Abstract: A data reader can be configured with at least a magnetically responsive lamination that has a first portion with a first stripe height from an air bearing surface (ABS) and a second portion with a different second stripe height from the ABS. The first portion can be constructed to have a back edge surface shaped at a predetermined angle relative to the ABS by a back edge feature.

Abstract: A magnetic element may generally be configured as a read head with at least a magnetic stack that contacts at least one magnetic shield. The magnetic shield can be positioned on top of a base lamination and have at least a predetermined anisotropy and magnetic coercivity corresponding to the base lamination.

Abstract: A data reader can be configured with at least a magnetically responsive lamination that has a first portion with a first stripe height from an air bearing surface (ABS) and a second portion with a different second stripe height from the ABS. The first portion can be constructed to have a back edge surface shaped at a predetermined angle relative to the ABS by a back edge feature.

Abstract: A magnetic element may generally be configured as a read head with at least a magnetic stack that contacts at least one magnetic shield. The magnetic shield can be positioned on top of a base lamination and have at least a predetermined anisotropy and magnetic coercivity corresponding to the base lamination.

Abstract: A magnetic element capable of reading data may generally be configured at least with a magnetic seed lamination disposed between a data reader stack and a magnetic shield. The magnetic seed lamination may be constructed at least with one magnetic layer coupled to the bottom shield and at least one non-magnetic layer decoupling the data reader stack from the at least one magnetic layer.

Abstract: A reconfigurable Wilkinson power divider, methods of manufacture and design structures are provided. The structure includes a first port, and a first arm and a second arm connected to the first port. The first arm and the second arm each include one or more tunable t-line circuits. The structure also includes a second port and a third port connected to the first port via the first arm and second arm, respectively.

Abstract: Systems and methods are provided for capturing mutual coupling effects between an integrated circuit chip and chip package using electronic design automation (EDA) tools. Specifically, a method is provided that is implemented in a computer infrastructure for designing an integrated circuit chip. The method includes compiling process technology parameters that describe electrical behavior for a chip-package coupling and a package of the integrated circuit chip. The method also includes generating a parasitic technology file to include the compiled process technology parameters.

Abstract: Systems and methods are provided for capturing mutual coupling effects between an integrated circuit chip and chip package using electronic design automation (EDA) tools. Specifically, a method is provided that is implemented in a computer infrastructure for designing an integrated circuit chip. The method includes compiling process technology parameters that describe electrical behavior for a chip-package coupling and a package of the integrated circuit chip. The method also includes generating a parasitic technology file to include the compiled process technology parameters.

Abstract: A reconfigurable Wilkinson power divider, methods of manufacture and design structures are provided. The structure includes a first port, and a first arm and a second arm connected to the first port. The first arm and the second arm each include one or more tunable t-line circuits. The structure also includes a second port and a third port connected to the first port via the first arm and second arm, respectively.

Abstract: A computer-implemented method of generating a library object for an integrated circuit design is disclosed. In one embodiment, the method includes: analyzing a pair of integrated circuit design objects for fringe capacitance effects between the pair of integrated circuit design objects; and generating the library object accounting for the fringe capacitance effects prior to completion of a layout design for the integrated circuit design.

Abstract: A computer-implemented method of generating a library object for an integrated circuit design is disclosed. In one embodiment, the method includes: analyzing a pair of integrated circuit design objects for fringe capacitance effects between the pair of integrated circuit design objects; and generating the library object accounting for the fringe capacitance effects prior to completion of a layout design for the integrated circuit design.

Abstract: A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silicon layer and a dielectric layer on a top side of the silicon layer. Additionally, the design structure includes a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer and a plurality of contacts in the dielectric layer in contact with the top-side interconnect. Further, the design structure includes a plurality of through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.

Abstract: A method for forming a through-silicon via bandpass filter includes forming a substrate comprising a silicon layer and providing a metal layer on a bottom side of the silicon layer. Additionally, the method includes providing a dielectric layer on a top side of the silicon layer and forming a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer. Further, the method includes forming a plurality of contacts in the dielectric layer in contact with the top-side interconnect and forming a plurality through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.

Abstract: A method for forming a through-silicon via bandpass filter includes forming a substrate comprising a silicon layer and providing a metal layer on a bottom side of the silicon layer. Additionally, the method includes providing a dielectric layer on a top side of the silicon layer and forming a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer. Further, the method includes forming a plurality of contacts in the dielectric layer in contact with the top-side interconnect and forming a plurality through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.

Abstract: A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silicon layer and a dielectric layer on a top side of the silicon layer. Additionally, the design structure includes a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer and a plurality of contacts in the dielectric layer in contact with the top-side interconnect. Further, the design structure includes a plurality of through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.