Abstract: The present application discloses a display panel. The display panel comprises a substrate and a plurality of pixel units disposed on the substrate, each of the plurality of pixel units comprises a plurality of sub-pixel units, each of the plurality of sub-pixel units comprises a light emitting layer, the plurality of sub-pixel units comprise at least one first type of sub-pixel unit, and the at least one first type of sub-pixel unit further comprises a first light processing layer, the first light processing layer comprises a light conversion layer and a light diffusion layer arranged as a laminated structure, and the first light processing layer is positioned at a side where a light emitting surface of the light emitting layer of the at least one first type of sub-pixel unit is located.

Abstract: The present disclosure provides a light conversion substrate and a manufacturing method thereof, and a display panel. The light conversion substrate may include a substrate having a first surface and a second surface arranged opposite to each other. A plurality of first grooves may be defined on the first surface of the substrate. A plurality of second grooves may be defined on the second surface of the substrate. The plurality of first grooves and the plurality of second grooves are arranged alternately. A first light conversion body may be arranged in each of the plurality of first grooves. A second light conversion body ma be arranged in each of the plurality of second grooves. In the present disclosure, light conversion materials may not interfere with each other during the manufacturing method, so that the present disclosure may be suitable for a display panel with high pixel density.

Abstract: Display panels and display devices, in order to provide a new full screen solution that can realize fingerprint recognition. The display panel includes a substrate, a display film layer located on a surface of the substrate and a touch film layer located above the display film layer. The display panel further includes a fingerprint recognition film layer including a plurality of image sensing elements arranged in an array, and an orthographic projection of the image sensing element on the substrate is not overlapped with an orthographic projection of the light-emitting sub-pixels in the display film layer on the substrate.

Abstract: A method for manufacturing an LED display device and an LED display device are provided. The method includes following operations. An LED array substrate and a conversion plate are provided. The LED array substrate includes a driving layer, a plurality of LED chips arranged in an array on a side of the LED array substrate having the driving layer. The conversion plate includes a substrate and a plurality of light conversion blocks, the plurality of light conversion blocks are spaced apart from each other and arranged on the substrate. A side of the conversion plate having the light conversion blocks is adhered with a side of the LED array substrate having the LED chips correspondingly, such that the light conversion blocks are arranged on corresponded top surfaces of the LED chips. The substrate is removed.

Abstract: A light emitting diode (LED) display device includes a plurality of pixel units. Each of the plurality of pixel units includes a red subpixel, a green subpixel, and a blue subpixel. The red subpixel is arranged with a first LED chip, the green subpixel is arranged with a second LED chip, and the blue subpixel is arranged with a third LED chip. The first LED chip is a blue LED chip or a green LED chip. The second LED chip is the green LED chip. The third LED chip is the blue LED chip. The red subpixel is further arranged with a red light conversion block arranged on the first LED chip.

Abstract: The present disclosure provides a display panel including a substrate; and a plurality of pixel units arranged on the substrate; wherein each of the plurality of pixel units includes a plurality of sub-pixel units including at least one first type of sub-pixel unit; each of the plurality of sub-pixel units includes a light emitting layer; the at least one first type of sub-pixel unit includes a first light processing layer; the first light processing layer includes at least a light diffusion material and a light conversion material mixed with each other; and the first light processing layer is located on a side of a light emitting surface of the light emitting layer at the at least one first type of sub-pixel unit. By the above-mentioned manner, the uniformity of light conversion by the light emitting layer may be improved, thereby the display effect of the display panel may be improved.

Abstract: The present disclosure relates to the field of display technologies, and a stretchable display device, a method for manufacturing the same, and an electronic device are disclosed. In the present disclosure, the device includes: a stretchable substrate, a stretchable wire and a plurality of rigid islands. The stretchable wire and the plurality of rigid islands are all arranged on the stretchable substrate. The plurality of rigid islands are spaced apart on the stretchable substrate, and a pixel encapsulation body is formed on the rigid island. The stretchable wire is connected to the pixel encapsulation body to form a power supply circuit for the pixel encapsulation body. The present disclosure realizes a reliable electrical connection condition, effective encapsulation and structural stability of light-emitting pixels under stretching conditions by connecting the light-emitting pixel that is separately encapsulated on each rigid island, to one another through the stretchable wire.

Abstract: The present disclosure relates to a light emitting device, a method for preparing the same and a display device. The light emitting device includes a cathode layer, a quantum dot light emitting layer, a hole injection layer and an anode layer which are laminated. The hole injection layer includes a complex metal oxide film comprising two metal oxides that is at least partially oxidated.

Abstract: The disclosure relates to a quantum dot light-emitting diode device and a manufacturing method and an apparatus thereof, which are used to alleviate the problem of interface quenching caused by the large density of the defect state of nanoparticles of the electron transport layer in the prior art. The method includes: dissolving a polyelectrolyte and nanoparticles having inorganic semiconductor properties to form a first mixed solution; depositing the first mixed solution on one surface of the formed quantum dot light-emitting layer to form an electron transport layer containing the polyelectrolyte and the nanoparticles. The end groups carried by at least a portion of the polyelectrolyte are capable of filling surface defects of the nanoparticles in the electron transport layer.

Abstract: An LED chip provided by an embodiment includes a first semiconductor layer; an active layer and a second semiconductor layer located sequentially on the first semiconductor layer. A first contact electrode extends through the active layer and the second semiconductor layer and is electrically connected to the first semiconductor layer; a second contact electrode is located on the second semiconductor layer and is electrically connected to the second semiconductor layer; a first extension electrode is located on the first contact electrode and is electrically connected to the first contact electrode, the first extension electrode comprises a plurality of concave spots for soldering; and a second extension electrode is located on the second contact electrode, electrically connected to the second contact electrode and isolated from the first extension electrode, and the second extension electrode includes a plurality of concave spots for soldering.

Abstract: A method for manufacturing a micro-LED display screen includes: forming an N-type GaN layer, a quantum-well light-emitting layer, and a P-type GaN layer on a sapphire substrate sequentially; etching the P-type GaN layer, the quantum-well light-emitting layer, and the N-type GaN layer from top to bottom, to form a first trench; forming an ITO layer on the surface of the P-type GaN layer, and etching the ITO layer to form a second trench; generating an N-type contact electrode in the first trench; generating a reflective electrode having a longitudinal cross-section in a shape with a wide upper side and a narrow lower side, respectively, on an upper surface of the N-type contact electrode and in the second trench; depositing an insulating layer on a surface of the micro-LED chip, and etching the insulating layer to expose the reflective electrodes; and soldering a driving circuit substrate to the reflective electrode.

Abstract: The present application discloses a driving backplane, a method for producing the same and a display device. The driving backplane includes: a substrate; a first insulating film layer disposed on the substrate and including a first region and a second region; an extended anode disposed on a side of the first region of the first insulating film layer, a height of the extended anode matching a height of a cathode of a light-emitting chip; and an extended cathode disposed on a side of the second region of the first insulating film layer, a height of the extended cathode matching a height of an anode of the light-emitting chip.

Abstract: The present disclosure discloses a stretchable display panel and a method of manufacturing the same. The stretchable display panel includes an elastic base layer and a number of array-distributed display units embedded in the elastic base layer. At least one of the display units include a pixel unit and a rigid protection body, and the rigid protection body includes at least a rigid sidewall disposed on at least one side of the pixel units.

Abstract: The present disclosure provides a light conversion substrate and a manufacturing method thereof, and a display panel. The light conversion substrate may include a substrate having a first surface and a second surface arranged opposite to each other. A plurality of first grooves may be defined on the first surface of the substrate. A plurality of second grooves may be defined on the second surface of the substrate. The plurality of first grooves and the plurality of second grooves are arranged alternately. A first light conversion body may be arranged in each of the plurality of first grooves. A second light conversion body ma be arranged in each of the plurality of second grooves. In the present disclosure, light conversion materials may not interfere with each other during the manufacturing method, so that the present disclosure may be suitable for a display panel with high pixel density.

Abstract: A light emitting diode (LED) display device includes a plurality of pixel units. Each of the plurality of pixel units includes a red subpixel, a green subpixel, and a blue subpixel. The red subpixel is arranged with a first LED chip, the green subpixel is arranged with a second LED chip, and the blue subpixel is arranged with a third LED chip. The first LED chip is a blue LED chip or a green LED chip. The second LED chip is the green LED chip. The third LED chip is the blue LED chip. The red subpixel is further arranged with a red light conversion block arranged on the first LED chip.

Abstract: The present application discloses a display panel. The display panel comprises a substrate and a plurality of pixel units disposed on the substrate, each of the plurality of pixel units comprises a plurality of sub-pixel units, each of the plurality of sub-pixel units comprises a light emitting layer, the plurality of sub-pixel units comprise at least one first type of sub-pixel unit, and the at least one first type of sub-pixel unit further comprises a first light processing layer, the first light processing layer comprises a light conversion layer and a light diffusion layer arranged as a laminated structure, and the first light processing layer is positioned at a side where a light emitting surface of the light emitting, layer of the at least one first type of sub-pixel unit is located.

Abstract: A method for manufacturing an LED display device and an LED display device are provided. The method includes following operations. An LED array substrate and a conversion plate are provided. The LED array substrate includes a driving layer, a plurality of LED chips arranged in an array on a side of the LED array substrate having the driving layer. The conversion plate includes a substrate and a plurality of light conversion blocks, the plurality of light conversion blocks are spaced apart from each other and arranged on the substrate. A side of the conversion plate having the light conversion blocks is adhered with a side of the LED array substrate having the LED chips correspondingly, such that the light conversion blocks are arranged on corresponded top surfaces of the LED chips. The substrate is removed.

Abstract: The present disclosure provides a display panel including a substrate; and a plurality of pixel units arranged on the substrate; wherein each of the plurality of pixel units includes a plurality of sub-pixel units including at least one first type of sub-pixel unit; each of the plurality of sub-pixel units includes a light emitting layer; the at least one first type of sub-pixel unit includes a first light processing layer; the first light processing layer includes at least a light diffusion material and a light conversion material mixed with each other; and the first light processing layer is located on a side of a light emitting surface of the light emitting layer at the at least one first type of sub-pixel unit. By the above-mentioned manner, the uniformity of light conversion by the light emitting layer may be improved, thereby the display effect of the display panel may be improved.

Abstract: The present disclosure relates to a light emitting device, a method for preparing the same and a display device. The light emitting device includes a cathode layer, a quantum dot light emitting layer, a hole injection layer and an anode layer which are laminated. The hole injection layer includes a complex metal oxide film comprising two metal oxides that is at least partially oxidated.

Abstract: The present disclosure relates to the field of display technologies, and a stretchable display device, a method for manufacturing the same, and an electronic device are disclosed. In the present disclosure, the device includes: a stretchable substrate, a stretchable wire and a plurality of rigid islands. The stretchable wire and the plurality of rigid islands are all arranged on the stretchable substrate. The plurality of rigid islands are spaced apart on the stretchable substrate, and a pixel encapsulation body is formed on the rigid island. The stretchable wire is connected to the pixel encapsulation body to form a power supply circuit for the pixel encapsulation body. The present disclosure realizes a reliable electrical connection condition, effective encapsulation and structural stability of light-emitting pixels under stretching conditions by connecting the light-emitting pixel that is separately encapsulated on each rigid island, to one another through the stretchable wire.