Abstract: Disclosed are a method for fabricating an inductor with a vertical winding and an injection molding tooling thereof. The fabrication method includes: providing a conductive member that includes a connection piece, which includes a first surface and a second surface that are oppositely arranged, and a pillar on the first surface; injecting the magnetic material onto a side of the conductive member with the pillar, such that the magnetic material and the conductive member form an integrated structure; and cutting the connection piece to form the vertical winding. The injection molding tooling includes: an upper punch for stamping a magnetic material and a conductive member into an integrated structure, a molding cavity body surrounding a periphery of a pillar of the conductive member, and a lower punch for bearing a connection piece of the conductive member.

Abstract: A high-precision current detection method for current detection in a current loop with at least two protection switches. The method includes: arranging a sampling bridge arm which are connected in parallel on at least one protection switch. The sampling bridge arm comprises at least one current sampling switch and at least one signal processing unit which are connected in series, the current sampling switches are at least two connected in parallel and/or at least two corresponding protection switches are connected in parallel; the current sampling switch obtains a current sampling signal Is by using a mirror current method; and the signal processing unit generates a protection switch current signal Ip according to the current sampling signal Is.

Abstract: A heat dissipation structure of a high-power chip power supply module is provided. The heat dissipation structure comprises a first motherboard, a second motherboard, a high-power chip module, a power supply module and a top heat dissipation device. The power supply module comprises at least one heating power component. The power supply module is provided with a heat dissipation surface. The heating power component is arranged adjacent to the heat dissipation surface. The heat dissipation structure further comprises a vapor chamber and a longitudinal thermal conductor. The vapor chamber is in thermal conduction with the heat dissipation face, and the vapor chamber is in thermal conduction with the top heat dissipation device through the longitudinal thermal conductor.

Abstract: The present disclosure provides an assembly structure for providing power for a chip and the assembly includes: a board; a chip, provided with at least one electrical energy input terminal; and a first power converting module, provided with at least one power output terminal, wherein the first power converting module is electrically connected to the chip, converts a first electrical energy to a second electrical energy, and supplies the second electrical energy through the at least one power output terminal to the at least one electrical energy input terminal of the chip, and a back plate; wherein the back plate and the chip are provided at two opposite sides of the board; wherein the board, the chip and the first power converting module are stacked and the first power converting module is at least partially inserted in the back plate.

Abstract: The application discloses a wafer-level power module and a manufacturing method thereof. The wafer-level power module comprises a wafer and a passive element, the wafer comprises a wafer functional area, and the wafer functional area is located on the first surface of the wafer; the passive element comprises at least one power pin, the passive element is stacked on the second surface of the wafer, the wafer functional area is electrically connected to the second surface of the wafer from the first surface of the wafer through a conductive path and is electrically connected with the power pin of the passive element, and the conductive path is attached to the wafer.

Abstract: The invention provides a power supply module with high heat dissipation capability and high reliability. Aiming at the problem that when a power supply module and a system board are fixedly welded, internal welding spots are remelted due to high temperature, on one hand, the structure of the power supply module is further optimized, a device layer is formed in a device in the power supply module through plastic packaging or embedded, an insulating dielectric layer is arranged between the two adjacent device layers, and the device layer and the insulating medium are laminated into an assembly body; the metal interconnection layer is arranged on the surface of the assembly body, and electrical connection between devices in the power supply module is achieved; and no metal welding spot exists in the power supply module, and the assembly reliability of the power supply module and the system is improved.

Abstract: Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

Abstract: A high-heat-dissipation high-frequency power module including an embedded circuit board, at least two semiconductor power devices, at least one high-frequency capacitor, and an insulating heat-conducting material is provided. Power electrodes of the at least two semiconductor power devices are connected in series to form at least one power conversion bridge arm. A ratio of the area of the overlapping projections of the power electrodes' wiring of the semiconductor power devices led out from the surface of the embedded circuit board, and the area of the semiconductor power devices is 60% or more. A power conversion bridge arm is connected in parallel to the high-frequency capacitor nearby so as to realize a low-loop inductance interconnection.

Abstract: A high-frequency high-power density module power supply including a carrier element is provided. At least one surface of the carrier element is provided with a surface power pin, and a flexible and rigid combination assembly. The flexible and rigid combination assembly comprises at least one rigid part and at least one flexible part, the at least one rigid part comprises a power semiconductor assembly, and the rigid part is electrically connected to the flexible part. At least one part of the flexible and rigid combination assembly is electrically connected to the surface power pin of the carrier element. The flexible and rigid combination assembly is bent by using the surface of the carrier element as a carrier. The rigid part and the flexible part are connected by means of the same flexible component.

Abstract: A power supply system includes a system board, a load and a power module, the power module includes a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, wherein the first package and the load are configured to be provided on an upper surface of the system board, the second package is stacked on an upper side of the load, and the bridge member is stacked on upper sides of the first package and the second package.

Abstract: A power conversion device is provided. The power conversion device is applied to a circuit topology and layout of the six-switch flying capacitor voltage reduction type conversion circuit which is applied to the intermediate bus converter. The layout of the transformer and the inductor is provided, so that the parasitic resistance of the winding in the magnetic core assembly is minimum. An auxiliary switch and an auxiliary winding are additionally arranged on the six-switch flying capacitor voltage reduction type conversion circuit, and the auxiliary switch and the auxiliary winding are used for providing enough energy for the output end when the input voltage is lower than four times of the output voltage. A switch layout is provided to reduce parasitic parameters and power losses of a transformer winding AC loop, and parasitic parameters and power losses on the switch bridge arm path.

Abstract: The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

Abstract: A power conversion device and a magnetic assembly are provided. The power conversion device and the magnetic assembly are applied to a circuit topology aiming at the application of an input voltage to an output voltage high-voltage-reduction ratio. The circuit topology has low switching loss and high conversion efficiency in a high-frequency switching occasion of a power switch. The device layout setting of the power conversion device and the winding mode of the transformer are provided, the size of the power conversion device is reduced, and the steady-state performance and the dynamic performance of the conversion device are improved.

Abstract: A high-integration-level carrier plate includes at least two prefabricated printed circuit board lamination layers, at least one hollowed-out area is formed in the printed circuit board lamination layer, the hollowed-out areas are embedded in the carrier plate, the printed circuit board lamination layers are fixedly connected through an insulating bonding dielectric layer and are electrically connected through at least one bonding material piece, and at least one power supply circuit assembly is arranged in the hollowed-out area; the printed circuit board lamination layer comprises at least a part of windings, and the windings and the magnetic cores are used for forming magnetic elements in the power supply circuit assembly through mutual cooperation.

Abstract: A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.

Abstract: According to the six-switch flying capacitor voltage buck-type conversion circuit and the four-switch flying capacitor voltage buck-type conversion circuit applied to the intermediate bus converter, further optimization is provided. On one hand, a power conversion device is provided, the voltage peak of the switch is absorbed by optimizing the clamping circuit and the layout thereof, the voltage stress of the switch is reduced, no extra loss is generated, and the conversion efficiency of the power conversion device is improved. On the other hand, by optimizing the current sampling circuit, the monitoring and control performance related to the current is optimized, and the size of the power conversion device is reduced.

Abstract: A high-frequency high-power packaging module comprises at least one power conversion bridge arm, at least one high-frequency capacitor, a circuit layer, an insulating heat-conducting plate, and a plastic package body. The front surface of the semiconductor power device is electrically connected with the first surface of the circuit layer, and the back surface of the semiconductor power device is thermally connected with or electrically connected with the lower surface of the insulating heat-conducting plate. The high-frequency capacitor is electrically connected with the first surface of the circuit layer or the second surface of the circuit layer or the lower surface of the insulating heat-conducting plate, and at least one electrode of the high-frequency capacitor is electrically connected with at least one electrode of the at least one semiconductor power device through the inner-layer electric connection layer.

Abstract: A wireless charging method includes: (a) providing a charging device, wherein the charging device includes at least one charging region for a smart device to place thereon, the charging device is configured to charge the smart device when executing a charging task, the charging task includes at least one charging subtask, and the charging device is configured to detect whether there is a detection object on the charging region when executing a detection task, and the detection task includes a plurality of detection subtasks; (b) executing a charging initialization program and a communication initialization program; and (c) executing the plurality of detection subtasks and at least one charging subtask, wherein the at least one charging subtask is interspersed and executed among the plurality of detection subtasks.

Abstract: The application discloses a power conversion device. The power conversion device comprises a transformer assembly, a switch, an output capacitor and a driving unit, and the conversion efficiency of the power conversion device is optimized; On the other hand, the application discloses a layout of the power conversion device; The layout comprises a transformer area, a switch area, an output capacitor area and a port area layout, and the conversion efficiency of the power conversion device is further improved through reasonable layout; and on the other hand, the application discloses a current sampling scheme suitable for the power conversion device is disclosed, and a control pin is multiplexed in a time-sharing mode, so that comprehensive detection and monitoring of the current of the power conversion device and the current sharing function of the plurality of power conversion devices in parallel application are achieved.