Patents by Inventor Jian You
Jian You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190165751Abstract: A transceiver circuit including: a substrate; a signal coupler configured on the substrate and including a coiled first conductive layer pattern; and a notch filter configured on the substrate and including a coiled second conductive layer pattern; wherein each of the first conductive layer pattern and the second conductive layer pattern is arranged as a substantially symmetrical pattern with respect to a first virtual axis.Type: ApplicationFiled: September 27, 2018Publication date: May 30, 2019Inventors: JIAN-YOU CHEN, CHENG-WEI LUO, KUAN-YU SHIH
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Patent number: 10256716Abstract: A voltage feed-forward circuit, a multiplier using the voltage feed-forward circuit, and a power factor correction circuit using the multiplier. The voltage feed-forward circuit is used to maintain and output a peak voltage (Vff) of an input voltage (Vin), and includes first switch element (S1), a logic control unit (U1), a second switch element (S2), a first capacitor (C1), a third switch element (S3) and a second capacitor (C2). The first control signal (?1) and the second control signal (?2) begin to be provided at the same time, and the first control signal (?1) stops being provided when a voltage of the second end of the first capacitor (C1) is greater than the peak voltage (Vff) of the input voltage (Vin).Type: GrantFiled: January 25, 2016Date of Patent: April 9, 2019Assignee: COSEMITECH (SHANGHAI) CO., LTD.Inventors: Jian You, Xiaoping Yin
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Patent number: 10171035Abstract: The present invention disclosure provides a multiplier and a power factor correction circuit which the multiplier is applied. The multiplier comprises a Gilbert multiplier circuit comprising a first differential input stage, a second differential input stage and an output stage; a first differential voltage conversion circuit; a second differential voltage conversion circuit; and a bias current generating circuit; Wherein said output stage comprises: a current mirror unit comprising two current input terminals and a current output terminal; and a feedback control unit configured to ensure that the current output terminal does not output current when the voltage difference received by the multiplier is zero. The present invention is advantageous in improving the linearity of the multiplier and the accuracy of the output current of the multiplier output current.Type: GrantFiled: January 25, 2016Date of Patent: January 1, 2019Assignee: COSEMITECH (SHANGHAI) CO., LTD.Inventors: Xiaoping Yin, Jian You
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Patent number: 10071413Abstract: The present invention discloses a device for assembling products in a die. The device comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9) wherein the pushing block (11) is connected with the pushing spring (10), the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is arranged above the assembling male die (5) in wedge-shaped connection and both of them are arranged in the lower die base (2), the assembling wedge (6) is arranged above the transmission wedge (4) in wedge-shaped connection while in contact.Type: GrantFiled: May 25, 2016Date of Patent: September 11, 2018Assignee: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Guofu Tian, Jian You, Zhouyan Wang, Yan Zhuang, Bin Teng, Yi Guo
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Patent number: 10071412Abstract: The present invention discloses a method for assembling products in a die by the aid of a device for assembling products in a die. The device for assembling products in the die comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9), wherein the pushing block (11) is connected with the pushing spring (10), and the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is in wedge-shaped connection with the assembling male die (5), and the transmission wedge (4) and the assembling male die (5) are arranged in a lower base (2).Type: GrantFiled: May 25, 2016Date of Patent: September 11, 2018Assignee: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Junjie Guo, Guofu Tian, Jian You, Yan Zhuang, Yi Guo, Bin Teng
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Patent number: 9914111Abstract: The present invention relates to a mercury-containing wastewater treatment technology field, in particular to an attapulgite-crosslinked chitosan composite adsorbent and its solid-phase synthetic method. The attapulgite-crosslinked chitosan composite mercury adsorbent in the invention is synthesized by the method of adding chitosan and glutaraldehyde in batches. In consideration of the limited solubility of chitosan, batch addition can not only dissolve chitosan, but also minimize the use of organic acid, resulting in less discharge of wastewater and waste gas, which is suitable for large-scale industrial production. The prepared mercury adsorbent can be applied to the removal of mercury ions in the wastewater owing to the excellent adsorptive property and regeneration performance. Meanwhile, the solid-phase synthetic procedure for preparing the mercury adsorbent is simple, easy to handle and environmental-friendly. Moreover, the product cost is greatly reduced due to the use of attapulgite.Type: GrantFiled: March 17, 2017Date of Patent: March 13, 2018Assignees: Wuhu Gefeng Green Technology Research Center Co., Ltd., Shandong Wuzhou Detection Co., Ltd.Inventors: Xiangdong Feng, Menglu Shi, Wengui Zhang, Huanghe Wu, Weiwei Liang, Zhifeng Lan, Jian You, Changlu Zhang
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Publication number: 20180013341Abstract: A voltage feed-forward circuit, a multiplier using the voltage feed-forward circuit, and a power factor correction circuit using the multiplier. The voltage feed-forward circuit is used to maintain and output a peak voltage (Vff) of an input voltage (Vin), and includes first switch element (S1), a logic control unit (U1), a second switch element (S2), a first capacitor (C1), a third switch element (S3) and a second capacitor (C2). The first control signal (?1) and the second control signal (?2) begin to be provided at the same time, and the first control signal (?1) stops being provided when a voltage of the second end of the first capacitor (C1) is greater than the peak voltage (Vff) of the input voltage (Vin).Type: ApplicationFiled: January 25, 2016Publication date: January 11, 2018Inventors: Jian You, Xiaoping Yin
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Publication number: 20170373640Abstract: The present invention disclosure provides a multiplier and a power factor correction circuit which the multiplier is applied. The multiplier comprises a Gilbert multiplier circuit comprising a first differential input stage, a second differential input stage and an output stage; a first differential voltage conversion circuit; a second differential voltage conversion circuit; and a bias current generating circuit; Wherein said output stage comprises: a current mirror unit comprising two current input terminals and a current output terminal; and a feedback control unit configured to ensure that the current output terminal does not output current when the voltage difference received by the multiplier is zero. The present invention is advantageous in improving the linearity of the multiplier and the accuracy of the output current of the multiplier output current.Type: ApplicationFiled: January 25, 2016Publication date: December 28, 2017Inventors: Xiaoping YIN, Jian YOU
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Publication number: 20170216903Abstract: The present invention discloses a device for assembling products in a die. The device comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9) wherein the pushing block (11) is connected with the pushing spring (10), the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is arranged above the assembling male die (5) in wedge-shaped connection and both of them are arranged in the lower die base (2), the assembling wedge (6) is arranged above the transmission wedge (4) in wedge-shaped connection while in contact.Type: ApplicationFiled: May 25, 2016Publication date: August 3, 2017Applicant: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Guofu TIAN, Jian YOU, Zhouyan WANG, Yan ZHUANG, Bin TENG, Yi GUO
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Publication number: 20170216898Abstract: The present invention discloses a method for synchronously processing dual belt materials. The method comprises steps of feeding, processing, detecting, assembling and outputting finished products. The step of feeding materials comprises cleaning, dividing materials, positioning and feeding. The step of assembling comprises pushing and assembling. A dual-belt-material feeder is used for feeding, and a dual-belt-material mould is used for punching. The dual-belt-material feeder (1) comprises a moving feeding device (11), a fixed feeding device (13) and two guide frames (14). The dual-belt-material mould comprises two punching moulds. The beneficial effects of the method for synchronously processing dual belt materials are that: the method can be used for producing thin wall miniature assembly parts in a single line and assembling the thin wall miniature assembly parts on line, so that problems caused by that the thin wall miniature assembly parts are produced in two production lines can be avoided.Type: ApplicationFiled: May 25, 2016Publication date: August 3, 2017Applicant: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Daojun SUN, Guofu TIAN, Jian YOU, Yan ZHUANG, Jiazhen GONG, Junjie GUO, Zhouyan WANG
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Publication number: 20170209913Abstract: The present invention discloses a method for assembling products in a die by the aid of a device for assembling products in a die. The device for assembling products in the die comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9), wherein the pushing block (11) is connected with the pushing spring (10), and the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is in wedge-shaped connection with the assembling male die (5), and the transmission wedge (4) and the assembling male die (5) are arranged in a lower base (2).Type: ApplicationFiled: May 25, 2016Publication date: July 27, 2017Applicant: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Junjie GUO, Guofu TIAN, Jian YOU, Yan ZHUANG, Yi GUO, Bin TENG
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Publication number: 20170203925Abstract: The present invention discloses a dual-band-material conveying device which comprises a material distributing device (4), a feeding device (5) and a conveying line (6). The material distributing device (4) comprises an adjusting plate (44), two limiting pillars (41) and a material distributing pillar (43). The adjusting plate (44) is mounted on the conveying line (6) through a mounting pillar (45), the adjusting plate (44) is provided with an adjusting groove (42) in which the two limiting pillars (41) and the material distributing pillar (43) are mounted. The conveying line (6) is provided with a pit, and the feeding device (5) is mounted in the pit. The feeding device (5) comprises a movable feeding device body (51), a fixed feeding device body (53) and two guide frames (54). The movable feeding device body (51) and the fixed feeding device body (53) are mounted between the two guide frames (54).Type: ApplicationFiled: May 25, 2016Publication date: July 20, 2017Applicant: CHENGDU HOMIN TECHNOLOGY CO., LTDInventors: Junjie GUO, Ke PENG, Guofu TIAN, Lin ZHAO, Jian YOU, Zhouyan WANG, Liang YU
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Publication number: 20150342778Abstract: This invention provides devices and systems and methods therefrom for properly controlling negative pressure applied to oral cavity, facilitating breathing and treating sleep apnea and snoring. The systems comprise a negative pressure system providing a vacuum source and an oral device comprising a shield, a tube passing through the shield, a flexible negative pressure deliverable part connected to the shield or the tube, an optional tongue protector, where the negative pressure deliverable part is conformable to the contour of the upper palate. Negative pressure is delivered to the front and back zones inside the oral cavity via the negative pressure deliverable part to eliminate air space in the oral cavity.Type: ApplicationFiled: January 10, 2014Publication date: December 3, 2015Inventors: Chung-Chu Chen, Yin-Ruei Chen, Ming-jian You, Wen-Yen Huang
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Publication number: 20140296836Abstract: The present invention provides methods and compositions for the nanotechnology-based therapy of one or more mammalian diseases. Disclosed are gold-in-porous silicon nanoassemblies that are effective in the targeted and localized treatment of one or more human hyperproliferative disorders, including, for example, cancer of the breast. Methods of systemic administration of these nanoassembly vectors are disclosed that facilitate direct thermal ablative therapy of selected tissues using a localized application of near-infrared energy to the target site, wherein the gold-in-porous silicon nanoparticles release heat to destroy the surrounding cancerous tissue.Type: ApplicationFiled: March 27, 2014Publication date: October 2, 2014Applicants: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM, THE METHODIST HOSPITAL RESEARCH INSTITUTEInventors: Haifa SHEN, Mauro Ferrari, Chun Li, Jian You
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Patent number: 8811541Abstract: A signal demodulation module is disclosed. The signal demodulation module includes an injection-locked oscillator, an envelope detector and a data slicer. The injection-locked oscillator has a central oscillating frequency equal to a frequency of a digital modulation signal received, and outputs a phase-locked oscillating signal which is in phase to the digital modulation signal. When input phase of the digital modulation signal changes, output phase of the injection-locked oscillator changes synchronously. The envelope detector is used for detecting an envelope line of the phase-locked oscillating signal and outputting an envelope signal accordingly. The data slicer is used for receiving the envelop signal and outputting a first digital signal according to a reference voltage and the envelop signal.Type: GrantFiled: March 11, 2013Date of Patent: August 19, 2014Assignee: National Taiwan UniversityInventors: Yi-Lin Tsai, Jian-You Chen, Bang-Cyuan Wang, Tsung-Hsien Lin
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Publication number: 20140190489Abstract: This invention provides devices and systems and methods therefrom for properly controlling negative pressure applied to oral cavity, facilitating breathing and treating sleep apnea and snoring. The systems comprise a negative pressure system providing a vacuum source and an oral device comprising a shield, a tube passing through the shield, a flexible negative pressure deliverable part connected to the shield or the tube, an optional tongue protector, where the negative pressure deliverable part is conformable to the contour of the upper palate. Negative pressure is delivered to the front and back zones inside the oral cavity via the negative pressure deliverable part to eliminate air space in the oral cavity.Type: ApplicationFiled: January 13, 2014Publication date: July 10, 2014Applicant: Somnics, Inc.Inventors: Chung-Chu Chen, Yin-Ruei Chen, Ming-Jian You, Wen-Yen Huang
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Publication number: 20140161211Abstract: A signal demodulation module is disclosed. The signal demodulation module includes an injection-locked oscillator, an envelope detector and a data slicer. The injection-locked oscillator has a central oscillating frequency equal to a frequency of a digital modulation signal received, and outputs a phase-locked oscillating signal which is in phase to the digital modulation signal. When input phase of the digital modulation signal changes, output phase of the injection-locked oscillator changes synchronously. The envelope detector is used for detecting an envelope line of the phase-locked oscillating signal and outputting an envelope signal accordingly. The data slicer is used for receiving the envelop signal and outputting a first digital signal according to a reference voltage and the envelop signal.Type: ApplicationFiled: March 11, 2013Publication date: June 12, 2014Applicant: NATIONAL TAIWAN UNIVERSITYInventors: YI-LIN TSAI, JIAN-YOU CHEN, BANG-CYUAN WANG, TSUNG-HSIEN LIN
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Publication number: 20130105204Abstract: A circuit board and a method for manufacturing the same are disclosed. The circuit board of the present invention comprises: a carrier board, wherein a first circuit layer is disposed on at least one surface of the carrier board, and the first circuit layer comprises plural conductive pads; a protein dielectric layer disposed on the surface of the carrier board and the first circuit layer, wherein the protein dielectric layer has plural openings to expose the conductive pads; and a second circuit layer disposed on a surface of the protein dielectric layer, wherein the second circuit layer comprises plural first conductive vias, and each first conductive via is correspondingly formed in the opening and electrically connects to the conductive pad.Type: ApplicationFiled: March 12, 2012Publication date: May 2, 2013Applicant: National Tsing Hua UniversityInventors: Jenn-Chang HWANG, Chao-Ying HSIEH, Chwung-Shan KOU, Chung-Hwa WANG, Li-Shiuan TSAI, Lung-Kai MAO, Shih-Jie JIAN, Jian-You LIN, Chun-Yi LEE
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Patent number: 8309968Abstract: The present invention relates to a Schottky diode with a diamond rod, which comprises: a substrate with a gate layer formed thereon; a patterned insulating layer disposed on the gate layer, wherein the patterned insulating layer comprises a first contact region and a second contact region; a diamond rod disposed on the patterned insulating layer, wherein a first end of the diamond rod connects to the first contact region, and a second end of the diamond rod connects to the second contact region; a first electrode corresponding to the first contact region of the patterned insulating layer, and covering the first end of the diamond rod; and a second electrode corresponding to the second contact region of the patterned insulating layer, and covering the second end of the diamond rod, and a method for manufacturing the same.Type: GrantFiled: July 30, 2010Date of Patent: November 13, 2012Assignee: National Tsing Hua UniversityInventors: Jenn-Chang Hwang, Chwung-Shan Kou, Jian-You Lin
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Publication number: 20110318415Abstract: A near-infrared mediated drug delivery system comprising a plurality of microspheres made of polymeric material, each sphere containing a plurality of hollow gold nanospheres together with drug product, wherein upon NIR irradiation, the drug product is released from the microsphere.Type: ApplicationFiled: March 9, 2010Publication date: December 29, 2011Inventors: Chun Li, Jian You