Patents by Inventor Jiann-Tyng Tzeng

Jiann-Tyng Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375851
    Abstract: A layout method and a layout system are disclosed. The layout method includes generating a design data comprising an electronic circuit, and generating a design layout by placing a first cell corresponding to the electronic circuit. The first cell includes a first source/drain region, a second source/drain region and a gate electrode, wherein the gate electrode define an odd-numbered track and an even-numbered track. The first cell also includes a first power rail, a first conductive via within the odd-numbered track, a second power rail and a second conductive via within the even-numbered track. The first source/drain region is electrically connected to the first power rail through the first conducive via, and the second source/drain region is electrically connected to the second power rail through the second conducive via.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: SHIH-WEI PENG, JIANN-TYNG TZENG
  • Publication number: 20210375761
    Abstract: In an embodiment, a method of forming a structure includes forming a first transistor and a second transistor over a first substrate; forming a front-side interconnect structure over the first transistor and the second transistor; etching at least a backside of the first substrate to expose the first transistor and the second transistor; forming a first backside via electrically connected to the first transistor; forming a second backside via electrically connected to the second transistor; depositing a dielectric layer over the first backside via and the second backside via; forming a first conductive line in the dielectric layer, the first conductive line being a power rail electrically connected to the first transistor through the first backside via; and forming a second conductive line in the dielectric layer, the second conductive line being a signal line electrically connected to the second transistor through the second backside via.
    Type: Application
    Filed: December 18, 2020
    Publication date: December 2, 2021
    Inventors: Shang-Wen Chang, Yi-Hsun Chiu, Cheng-Chi Chuang, Ching-Wei Tsai, Wei-Cheng Lin, Shih-Wei Peng, Jiann-Tyng Tzeng
  • Publication number: 20210374315
    Abstract: A method of forming an IC device includes creating a recess by removing at least a portion of a channel of a first transistor and a portion of a gate electrode, the gate electrode being common to the first transistor and an underlying second transistor. The method includes filling the recess with a dielectric material to form an isolation layer, and constructing a slot via overlying the isolation layer.
    Type: Application
    Filed: August 5, 2021
    Publication date: December 2, 2021
    Inventors: Shih-Wei PENG, Guo-Huei WU, Wei-Cheng LIN, Hui-Zhong ZHUANG, Jiann-Tyng TZENG
  • Publication number: 20210366844
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a plurality of gate structures arranged over a substrate and between adjacent ones of a plurality of source/drain regions within the substrate. A plurality of conductive contacts are electrically coupled to the plurality of source/drain regions. A first interconnect wire is arranged over the plurality of conductive contacts, and a second interconnect wire arranged over the first interconnect wire. A via rail contacts the first interconnect wire and the second interconnect wire. The via rail has an outer sidewall that faces an outermost edge of the plurality of source/drain regions and that is laterally separated from the outermost edge of the plurality of source/drain regions by a non-zero distance. The outer sidewall of the via rail continuously extends past two or more of the plurality of gate structures.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Inventors: Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Ru-Gun Liu, Wen-Hao Chen
  • Publication number: 20210357565
    Abstract: A method of generating an IC layout diagram includes abutting a first row of cells with a second row of cells along a border, the first row including first and second active sheets, the second row including third and fourth active sheets, the active sheets extending along a row direction and having width values. The active sheets are overlapped with first through fourth back-side via regions, the first active sheet width value is greater than the third active sheet width value, a first back-side via region width values is greater than a third back-side via region width value, and a value of a distance from the first active sheet to the border is less than a minimum spacing rule for metal-like defined regions. At least one of abutting the first row with the second row or overlapping the active sheets with the back-side via regions is performed by a processor.
    Type: Application
    Filed: January 13, 2021
    Publication date: November 18, 2021
    Inventors: Shang-Wei FANG, Kam-Tou SIO, Wei-Cheng LIN, Jiann-Tyng TZENG, Lee-Chung LU, Yi-Kan CHENG, Chung-Hsing WANG
  • Patent number: 11171089
    Abstract: A method of manufacturing a semiconductor device including the operations of defining a first metal pattern (MX-1) having a first metal pattern pitch (MX-1P); depositing an insulating layer over the first metal pattern; defining a core grid having a plurality of core locations having a coreX pitch (CoreXP) on the insulating layer; removing predetermined portions of the insulating layer to form a plurality of core openings through a predetermined set of the core locations; and elongating the core openings using a directional etch (DrE) to form expanded core openings that are used to form the next metal layer MX pattern.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: November 9, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin
  • Publication number: 20210343698
    Abstract: A semiconductor device includes a cell. The cell includes an active area, gates, at least one gate via and at least one contact via. The active area includes forbidden regions. The gates are disposed across the active area. The at least one gate via is coupled with one of the gates. The at least one contact via is coupled with at least one conductive segment each corresponding to a source/drain of a transistor. In a layout view, one of the forbidden regions abuts a region of an abutted cell in which at least one of a gate via or a contact via of the abutted cell is disposed. In a layout view, the least one of the at least one gate via or the at least one contact via is arranged within the active area and outside of the forbidden regions. A method is also disclosed herein.
    Type: Application
    Filed: December 28, 2020
    Publication date: November 4, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei PENG, Jiann-Tyng TZENG
  • Publication number: 20210343744
    Abstract: An integrated circuit includes a set of power rails on a back-side of a substrate, a first flip-flop, a second flip-flop and a third flip-flop. The set of power rails extend in a first direction. The first flip-flop includes a first set of conductive structures extending in the first direction. The second flip-flop abuts the first flip-flop at a first boundary, and includes a second set of conductive structures extending in the first direction. The third flip-flop abuts the second flip-flop at a second boundary, and includes a third set of conductive structures extending in the first direction. The first, second and third flip-flop are on a first metal layer and are on a front-side of the substrate opposite from the back-side. The second set of conductive structures are offset from the first boundary and the second boundary in a second direction.
    Type: Application
    Filed: February 25, 2021
    Publication date: November 4, 2021
    Inventors: Te-Hsin CHIU, Wei-Cheng LIN, Wei-An LAI, Jiann-Tyng TZENG
  • Publication number: 20210343645
    Abstract: An integrated circuit includes a strip structure having a front side and a back side. A gate structure is on the front side of the strip structure. The integrated circuit includes a plurality of channel layers above the front side of the strip structure, wherein each of the plurality of channel layers is enclosed within the gate structure. An isolation structure surrounds the strip structure. The integrated circuit includes a backside via in the isolation structure. An epitaxy structure is on the front side of the strip structure. The integrated circuit includes a contact over the epitaxy structure. The contact has a first portion on a first side of the epitaxy structure. The first portion of the contact extends into the isolation structure and contacts the backside via. The integrated circuit includes a backside power rail on the back side of the strip structure and contacting the backside via.
    Type: Application
    Filed: January 5, 2021
    Publication date: November 4, 2021
    Inventors: Shih-Wei PENG, Wei-Cheng LIN, Cheng-Chi CHUANG, Jiann-Tyng TZENG
  • Publication number: 20210343650
    Abstract: An IC package includes a first die including a front side and a back side, the front side including a first signal routing structure, the back side including a first power distribution structure, and a second die including a front side and a back side, the front side including a second signal routing structure, the back side including a second power distribution structure. The IC package includes a third power distribution structure positioned between the first and second power distribution structures and electrically connected to each of the first and second power distribution structures.
    Type: Application
    Filed: February 17, 2021
    Publication date: November 4, 2021
    Inventors: Shih-Wei PENG, Te-Hsin CHIU, Jiann-Tyng TZENG
  • Publication number: 20210343697
    Abstract: A method generating the layout diagram includes: selecting gate patterns for which a first distance from a corresponding VG pattern to a corresponding cut-gate section is equal to or greater than a first reference value; and for each of the selected gate patterns, increasing a size of the corresponding cut-gate section from a first value to a second value; the second value resulting in a first type of overhang of a corresponding remnant portion of the corresponding gate pattern; and the first type of overhang being a minimal permissible amount of overhang of the corresponding remnant portion beyond the corresponding first or second nearest active area pattern. A result is that gaps between ends of corresponding ends of remnants of gate patters are expanded.
    Type: Application
    Filed: December 1, 2020
    Publication date: November 4, 2021
    Inventors: Te-Hsin CHIU, Shih-Wei PENG, Jiann-Tyng TZENG
  • Publication number: 20210334446
    Abstract: A device includes a first cell, a second cell, and first isolation portions. The second cell is adjacent the first cell. The first and second cells are arranged in a first direction, and the first cell includes first and second conductive structures. The first conductive structures extend in the first direction. Each of the first conductive structures has a first end facing the second cell. The second conductive structures extend in the first direction. The first and second conductive structures are alternately arranged in a second direction different from the first direction. The first isolation portions are respectively abutting the first ends of the first conductive structures. Two of the first isolation portions are misaligned with each other in the second direction.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 28, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Wei PENG, Chih-Ming LAI, Jiann-Tyng TZENG
  • Patent number: 11159164
    Abstract: An integrated circuit includes a first and a second active region, a first contact, a second contact and a first insulating layer. The first active region is in a substrate, extends in a first direction, and is located on a first level. The second active region is in the substrate, extends in the first direction, is located on the first level, and is separated from the first active region in a second direction. The first contact is coupled to the first and the second active region, extends in the second direction, is located on a second level, and overlaps the first and the second active region. The second contact extends in the second direction, overlaps the first contact, and is located on a third level. The first insulating layer extends in the second direction, and is between the second contact and the first contact.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 26, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Peng, Cheng-Chi Chuang, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin
  • Patent number: 11158580
    Abstract: The present disclosure describes a semiconductor structure having a power distribution network including first and second conductive lines. A substrate includes a first surface that is in contact with the power distribution network. A plurality of backside vias are in the substrate and electrically coupled to the first conductive line. A via rail is on a second surface of the substrate that opposes the first surface. A first interlayer dielectric is on the via rail and on the substrate. A second interlayer dielectric is on the first interlayer dielectric. A third interlayer dielectric is on the second interlayer dielectric. First and top interconnect layers are in the second and third interlayer dielectrics, respectively. Deep vias are in the third interlayer dielectric and electrically coupled to the via rail. The deep vias are also connected to the first and top interconnect layers. A power supply in/out layer is on the third interlayer dielectric and in contact with the top interconnect layer.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kam-Tou Sio, Cheng-Chi Chuang, Chia-Tien Wu, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-Cheng Lin
  • Patent number: 11152348
    Abstract: An integrated circuit structure includes: a first plurality of cell rows extending in a first direction, each of which has a first row height and comprises a plurality of first cells disposed therein; and a second plurality of cell rows extending in the first direction, each of which has a second row height different from the first row height and comprises a plurality of second cells disposed therein. The plurality of first cells comprises a first plurality of active regions each of which continuously extends across the plurality of first cells in the first direction, and wherein the plurality of second cells comprises a second plurality of active regions each of which continuously extends across the plurality of second cells in the first direction.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kam-Tou Sio, Jiann-Tyng Tzeng, Jack Liu, Yi-Chuin Tsai, Shang-Wei Fang, Sing-Kai Huang, Charles Chew-Yuen Young
  • Patent number: 11145678
    Abstract: A method for manufacturing a semiconductor device includes following operations. A substrate including an active area is received. A plurality of source/drain regions of a plurality of transistor devices are formed in the active area. An isolation region is inserted between two adjacent source/drain regions of two adjacent transistor devices. The isolation region and the two adjacent source/drain regions cooperatively form two diode devices electrically connected in a back to back manner.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: October 12, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jack Liu, Jiann-Tyng Tzeng, Chih-Liang Chen, Chew-Yuen Young, Sing-Kai Huang, Ching-Fang Huang
  • Publication number: 20210313263
    Abstract: A semiconductor device includes a base, source, drain and gate electrodes, signal tracks and a power mesh. The source, drain and gate electrodes are arranged on a surface of the base, wherein the gate electrodes are extended along a first direction. The signal tracks arranged above the first surface of the base and above the source and drain electrodes and the gate electrodes, wherein the signal tracks are extended along the first directions. A power mesh arranged below the first surface of the base, the power mesh comprising first power rails extended in the second direction and second power rails extended in a first direction, wherein the second direction is substantially perpendicular to the first direction.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 7, 2021
    Inventors: WEI-AN LAI, WEI-CHENG LIN, JIANN-TYNG TZENG
  • Publication number: 20210313268
    Abstract: In one embodiment, an integrated circuit includes a first pattern metal layer, a second pattern metal layer formed over the first pattern metal layer, wherein the second pattern metal layer comprises a second plurality of metal tracks extending in a first direction and less than 9, a third pattern metal layer disposed between the first pattern metal layer and the second pattern metal layer, the third pattern metal layer including, a first metal track segment, a second metal track segment shifted in a second direction from the first metal track segment, and a third metal track segment shifted in the second direction from the second metal track segment, wherein the second plurality of metal tracks, and at least a portion of each of the first metal track segment, the second metal track segment, and the third metal track segment are within a double cell height in the second direction.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 7, 2021
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng
  • Publication number: 20210313270
    Abstract: A semiconductor structure includes: a buried power rail disposed between a first fin structure and a second fin structure on a substrate extending in a first direction in a horizontal plane, the first fin structure located in a first cell, the second fin structure located in a second cell abutting the first cell at a boundary line extending in the first direction, the buried power rail providing a first voltage; and a metal one (M1) metal track disposed in a M1 layer extending in a second direction in the horizontal plane. At an intersection of the buried power rail and the M1 metal track, the semiconductor structure further includes an electrically conductive path to provide the first voltage to the M1 metal track, the electrically conductive path having a first metal zero (M0) metal track extending in the first direction over the boundary line.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 7, 2021
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng, Wei-Cheng Lin
  • Patent number: 11139245
    Abstract: In one embodiment, an integrated circuit includes a first pattern metal layer, a second pattern metal layer formed over the first pattern metal layer, wherein the second pattern metal layer comprises a second plurality of metal tracks extending in a first direction and less than 9, a third pattern metal layer disposed between the first pattern metal layer and the second pattern metal layer, the third pattern metal layer including, a first metal track segment, a second metal track segment shifted in a second direction from the first metal track segment, and a third metal track segment shifted in the second direction from the second metal track segment, wherein the second plurality of metal tracks, and at least a portion of each of the first metal track segment, the second metal track segment, and the third metal track segment are within a double cell height in the second direction.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng