Patents by Inventor Jianwen Xu

Jianwen Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190142687
    Abstract: The invention provides a massage sofa having a seat portion and a backrest portion; the backrest portion has an accommodating cover, and the accommodating cover is provided with a baffle plate, and the baffle plate separates the accommodating cover into a first accommodating cavity and a second accommodating cavity, wherein the second accommodating cavity is located at a front side of the first accommodating cavity; a flocculating filler is disposed in the first accommodating cavity, a layered filler is disposed in the second accommodating cavity, the baffle plate is provided with a massage airbag, the massage airbag is located between the layered filler and the baffle plate, and the baffle plate is a baffle plate having a stiffness greater than a stiffness of the accommodating cover. The massage airbag of the massage sofa of the invention has a large massage force and the softness of the existing massage sofa.
    Type: Application
    Filed: October 26, 2018
    Publication date: May 16, 2019
    Inventors: Jianhan Zou, Jianwen Xu, Zhican Pan, Decai Qiu
  • Patent number: 10141202
    Abstract: Some implementations provide a semiconductor device that includes a substrate, several metal and dielectric layers coupled to the substrate, and a pad coupled to one of the several metal layers. The semiconductor device also includes a first metal layer coupled to the pad and an under bump metallization layer coupled to the first metal redistribution layer. The semiconductor device further includes a mold layer covering a first surface of the semiconductor device and at least a side portion of the semiconductor device. In some implementations, the mold layer is an epoxy layer. In some implementations, the first surface of the semiconductor device is the top side of the semiconductor device. In some implementations, the mold layer covers the at least side portion of the semiconductor device such that a side portion of at least one of the several metal layers and dielectric layers is covered with the mold layer.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: November 27, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Reynante Tamunan Alvarado, Lizabeth Ann Keser, Jianwen Xu
  • Publication number: 20180155328
    Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).
    Type: Application
    Filed: January 22, 2018
    Publication date: June 7, 2018
    Inventors: Jie Song, Jianwen Xu
  • Patent number: 9908871
    Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: March 6, 2018
    Assignee: University of Massachusetts
    Inventors: Jie Song, Jianwen Xu
  • Publication number: 20170182220
    Abstract: The invention provides a novel approach to hydrogels with predictable degradation/gelling kinetics, which is useful for many biomedical applications where appropriate gelling kinetics and the timely disintegration of the hydrogel (e.g., drug delivery, guided tissue regeneration) is required. Precisely controlling hydrogel degradation over a broad range in a predictable manner is achieved via a simple but versatile hydrogel platform that allows formulation of hydrogels with predictable disintegration time from within 2 days to >250 days yet comparable macroscopic physical properties.
    Type: Application
    Filed: February 26, 2015
    Publication date: June 29, 2017
    Inventors: Jie Song, Jianwen Xu
  • Publication number: 20160289219
    Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).
    Type: Application
    Filed: June 10, 2016
    Publication date: October 6, 2016
    Inventors: Jie Song, Jianwen Xu
  • Patent number: 9388276
    Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: July 12, 2016
    Assignee: University of Massachusetts
    Inventors: Jie Song, Jianwen Xu
  • Patent number: 9318405
    Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer. The molding compound may eliminate sidewall chipping and cracking as well as reduce the need for back side lamination.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: April 19, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jianwen Xu, Lizabeth Ann Keser, William Stone, Steve Joseph Bezuk, Nicholas Ka Ming Yu
  • Patent number: 9259509
    Abstract: The invention relates to materials comprising siloxanes, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: February 16, 2016
    Assignee: University of Massachusetts
    Inventors: Jie Song, Jianwen Xu
  • Publication number: 20150318229
    Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer.
    Type: Application
    Filed: May 1, 2015
    Publication date: November 5, 2015
    Inventors: Jianwen XU, Lizabeth Ann KESER, William STONE, Steve Joseph BEZUK, Nicholas Ka Ming YU
  • Patent number: 9054111
    Abstract: An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: June 9, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianwen Xu, Lizabeth Ann A. Keser, Goerge R. Leal, Betty H. Yeung
  • Patent number: 9034697
    Abstract: A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: May 19, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Zhiwei Gong, Jianwen Xu, Wei Gao, Scott M. Hayes
  • Publication number: 20140357806
    Abstract: The invention relates to materials comprising polymer network containing siloxanes or organic-based core structures, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to an organic core functionalized with polymers. In another embodiment, organic core-polymer conjugates comprise polylactone segments. The organic core-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices.
    Type: Application
    Filed: October 21, 2013
    Publication date: December 4, 2014
    Applicant: University of Massachusetts Medical School
    Inventors: Jie Song, Jianwen Xu
  • Publication number: 20140339712
    Abstract: Some implementations provide a semiconductor device that includes a substrate, several metal and dielectric layers coupled to the substrate, and a pad coupled to one of the several metal layers. The semiconductor device also includes a first metal layer coupled to the pad and an under bump metallization layer coupled to the first metal redistribution layer. The semiconductor device further includes a mold layer covering a first surface of the semiconductor device and at least a side portion of the semiconductor device. In some implementations, the mold layer is an epoxy layer. In some implementations, the first surface of the semiconductor device is the top side of the semiconductor device. In some implementations, the mold layer covers the at least side portion of the semiconductor device such that a side portion of at least one of the several metal layers and dielectric layers is covered with the mold layer.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 20, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Reynante Tamunan Alvarado, Lizabeth Ann Keser, Jianwen Xu
  • Patent number: 8841168
    Abstract: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: September 23, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Mark Wendell Schwarz, Jianwen Xu
  • Publication number: 20140255333
    Abstract: The invention relates to materials comprising siloxanes, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement.
    Type: Application
    Filed: May 23, 2014
    Publication date: September 11, 2014
    Applicant: University of Massachusetts Medical School
    Inventors: Jie Song, Jianwen Xu
  • Patent number: 8765112
    Abstract: The invention relates to materials comprising siloxanes, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: July 1, 2014
    Assignee: University of Massachusetts
    Inventors: Jie Song, Jianwen Xu
  • Publication number: 20140058058
    Abstract: The invention generally relates to functional polymers and hydrogels. More particularly, the invention provides versatile monomers and polymers with well-defined functionalities, e.g., polycarbonates and poly(ester-carbonates), compositions thereof, and methods for making and using the same. The invention also provides cytocompatible poly(ethylene glycol)-co-polycarobonate hydrogels (e.g., crosslinked by copper-free, strain-promoted “click” chemistry).
    Type: Application
    Filed: February 24, 2012
    Publication date: February 27, 2014
    Applicant: University of Massachusetts Medical School
    Inventors: Jie Song, Jianwen Xu
  • Patent number: 8617935
    Abstract: A mechanism for accurate alignment of semiconductor package back side interconnect processing is provided. As semiconductor die are placed in position for an encapsulated panel, two or more alignment die having fiducial markings formed on the back, or non-active, side of those die are also placed in the panel. Once all the die and other components have been placed for the panel, the panel is encapsulated using an encapsulant. Excess encapsulant, if any, is removed by a process such as backgrinding. The back grinding process exposes the back side of the alignment die and the fiducial features on those alignment die. The fiducial features on the alignment die can then be used for alignment of backside processing operations on the panel.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: December 31, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianwen Xu, Zhiwei Gong, Scott M. Hayes
  • Patent number: 8609471
    Abstract: A structure (46) for holding an integrated circuit (IC) die (50) during packing includes a flexible structurally reinforced silicone adhesive film (22) and a mold frame (44). The mold frame (44) adheres to an adhesive side (38) of the film (22). A method (20) of packaging the IC die (50) includes placing the IC die (50) on the adhesive film (22) with its active surface (52) and bond pads (54) in contact with an adhesive side (38) of the film (22). A molding compound (58) is dispensed over the IC die, and the IC die (50) is encapsulated using compression molding to form a compression molded encapsulant layer (70). IC die (50) is subsequently released from the film (22) as a panel (72) of IC dies (50).
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: December 17, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Jianwen Xu