Abstract: A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.

Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

Abstract: A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first metal winding and a second metal winding. A first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from the outside to the inside; the first metal winding is formed on the first wiring layer and winded around the magnetic core in a foil structure; the first insulating layer is at least partially covered by the first metal winding; a second metal winding is formed on the second wiring layer and winded around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and is at least partially covered by the first metal winding.

Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.

Abstract: A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.

Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.

Abstract: A control method of a power converter including a first stage converter and a second stage converter is provided. The first stage converter converts an input voltage into an intermediate voltage. The second stage converter converts the intermediate voltage into an output voltage to power a load. If a loading amount of the load is larger than a first threshold value, the intermediate voltage is adjusted to increase a voltage difference between the intermediate voltage and the output voltage, so that a change of the intermediate voltage is in a negative correlation with a change of the loading amount. If the loading amount is smaller than a second threshold value, the intermediate voltage remains be unchanged or the intermediate voltage is adjusted, so that the change of the intermediate voltage is in positive correlation with the change of the loading amount.

Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.

Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

Abstract: The present disclosure provides a power converter, including: a pre-stage circuit, configured to receive an input voltage and convert the input voltage to a bus voltage; and plurality of post-stage circuits, connected in parallel to an output terminal of the pre-stage circuit, and configured to receive the bus voltage from the pre-stage circuit and each converts the bus voltage to an output voltage. The power converter provided by the present disclosure can effectively solve the problems of isolation and the wide range of operating voltage, and can take both of high efficiency and high power density into consideration.

Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.

Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; and a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit, wherein the bonding part is made from an insulated material with cohesiveness, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel, and wherein side surfaces of the two power chips are naked except the portions contacting the bonding part.

Abstract: A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard, including: a preceding-stage power supply, located on a mainboard, and configured to receive a first DC voltage and to provide a second DC voltage, wherein the first DC voltage is greater than the second DC voltage; and a first post-stage power supply and a second post-stage power supply, located on the mainboard, to receive the second DC voltage, the first post-stage power supply is disposed at a first side of the chip, the second post-stage power supply is disposed at a second side of the chip, the first post-stage power supply provides a third DC voltage to the chip, the second DC voltage is greater than the third DC voltage, the second post-stage power supply provides a fourth DC voltage to the chip, and the second DC voltage is greater than the fourth DC voltage.

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit; and a sealing layer isolating the power chip unit on the substrate from surroundings to seal the power chip unit; the bonding part and the sealing layer are made from different insulated material, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel.

Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.