Abstract: Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate and related fabrication methods. The embedded capacitor can be coupled to a power distribution network (PDN) to provide decoupling capacitance to reduce current-resistance (IR) drop. The RDL substrate is disposed between the IC chip(s) and the package substrate to minimize distance between the embedded capacitor(s) and the IC chip(s) to reduce the parasitic inductance in the PDN, thus reducing PDN noise. With the RDL substrate disposed between the package substrate and the IC chip(s), the RDL substrate needs to support through-interconnections between the package substrate and the IC chip(s). In this regard, the RDL substrate includes an outer RDL layer adjacent to the IC chip(s) to support small pitch metal interconnects as well as provide fan-out capability.

Abstract: Provided are a preparation of semicarbazide-sensitive amine oxidase inhibitor and the use thereof. In particular, disclosed are a compound as shown in formula I, or a stereoisomer or racemate or pharmaceutically acceptable salt thereof. Also disclosed is that the above-mentioned compound can inhibit semicarbazide-sensitive amine oxidase.

Abstract: Provided are a JAK kinase inhibitor, preparation and use thereof. In particular, provided is a compound of Formula I, wherein each group is as described in the specification. The compound has an excellent JAK inhibitory activity, and therefore can be used to prepare pharmaceutical compositions for the treatment of cancer and other diseases related to JAK activity.

Abstract: The embodiments of the disclosure provide a method, apparatus, device and storage medium for presenting information, which relate to the technical field of computers. The method includes: obtaining object search information, in response to the object search information being object category information, determining a target object category corresponding to the object search information, and presenting object information of a plurality of target objects corresponding to the target object category in a search result presentation page; where all the plurality of target objects are different, and object information of a target object includes object attribute information and image resource information of the target object. By employing the above technical solution, when the user is searching the object category, object information of a plurality of target objects different from each other corresponding to the target object category is presented in the search result page.

Abstract: Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate and related fabrication methods. The embedded capacitor can be coupled to a power distribution network (PDN) to provide decoupling capacitance to reduce current-resistance (IR) drop. The RDL substrate is disposed between the IC chip(s) and the package substrate to minimize distance between the embedded capacitor(s) and the IC chip(s) to reduce the parasitic inductance in the PDN, thus reducing PDN noise. With the RDL substrate disposed between the package substrate and the IC chip(s), the RDL substrate needs to support through-interconnections between the package substrate and the IC chip(s). In this regard, the RDL substrate includes an outer RDL layer adjacent to the IC chip(s) to support small pitch metal interconnects as well as provide fan-out capability.

Abstract: An orthodontic appliance, includes comprising a main body portion, and a traction component, a transmission component and a position occupation component which are independently provided. The traction component is detachably connected to the main body portion and/or the transmission component, so as to achieve switching between a working state and a non-working state; the transmission component and the position occupation component are provided on the main body portion, the transmission component is transmittingly connected to the position occupation component, and the main body portion is provided with a groove; when an effective space of the groove needs to be changed, the traction component is transmittingly connected to the transmission component, so as to drive the position occupation component to at least partially enter or exit the or move in the groove along the width direction of the groove, so as to change the effective space of the groove.

Abstract: An orthodontic appliance includes a body portion, and a traction component, a transmission component and an occupying component which are independently provided, the body portion is provided with a slot and an open accommodating cavity communicated with the slot, and the traction component is detachably connected to the accommodating cavity and/or the transmission component; the accommodating cavity accommodates the transmission component, the occupying component is provided in the slot or is provided in the accommodating cavity and the slot, and the transmission component is transmittingly connected to the occupying component; the transmission component is provided with a transmission adaptation position configured to be transmittingly connected to a screwing tool, and the transmission component drives the occupying component to at least partially enter or exit the slot or move in the slot in a slot width direction, so as to change an effective space of the slot.

Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion, a second integrated device coupled to the first metallization portion, a second metallization portion coupled to the first metallization portion through a first plurality of pillar interconnects, a first chiplet located between the first metallization portion and the second metallization portion, wherein the first chiplet is configured to be electrically coupled to the first integrated device through the first metallization portion, and a second chiplet located between the first metallization portion and the second metallization portion, wherein the second chiplet is configured to be electrically coupled to the second integrated device through the first metallization portion.

Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion through a first plurality of pillar interconnects, and a first chiplet located between the first integrated device and the first metallization portion. The first chiplet is coupled to the first integrated device through a first plurality of inter pillar interconnects. The first chiplet may include an active chiplet. The first chiplet may include a passive chiplet.

Abstract: A package comprising a first integrated device comprising a plurality of first pillar interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a metallization portion located over the first integrated device and the encapsulation layer, wherein the metallization portion includes at least one passivation layer and a plurality of metallization layer interconnects, wherein the plurality of first pillar interconnects is coupled to the plurality of metallization layer interconnects; and a second integrated device comprising a plurality of second pillar interconnects, wherein the second integrated device is coupled to the plurality of metallization layer interconnects through a plurality of second pillar interconnects and a plurality of solder interconnects.

Abstract: A package comprising a first integrated device comprising a plurality of first pillar interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a metallization portion located over the first integrated device and the encapsulation layer, wherein the metallization portion includes at least one passivation layer and a plurality of metallization layer interconnects, wherein the plurality of first pillar interconnects is coupled to the plurality of metallization layer interconnects; and a second integrated device comprising a plurality of second pillar interconnects, wherein the second integrated device is coupled to the plurality of metallization layer interconnects through a plurality of second pillar interconnects and a plurality of solder interconnects.

Abstract: Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate and related fabrication methods. The embedded capacitor can be coupled to a power distribution network (PDN) to provide decoupling capacitance to reduce current-resistance (IR) drop. The RDL substrate is disposed between the IC chip(s) and the package substrate to minimize distance between the embedded capacitor(s) and the IC chip(s) to reduce the parasitic inductance in the PDN, thus reducing PDN noise. With the RDL substrate disposed between the package substrate and the IC chip(s), the RDL substrate needs to support through-interconnections between the package substrate and the IC chip(s). In this regard, the RDL substrate includes an outer RDL layer adjacent to the IC chip(s) to support small pitch metal interconnects as well as provide fan-out capability.

Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).

Abstract: The invention provides a massage sofa having a seat portion and a backrest portion; the backrest portion has an accommodating cover, and the accommodating cover is provided with a baffle plate, and the baffle plate separates the accommodating cover into a first accommodating cavity and a second accommodating cavity, wherein the second accommodating cavity is located at a front side of the first accommodating cavity; a flocculating filler is disposed in the first accommodating cavity, a layered filler is disposed in the second accommodating cavity, the baffle plate is provided with a massage airbag, the massage airbag is located between the layered filler and the baffle plate, and the baffle plate is a baffle plate having a stiffness greater than a stiffness of the accommodating cover. The massage airbag of the massage sofa of the invention has a large massage force and the softness of the existing massage sofa.

Abstract: Some implementations provide a semiconductor device that includes a substrate, several metal and dielectric layers coupled to the substrate, and a pad coupled to one of the several metal layers. The semiconductor device also includes a first metal layer coupled to the pad and an under bump metallization layer coupled to the first metal redistribution layer. The semiconductor device further includes a mold layer covering a first surface of the semiconductor device and at least a side portion of the semiconductor device. In some implementations, the mold layer is an epoxy layer. In some implementations, the first surface of the semiconductor device is the top side of the semiconductor device. In some implementations, the mold layer covers the at least side portion of the semiconductor device such that a side portion of at least one of the several metal layers and dielectric layers is covered with the mold layer.

Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).

Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).

Abstract: The invention provides a novel approach to hydrogels with predictable degradation/gelling kinetics, which is useful for many biomedical applications where appropriate gelling kinetics and the timely disintegration of the hydrogel (e.g., drug delivery, guided tissue regeneration) is required. Precisely controlling hydrogel degradation over a broad range in a predictable manner is achieved via a simple but versatile hydrogel platform that allows formulation of hydrogels with predictable disintegration time from within 2 days to >250 days yet comparable macroscopic physical properties.

Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).

Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).