 2018Date of Patent: November 19, 2019Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Jian-You Chen, Cheng-Wei Luo, Kuan-Yu Shih
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Patent number: 10343202Abstract: The present invention discloses a method for synchronously processing dual belt materials. The method comprises steps of feeding, processing, detecting, assembling and outputting finished products. The step of feeding materials comprises cleaning, dividing materials, positioning and feeding. The step of assembling comprises pushing and assembling. A dual-belt-material feeder is used for feeding, and a dual-belt-material mold is used for punching. The dual-belt-material feeder (1) comprises a moving feeding device (11), a fixed feeding device (13) and two guide frames (14). The dual-belt-material mold comprises two punching molds. The beneficial effects of the method for synchronously processing dual belt materials are that: the method can be used for producing thin wall miniature assembly parts in a single line and assembling the thin wall miniature assembly parts on line, so that problems caused by that the thin wall miniature assembly parts are produced in two production lines can be avoided.Type: GrantFiled: May 25, 2016Date of Patent: July 9, 2019Assignee: CHENGDU HOMIN TECHNOLOGY CO., LTD.Inventors: Daojun Sun, Guofu Tian, Jian You, Yan Zhuang, Jiazhen Gong, Junjie Guo, Zhouyan Wang
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Publication number: 20190165751Abstract: A transceiver circuit including: a substrate; a signal coupler configured on the substrate and including a coiled first conductive layer pattern; and a notch filter configured on the substrate and including a coiled second conductive layer pattern; wherein each of the first conductive layer pattern and the second conductive layer pattern is arranged as a substantially symmetrical pattern with respect to a first virtual axis.Type: ApplicationFiled: September 27, 2018Publication date: May 30, 2019Inventors: JIAN-YOU CHEN, CHENG-WEI LUO, KUAN-YU SHIH
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Patent number: 10256716Abstract: A voltage feed-forward circuit, a multiplier using the voltage feed-forward circuit, and a power factor correction circuit using the multiplier. The voltage feed-forward circuit is used to maintain and output a peak voltage (Vff) of an input voltage (Vin), and includes first switch element (S1), a logic control unit (U1), a second switch element (S2), a first capacitor (C1), a third switch element (S3) and a second capacitor (C2). The first control signal (?1) and the second control signal (?2) begin to be provided at the same time, and the first control signal (?1) stops being provided when a voltage of the second end of the first capacitor (C1) is greater than the peak voltage (Vff) of the input voltage (Vin).Type: GrantFiled: January 25, 2016Date of Patent: April 9, 2019Assignee: COSEMITECH (SHANGHAI) CO., LTD.Inventors: Jian You, Xiaoping Yin