Abstract: A system for purifying helium gas, a method, and an application. The system includes a first gas-liquid separation device, a primary helium extraction tower, a second gas-liquid separation device, a secondary helium extraction tower, and a nitrogen removal tower, which are in sequential communication. The first gas-liquid separation device performs first treatment to convert helium-containing natural gas into a first gas and first liquid phases; the primary helium extraction tower performs first distillation on the first gas and first liquid phases to obtain a second gas and second liquid phases; the second gas-liquid separation device performs second treatment to convert the second gas phase to a third gas and third liquid phase; the secondary helium extraction tower performs second distillation on the third gas and third liquid phases to obtain crude helium and a fourth liquid phase form which nitrogen is removed by the nitrogen removal tower.

Abstract: Methods and systems for depositing rare earth metal carbide containing layers on a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process such as an atomic layer deposition process for depositing a rare earth metal carbide containing layer onto a surface of the substrate.

Abstract: A method for fabricating a package structure is provided. The method includes premixing cellulose nanofibrils (CNFs) and a graphene material in a solvent to form a solution; removing the solvent from the solution to form a composite filler; mixing a prepolymeric material with the composite filler to form a composite material; and performing a molding process using the composite material.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure that includes a metal-insulator-metal (MIM) device disposed over a substrate. The MIM device includes a first electrode and a second electrode stacked over the substrate. A dielectric layer is arranged between the first electrode and the second electrode. A getter layer is disposed over the substrate and is separated from the dielectric layer by the first electrode. The MIM device includes a middle portion having a first non-zero concentration of hydrogen and a peripheral portion having both a second non-zero concentration of hydrogen that is greater than the first non-zero concentration and a third non-zero concentration of hydrogen that is less than the first non-zero concentration. The middle portion includes the dielectric layer and the peripheral portion includes the getter layer.

Abstract: A focusing lens assembly includes a housing, a liquid lens, a solid lens assembly, an elastic member set, and a driving assembly. The liquid lens covers a light incidence port of the housing and includes an operating member. The solid lens assembly is located in an accommodating space of the housing. A liquid lens optical axis substantially coincides with the solid lens optical axis. The elastic member set is configured to suspend the solid lens assembly in the accommodating space. The driving assembly includes a coil set fixed to the solid lens assembly and a fixed magnet set fixed to the housing and corresponds to the coil set. When the coil set is driven, the coil set interacts with the fixed magnet set, so that the solid lens assembly moves along the solid lens optical axis to selectively enable the solid lens assembly to abut against the operating member.

Abstract: This application describes a data transmission method, a network node, and a storage medium for communications technologies. In this application, an underlay segment identifier corresponding to an underlay path is designed, and the underlay segment identifier is advertised, so that a node on a segment routing network can sense the underlay path by using the underlay segment identifier. In this way, when a data packet is transmitted, the data packet can be sent based on an underlay segment identifier carried in the data packet and through an underlay path corresponding to the underlay segment identifier. Therefore, an underlay path through which a data packet is to be transmitted may be specified based on a service requirement, so that different data packets can be transmitted through different underlay paths, thereby improving flexibility and facilitating traffic planning.

Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; and a cap structure attached to the buried oxide layer, the cap structure comprising a microneedle.

Abstract: Devices, circuits, and methods for electrostatic discharge (ESD) protection are provided. An electrostatic discharge (ESD) protection circuit comprises a first transistor connected between a first voltage and a second voltage, and a first control circuit connected between the first voltage and the second voltage, and configured to supply a control signal to the first transistor. The circuit further comprises a second transistor connected between the second voltage and a third voltage, and a second control circuit connected between the second voltage and the third voltage, and configured to supply a control signal to the second transistor. The first control circuit and the second control circuit are connected to each other via a first interconnect and a second interconnect. The first and second transistors are configured to turn on in response to an ESD event.

Abstract: A connecting member of a universal connector includes a first insertion hole and a second insertion hole formed on from a first end surface toward a second end surface of the connecting member, and a third insertion hole and a fourth insertion hole formed on the second end surface toward the first end surface of the connecting member, whereby the insertion holes will not be affected by and damage other structures of the connecting member in the mechanical process, so as to achieve the enhancement of the convenience of processing.

Abstract: An electrical connector includes at least one terminal assembly. The terminal assembly includes: a first signal terminal and a second signal terminal being narrow-edge coupled; and an insulating block fixing the first signal terminal and the second signal terminal. A length of the first signal terminal is greater than a length of the second signal terminal. A first connecting portion of the first signal terminal is provided with at least one exposing area, which is exposed to the insulating block and exposed in air medium. The first connecting portion has at least one widening portion and at least one narrow portion connected to each other along a length direction thereof. A width of the widening portion is greater than a width of the narrow portion. The exposing area is provided at the widening portion. A second connecting portion of the second signal terminal is completely wrapped in the insulating block.

Abstract: An optical lens assembly includes at least four optical lens elements being, in order from an object side of the optical lens assembly to an image side thereof, a first optical lens element, a second optical lens element, a third optical lens element and a fourth optical lens element. At least one of the at least four optical lens elements is a filter lens element, the filter lens element includes a near-infrared light filter coating membrane, the filter lens element is made of a glass material, and the filter lens element has at least one aspheric surface. The near-infrared light filter coating membrane includes at least one low refractive index layer and at least one high refractive index layer, and the near-infrared light filter coating membrane is formed by alternately stacking the at least one high refractive index layer and the at least one low refractive index layer.

Abstract: A vertical-cavity surface-emitting laser array includes a substrate. The VCSEL array also includes an active layer formed between a lower mirror and an upper mirror. The VCSEL array also includes a contact layer formed between the active layer and the substrate. The VCSEL array also includes an isolation trench between the first VCSEL and the second VCSEL of the VCSEL array. The isolation trench extending through the contact layer is filled with a filler.

Abstract: An anti-tremor device including a tool unit, a carrying portion, and an anti-tremor module is disclosed. The tool unit is coupled or mounted on the carrying portion. The anti-tremor module is disposed on the carrying portion. The anti-tremor module includes a rotary transmission mechanism and a control module. The control module includes a sensing unit and a control unit. The sensing unit is coupled to the control unit, and the control module is coupled to the rotary transmission mechanism. When the sensing unit senses the tremor of the carrying portion, the control unit controls the rotary transmission mechanism to increase the inertia of the anti-tremor module to eliminate or reduce the tremor of the carrying portion.

Abstract: Methods and systems for depositing rare earth metal carbide containing layers on a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process such as an atomic layer deposition process for depositing a rare earth metal carbide containing layer onto a surface of the substrate.

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

Abstract: A package includes a semiconductor die attached to a substrate and a mold body encapsulating the semiconductor die. A first portion of a lead is directly bonded to a contact pad on the semiconductor die with no intervening component between the first portion of the lead and the contact pad. A second portion of the lead extends outside the mold body to form an external terminal of the package. The lead is a dual gauge lead with the first portion of the lead having a thickness perpendicular to the contact pad that is smaller than a thickness of the second portion of the lead extending outside the mold body.

Abstract: An anti-tremor device including a tool unit, a carrying portion, and an anti-tremor module is disclosed. The tool unit is coupled or mounted on the carrying portion. The anti-tremor module is disposed on the carrying portion. The anti-tremor module includes a rotary transmission mechanism and a control module. The control module includes a sensing unit and a control unit. The sensing unit is coupled to the control unit, and the control module is coupled to the rotary transmission mechanism. When the sensing unit senses the tremor of the carrying portion, the control unit controls the rotary transmission mechanism to increase the inertia of the anti-tremor module to eliminate or reduce the tremor of the carrying portion.

Abstract: Implementations of high-power semiconductor device modules are described, including automotive power transistor assemblies for use in power amplifier circuits such as a cascode circuit. In some implementations, power amplifier circuit components are provided on separate semiconductor die attached to discrete dual die attach pads. A separation between the die attach pads, as well as a through-hole, provide sufficient isolation between the die to permit operation of the circuit at high voltages without relying on a thick multi-layer direct bond copper (DBC) isolation structure. In some implementations, higher voltage operation can be supported by a thin multi-layer, resin coated copper DAP in which the top layer is split.

Abstract: Disclosed are methods and systems for depositing layers comprising a transition metal and a group 13 element. The layers are formed onto a surface of a substrate. The deposition process may be a cyclical deposition process. Exemplary structures in which the layers may be incorporated include field effect transistors, VNAND cells, metal-insulator-metal (MIM) structures, and DRAM capacitors.

Abstract: Devices and methods for selectively etching a metal nitride layer are disclosed. The methods comprise an oxidation step and an etching step which are optionally separated by a purge, and which can be repeated in a cyclical etching process.