Patents by Inventor JianHong Zeng

JianHong Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200312792
    Abstract: The present disclosure provides a semiconductor chip including a functional area, a first end, a second end, a third end, and a connecting portion. The functional area has first and second sides opposite to each other. The first end is disposed on the first side and the third end is disposed on the first side, wherein the semiconductor chip is switched on or off according to the drive signal received between the third end and the first end, and the connecting portion is disposed on the first side of the functional area and connected to the first end and the third end, wherein when the temperature rises above the a first temperature, the connecting portion is in a conductive state, and when the temperature drops to be not higher than a third temperature, the connecting portion is in an insulated state.
    Type: Application
    Filed: March 12, 2020
    Publication date: October 1, 2020
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu HONG, Shili WU, Ganyu ZHOU, Yuan GAO, Jinshan SHI, Jianhong ZENG
  • Publication number: 20200303326
    Abstract: A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.
    Type: Application
    Filed: March 16, 2020
    Publication date: September 24, 2020
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Jianhong ZENG, Yan CHEN, Le LIANG, Xiaoni XIN
  • Publication number: 20200286980
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.
    Type: Application
    Filed: November 21, 2019
    Publication date: September 10, 2020
    Inventors: Bau-Ru Lu, Jianhong Zeng, Chun Hsien Lu
  • Patent number: 10734976
    Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: August 4, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Peiqing Hu, Jianhong Zeng, Haoyi Ye
  • Publication number: 20200227205
    Abstract: Disclosed are a method for fabricating an inductor with a vertical winding and an injection molding tooling thereof. The fabrication method includes: providing a conductive member that includes a connection piece, which includes a first surface and a second surface that are oppositely arranged, and a pillar on the first surface; injecting the magnetic material onto a side of the conductive member with the pillar, such that the magnetic material and the conductive member form an integrated structure; and cutting the connection piece to form the vertical winding. The injection molding tooling includes: an upper punch for stamping a magnetic material and a conductive member into an integrated structure, a molding cavity body surrounding a periphery of a pillar of the conductive member, and a lower punch for bearing a connection piece of the conductive member.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 16, 2020
    Inventors: Pengkai JI, Shouyu HONG, Jinping ZHOU, Min ZHOU, Jianhong ZENG, Zhenqing ZHAO
  • Publication number: 20200219647
    Abstract: Provided are an inversely coupled inductor and a power module. The inversely coupled inductor includes a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. The power supply module includes the above inversely coupled inductor, which is in turn stacked on, and electrically connected to, the packaged chip module. By arranging the two windings to cross with each other on the outside of the first passage of the magnetic core, the same type terminal (such as input pins or output pins) of the inversely coupled inductor can be located on the same side.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Jinping ZHOU, Shouyu HONG, Jianhong ZENG
  • Publication number: 20200219846
    Abstract: A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Xiaoni XIN, Yan CHEN, Qingdong CHEN, Shouyu HONG, Jianhong ZENG, Zhenqing ZHAO
  • Publication number: 20200219648
    Abstract: Provided are a coupled inductor and a power module including the coupled inductor. A coupled inductor includes: a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. Another coupled inductor includes: a magnetic core, a first winding and a second winding, where the magnetic core has a first passage and a second passage in parallel, both run through the magnetic core from one end face thereof to another opposite end face, where the first winding and the second winding both penetrate the first passage and the second passage, such that differently-named terminals of the windings are located on the same end face of the magnetic core.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Jinping ZHOU, Shouyu HONG, Jianhong ZENG, Mingzhun ZHANG, Min ZHOU
  • Publication number: 20200204078
    Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Jianhong ZENG, Haoyi YE, Xiaoni XIN, Siyu HE, Xinjian ZOU
  • Patent number: 10685895
    Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 16, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Pengkai Ji, Shouyu Hong, Zhenqing Zhao, Jianhong Zeng
  • Publication number: 20200161042
    Abstract: A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 21, 2020
    Inventors: Chaofeng CAI, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Xiaoni XIN
  • Publication number: 20200143985
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first metal winding and a second metal winding. A first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from the outside to the inside; the first metal winding is formed on the first wiring layer and winded around the magnetic core in a foil structure; the first insulating layer is at least partially covered by the first metal winding; a second metal winding is formed on the second wiring layer and winded around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and is at least partially covered by the first metal winding.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 7, 2020
    Inventors: Chaofeng CAI, Xiaoni XIN, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Jinping ZHOU, Zhiheng FU, Min ZHOU, YU-CHING KUO, TONG-SHENG PAN, WEN-YU LIN
  • Publication number: 20200143984
    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.
    Type: Application
    Filed: October 15, 2019
    Publication date: May 7, 2020
    Inventors: Shouyu HONG, Jianping YING, Jianhong ZENG, Chaofeng CAI, Ganyu ZHOU, Pengkai JI
  • Patent number: 10630181
    Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: April 21, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Jianhong Zeng, Haoyi Ye, Xiaoni Xin, Siyu He, Xinjian Zou
  • Patent number: 10629550
    Abstract: A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: April 21, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Jianhong Zeng, Yan Chen, Le Liang, Xiaoni Xin
  • Patent number: 10615702
    Abstract: A control method of a power converter including a first stage converter and a second stage converter is provided. The first stage converter converts an input voltage into an intermediate voltage. The second stage converter converts the intermediate voltage into an output voltage to power a load. If a loading amount of the load is larger than a first threshold value, the intermediate voltage is adjusted to increase a voltage difference between the intermediate voltage and the output voltage, so that a change of the intermediate voltage is in a negative correlation with a change of the loading amount. If the loading amount is smaller than a second threshold value, the intermediate voltage remains be unchanged or the intermediate voltage is adjusted, so that the change of the intermediate voltage is in positive correlation with the change of the loading amount.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 7, 2020
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Yu Zhang, Haoyi Ye, Jianhong Zeng
  • Patent number: 10608549
    Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: March 31, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Jianhong Zeng, Xiaoni Xin
  • Publication number: 20190393789
    Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.
    Type: Application
    Filed: September 4, 2019
    Publication date: December 26, 2019
    Inventors: Jianhong Zeng, Haoyi Ye, Peiqing Hu, Pengkai Ji
  • Patent number: 10511176
    Abstract: The present disclosure provides a power converter, including: a pre-stage circuit, configured to receive an input voltage and convert the input voltage to a bus voltage; and plurality of post-stage circuits, connected in parallel to an output terminal of the pre-stage circuit, and configured to receive the bus voltage from the pre-stage circuit and each converts the bus voltage to an output voltage. The power converter provided by the present disclosure can effectively solve the problems of isolation and the wide range of operating voltage, and can take both of high efficiency and high power density into consideration.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: December 17, 2019
    Assignee: Delta Electronics, Inc.
    Inventors: Jianhong Zeng, Peiqing Hu, Haoyi Ye, Yan Chen, Jiale Dai, Ziying Zhou
  • Publication number: 20190379362
    Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.
    Type: Application
    Filed: August 22, 2019
    Publication date: December 12, 2019
    Inventors: Peiqing Hu, Jianhong Zeng, Haoyi Ye