Patents by Inventor Jianshe Bi

Jianshe Bi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package having side and bottom contact pads
    Patent number: 9362212
    Abstract: A packaged integrated circuit device includes a substrate module, leads, an IC die having first and second sets of die contact pads, and an encapsulant. The substrate module has upper and lower sets of conductive contacts on its upper and lower surfaces, respectively. The upper set of conductive contacts is electrically connected to the lower set of conductive contacts. The first set of die contact pads is electrically connected to the upper set of conductive contacts. The second set of die contact pads is electrically connected to the leads. Certain embodiments are a multi-form packaged device having both leads and conductive balls supporting different types of external connections, such as BGA and QFN.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: June 7, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Yanbo Xu, Jianshe Bi, Jinsheng Wang, Zhijie Wang, Fei Zong
  • Protective packaging for integrated circuit device
    Patent number: 9196557
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE
    Publication number: 20150332985
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Application
    Filed: November 26, 2014
    Publication date: November 19, 2015
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereof
    Patent number: 8859086
    Abstract: The present invention provides a bonded structure of a flexible circuit board of a touch screen for preventing overflow including a touch sensor panel having a flexible circuit board adhered thereon. The flexible circuit board and/or the touch sensor panel have a glue dam disposed thereon, and a length of the glue dam is larger than a width of the flexible circuit board. The bonded structure of the flexible circuit board of the touch screen for preventing overflow in the present invention disposes the glue dam at a position at the bonding area of the flexible circuit board bonded to the touch sensor panel to effectively reduce the overflow to a side of the flexible circuit board outside the touch sensor panel, and an appearance of the overflow and voids during bonding could be avoided.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: October 14, 2014
    Assignee: HannStar Display(Nanjing) Corp.
    Inventors: Xin Yi, Jianshe Bi
  • BONDED STRUCTURE OF TOUCH SCREEN WITH FLEXIBLE CIRCUIT BOARD FOR PREVENTING OVERFLOW AND BONDING METHOD THEREOF
    Publication number: 20120301656
    Abstract: The present invention provides a bonded structure of a flexible circuit board of a touch screen for preventing overflow including a touch sensor panel having a flexible circuit board adhered thereon. The flexible circuit board and/or the touch sensor panel have a glue dam disposed thereon, and a length of the glue dam is larger than a width of the flexible circuit board. The bonded structure of the flexible circuit board of the touch screen for preventing overflow in the present invention disposes the glue dam at a position at the bonding area of the flexible circuit board bonded to the touch sensor panel to effectively reduce the overflow to a side of the flexible circuit board outside the touch sensor panel, and an appearance of the overflow and voids during bonding could be avoided.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 29, 2012
    Inventors: Xin Yi, Jianshe Bi