Patents by Inventor Jiann-Tyng Tzeng

Jiann-Tyng Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220382956
    Abstract: An integrated circuit with mixed poly pitch cells with a plurality of different pitch sizes is disclosed. The integrated circuit includes: at least a minimum unit each with at least a first number of first poly pitch cells with a first pitch size, and a second number of second poly pitch cells with a second pitch size, the first pitch size PP is different from the second pitch size PP1, the greatest common divisor of the first pitch size PP and the second pitch size PP1 is GCD, wherein GCD is an integer greater than 1; a gate length of the first pitch size is Lg; a gate length of the second pitch size is Lg1; Lg and Lg1 are capable of being extended to achieve G-bias for power and speed optimization of the minimum unit and the integrated circuit.
    Type: Application
    Filed: July 31, 2022
    Publication date: December 1, 2022
    Inventors: Shih-Wei Peng, Lipen Yuan, Jiann-Tyng Tzeng, Wei-Cheng Lin
  • Patent number: 11515197
    Abstract: A semiconductor device includes: a substrate; an ion-implanted silicon layer disposed in the substrate; a first insulator layer disposed over the ion-implanted silicon layer; an active device disposed over the first insulator layer; and a conductive via configured to penetrate the first insulator layer for coupling the ion-implanted silicon layer and the active device.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: November 29, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng
  • Patent number: 11515308
    Abstract: An IC structure includes first and second cell rows extending in a first direction. The first cell row includes first cells each including one or more first fins having first source/drain regions of a first conductivity type and one or more second fins having second source/drain regions of a second conductivity type opposite the first conductivity type. The second cell row includes second cells each including one or more third fins having third source/drain regions of the first conductivity type and one or more fourth fins having fourth source/drain regions of the second conductivity type. The first cells have a same first number of the one or more first fins, and the second cells have a same second number of the one or more third fins less than the first number of the one or more first fins.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: November 29, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kam-Tou Sio, Jiann-Tyng Tzeng
  • Publication number: 20220374577
    Abstract: A method (of forming a semiconductor device) including forming cell regions (in alternating first and second rows having first and second heights) including forming a majority of the cell regions in the first rows including: limiting a height of the majority of the cell regions to be single-row cell regions that span corresponding single one of the first rows but do not extend therebeyond; and forming a minority of the cell regions correspondingly in at least the first rows including reducing widths of the multi-row cell regions to be smaller than comparable single-row cell regions; and expanding heights of the minority of the cell regions to be multi-row cell regions, each of the multi-row cell regions spanning a corresponding single first row and at least a corresponding second row such that cell region densities of the second rows are at least about forty percent.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 24, 2022
    Inventors: Wei-Cheng LIN, Hui-Ting YANG, Jiann-Tyng TZENG, Lipen YUAN, Wei-An LAI
  • Publication number: 20220367460
    Abstract: An integrated circuit (IC) device includes a first plurality of active areas extending in a first direction and having a first pitch in a second direction perpendicular to the first direction, and a second plurality of active areas extending in the first direction, offset from the first plurality of active areas in the first direction, and having a second pitch in the second direction. A ratio of the second pitch to the first pitch is 3:2.
    Type: Application
    Filed: October 26, 2021
    Publication date: November 17, 2022
    Inventors: Yu-Xuan HUANG, Shih-Wei PENG, Te-Hsin CHIU, Hou-Yu CHEN, Kuan-Lun CHENG, Jiann-Tyng TZENG
  • Publication number: 20220367240
    Abstract: A semiconductor device includes a buried metal line disposed in a semiconductor substrate, a first dielectric material on a first sidewall of the buried metal line and a second dielectric material on a second sidewall of the buried metal line, a first multiple fins disposed proximate the first sidewall of the buried metal line, a second multiple fins disposed proximate the second sidewall of the buried metal line, a first metal gate structure over the first multiple fins and over the buried metal line, wherein the first metal gate structure extends through the first dielectric material to contact the buried metal line, and a second metal gate structure over the second multiple fins and over the buried metal line.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 17, 2022
    Inventors: Lei-Chun Chou, Chih-Liang Chen, Jiann-Tyng Tzeng, Chih-Ming Lai, Ru-Gun Liu, Charles Chew-Yuen Young
  • Publication number: 20220367324
    Abstract: A method of manufacturing a semiconductor device, including: forming a plurality of first metal strips extending in a first direction on a first plane; and forming a plurality of second metal strips extending in the first direction on a second plane over the first plane by executing a photolithography operation with a single mask, wherein a first second metal strip (FIG. 1, 131) is disposed over a first first metal strip; wherein the first first metal strip and the first second metal strip are directed to a first voltage source; wherein a distance between the first second metal strip and a second second metal strip immediate adjacent to the first second metal strip is greater than a distance between the second second metal strip and a third second metal strip immediate adjacent to the second second metal strip.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Inventors: SHIH-WEI PENG, CHIA-TIEN WU, JIANN-TYNG TZENG
  • Publication number: 20220358275
    Abstract: One aspect of this description relates to a method for operating an integrated circuit (IC) manufacturing system. The method includes placing a first nano-sheet structure within a IC layout diagram. The first nano-sheet structure has a first width. The method includes abutting a second nano-sheet structure with the first nano-sheet structure. The second nano-sheet structure has a second width. The second width is less than the first width. The method includes generating and storing the IC layout diagram in a storage device.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Wei-An Lai, Wei-Cheng Lin, Yan-Hao Chen, Jiann-Tyng Tzeng, Lipen Yuan, Hui-Zhong Zhuang, Yu-Xuan Huang
  • Publication number: 20220359512
    Abstract: Exemplary embodiments for an exemplary dual transmission gate and various exemplary integrated circuit layouts for the exemplary dual transmission gate are disclosed. These exemplary integrated circuit layouts represent double-height, also referred to as double rule, integrated circuit layouts. These double rule integrated circuit layouts include a first group of rows from among multiple rows of an electronic device design real estate and a second group of rows from among the multiple rows of the electronic device design real estate to accommodate a first metal layer of a semiconductor stack. The first group of rows can include a first pair of complementary metal-oxide-semiconductor field-effect (CMOS) transistors, such as a first p-type metal-oxide-semiconductor field-effect (PMOS) transistor and a first n-type metal-oxide-semiconductor field-effect (NMOS) transistor, and the second group of rows can include a second pair of CMOS transistors, such as a second PMOS transistor and a second NMOS transistor.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei PENG, Hui-Zhong ZHUANG, Jiann-Tyng TZENG, Li-Chun TIEN, Pin-Dai SUE, Wei-Cheng LIN
  • Patent number: 11495687
    Abstract: The present disclosure describes various non-planar semiconductor devices, such as fin field-effect transistors (finFETs) to provide an example, having one or more metal rail conductors and various methods for fabricating these non-planar semiconductor devices. In some situations, the one or more metal rail conductors can be electrically connected to gate, source, and/or drain regions of these various non-planar semiconductor devices. In these situations, the one or more metal rail conductors can be utilized to electrically connect the gate, the source, and/or the drain regions of various non-planar semiconductor devices to other gate, source, and/or drain regions of various non-planar semiconductor devices and/or other semiconductor devices. However, in other situations, the one or more metal rail conductors can be isolated from the gate, the source, and/or the drain regions these various non-planar semiconductor devices.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: November 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kuo-Cheng Chiang, Ru-Gun Liu, Wei-Hao Wu, Yi-Hsiung Lin, Chia-Hao Chang, Lei-Chun Chou
  • Publication number: 20220352079
    Abstract: An integrated circuit includes conductive rails that are disposed in a first conductive layer and separated from each other in a layout view, signal rails disposed in a second conductive layer different from the first conductive layer, at least one first via coupling a first signal rail of the signal rails to at least one of the conductive rails, and at least one first conductive segment. The first signal rail transmits a supply signal through the at least one first via and the at least one of the conductive rails to at least one element of the integrated circuit. The at least one first via and the at least one first conductive segment are disposed above first conductive layer. The at least one first conductive segment is coupled to the at least one of the conductive rails and is separate from the first signal rail.
    Type: Application
    Filed: July 19, 2022
    Publication date: November 3, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Wei PENG, Chia-Tien WU, Jiann-Tyng TZENG
  • Publication number: 20220352148
    Abstract: A monolithic three dimensional integrated circuit is provided. The monolithic three dimensional integrated circuit includes a first cell layer having a first cell having a first active component of the monolithic three dimensional integrated circuit. A second layer having a second cell including a second active component. The second cell layer is formed vertically above the first cell layer. The first cell layer having the first active component and the second cell layer having the second active component are formed on a single die. The first cell has a smaller metal pitch than the second cell. A buried via electrically couples the first active component of the first cell of the first cell layer with the second active component of the second cell of the second cell layer.
    Type: Application
    Filed: April 30, 2021
    Publication date: November 3, 2022
    Inventors: Kam-Tou Sio, Jiann-Tyng Tzeng, Shih-Wei Peng
  • Publication number: 20220344258
    Abstract: A monolithic three-dimensional (3D) integrated circuit (IC) device includes a lower tier including a lower tier cell and an upper tier arranged over the lower tier. The upper tier has a first upper tier cell and a second upper tier cell separated by a predetermined lateral space. A monolithic inter-tier via (MIV) extends from the lower tier through the predetermined lateral space, and the MIV has a first end electrically connected to the lower tier cell and a second end electrically connected to the first upper tier cell.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 27, 2022
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng, Kam-Tou Sio, Wei-Cheng Lin, Wei-An Lai
  • Publication number: 20220344263
    Abstract: A method of making an integrated circuit includes steps of etching an opening in an insulating mask to expose a first dummy contact on a backside of the integrated circuit, depositing a conductive material into the opening, the conductive material contacting a sidewall of the first dummy contact, and recessing the conductive material to expose an end of the first dummy contact. The method also includes steps of depositing an insulating material over the conductive material in the opening, removing the first dummy contact from the insulating mask to form a first contact opening, and forming a first conductive contact in the first contact opening, the first conductive contact being electrically connected to the conductive material.
    Type: Application
    Filed: April 27, 2021
    Publication date: October 27, 2022
    Inventors: Shih-Wei PENG, Te-Hsin CHIU, Wei-An LAI, Ching-Wei TSAI, Jiann-Tyng TZENG
  • Publication number: 20220344255
    Abstract: Apparatus and methods for generating a physical layout for a high density routing circuit are disclosed. An exemplary semiconductor structure includes: a gate structure; a plurality of first metal lines formed in a first dielectric layer below the gate structure; at least one first via formed in a second dielectric layer between the gate structure and the first dielectric layer; a plurality of second metal lines formed in a third dielectric layer over the gate structure; and at least one second via formed in a fourth dielectric layer between the gate structure and the third dielectric layer. Each of the at least one first via is electrically connected to the gate structure and a corresponding one of the plurality of first metal lines. Each of the at least one second via is electrically connected to the gate structure and a corresponding one of the plurality of second metal lines.
    Type: Application
    Filed: April 27, 2021
    Publication date: October 27, 2022
    Inventors: Wei-An Lai, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng
  • Patent number: 11482473
    Abstract: A semiconductor device, including a first metal strip extending in a first direction on a first plane; a second metal strip extending in the first direction on a second plane over the first metal strip; a third metal strip immediate adjacent to the second metal strip and extending in the first direction on the second plane; and a fourth metal strip immediate adjacent to the third metal strip and extending in the first direction on the second plane; wherein the first metal strip and the second metal strip are directed to a first voltage source; wherein a distance between the second metal strip and the third metal strip is greater than a distance between the third metal strip and the fourth metal strip.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: October 25, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Wei Peng, Chia-Tien Wu, Jiann-Tyng Tzeng
  • Publication number: 20220336458
    Abstract: In some embodiments, a method of making a semiconductor device includes forming a recess in a first region of a first dielectric material, the first dielectric material at least partially embedding a semiconductor region, the recess having a first surface portion separated by a distance in a first direction from the semiconductor region by a portion of the first dielectric material; depositing a second dielectric material in the recess to form a second surface portion oriented at an oblique angle from the first surface portion; and depositing a conductive material in the recess.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 20, 2022
    Inventors: Te-Hsin Chiu, Shih-Wei Peng, Meng-Hung Shen, JIann-Tyng Tzeng
  • Publication number: 20220335193
    Abstract: Generating a circuit layout is provided. A circuit layout associated with a circuit is received. A parallel pattern recognition is performed on the circuit layout. Performing the parallel pattern recognition includes determining that there is a parallel pattern in the circuit layout. In response to determining that there is a parallel pattern in the circuit layout, a cell swap for a first cell associated with the parallel pattern with a second cell is performed. After the cell swap for the first cell, engineering change order routing is performed to connect the second cell in the circuit layout. An updated circuit layout having the second cell is provided.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 20, 2022
    Inventors: Shih-Wei Peng, Kam-Tou Sio, Jiann-Tyng Tzeng
  • Publication number: 20220336354
    Abstract: Apparatus and methods for back side routing a data signal in a semiconductor device are described. In one example, a described semiconductor cell structure includes: a dummy device region at a front side of the semiconductor cell structure; a metal layer including a plurality of metal lines at a back side of the semiconductor cell structure; a dielectric layer formed between the dummy device region and the metal layer; an inner metal disposed within the dielectric layer; at least one first via that is formed through the dielectric layer and electrically connects the inner metal to the plurality of metal lines at the back side; and at least one second via that is formed in the dielectric layer and physically coupled between the inner metal and the dummy device region at the front side.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 20, 2022
    Inventors: Shih-Wei PENG, Wei-Cheng LIN, Jiann-Tyng TZENG
  • Publication number: 20220336261
    Abstract: A method of forming a semiconductor device includes forming a wafer having an ion-implanted silicon layer, wherein the ion-implanted silicon layer is disposed between a first insulator layer and a second insulator layer inside the wafer; forming an active region over the ion-implanted silicon layer; forming an active device in the active region; and forming a conductive via to couple the ion-implanted silicon layer and the active device.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: SHIH-WEI PENG, WEI-CHENG LIN, JIANN-TYNG TZENG