Abstract: A display panel and a display device are disclosed. The display panel includes a substrate, a light-emitting element layer, a pixel defining layer, an encapsulation layer, a refraction layer, and a color filter layer. The refraction layer is arranged on the encapsulation layer to refract light entering the refraction layer. The color filter layer is arranged on the refraction layer, and includes a black matrix disposed in a non-opening area and multiple color filters disposed in a non-opening area. Every two adjacent color filters are separated by the black matrix. The refraction layer includes multiple refraction portions. Each refraction portion is arranged under the black matrix, is located in the non-opening area, and extends toward the opening area. The refraction portions are each used to refract the external ambient light and receive the reflected light reflected by the light-emitting element and refract the reflected light to the black matrix.

Abstract: The present invention relates to a method of preparing a black phosphorus nanosheet and application, belonging to the technical field of functional material production. In the method, the black phosphorus sheet is used as the electrolytic anode, and an electrochemical reaction system is constructed together with an inert electrode and an alkaline aqueous electrolyte, wherein the alkaline aqueous electrolyte comprises an N-N dimethylformamide solution dissolved with epoxy resin. In alkaline aqueous electrolyte, the prepared black phosphorus nanosheet structure tends to be more stable, not easy to be damaged and the oxidation degree is reduced. Under alkaline conditions, it is conducive to improve the intercalation and stripping effect of black phosphorus material of anode and make the black phosphorus exfoliation more complete.

Abstract: A semiconductor package includes a first layer including a semiconductor die and a shunt embedded within a first dielectric substrate layer, and metal pillars extending therethrough. The semiconductor package further includes a second layer stacked on the first layer, the second layer including a metal trace patterned on the first dielectric substrate layer, and a second dielectric substrate layer over the metal trace. The metal trace electrically connects a first portion of the shunt to a first metal pillar of the metal pillars and electrically connects a second portion of the shunt to a second metal pillar of the metal pillars. The semiconductor package further includes a base layer opposite the second layer relative the first layer, the base layer forming exposed electrical contact pads for the semiconductor package, the electrical contact pads providing electrical connections to the shunt, the metal pillars, and the semiconductor die.

Abstract: An atomizer is provided. The atomizer includes multiple heating assemblies. Each of the multiple heating assemblies includes a heating sleeve, a magnetic conductive member, and a magnet exciting coil. The magnetic conductive member includes an induction portion and two output portions. The two output portions are disposed at two ends of the induction portion. The magnet exciting coil is disposed on the induction portion. One end of each of the two output portions away from the induction portion faces the heating sleeve in a radial direction of the heating sleeve. Heating sleeves of the multiple heating assemblies are sequentially arranged in an axial direction of the heating sleeve. At least two induction portions of multiple induction portions have different widths in the axial direction of the heating sleeve.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an integrated circuit (IC) component, an insulating layer laterally encapsulating the IC component, a redistribution structure disposed on the insulating layer and the IC component, and a warpage control portion coupling to a back side of the IC component opposite to the redistribution structure. The redistribution structure is electrically connected to the IC component. The warpage control portion includes a substrate, a patterned dielectric layer disposed between the substrate and the IC component, and a metal pattern embedded in the patterned dielectric layer and electrically isolated from the IC component.

Abstract: A display panel, a display device, and an electronic device are disclosed. The display panel includes a flexible substrate, a plurality of pixel islands, an electrochromic layer, and a plurality of force sensors. In response to a stretching length of a corresponding one of a plurality of flexible connection lines being greater than a preset value, each of the plurality of force sensors is configured to enable the electrochromic layer to be switched to a transparent state to allow light emitted from the display panel to pass therethrough. In response to the stretching length of the corresponding one of the plurality of flexible connection lines being less than the preset value, each of the plurality of force sensors is configured to enable the electrochromic layer to be switched to an opaque state to block the light emitted from the display panel.

Abstract: Methods of forming a super high density metal-insulator-metal (SHDMIM) capacitor and semiconductor device are disclosed herein. A method includes depositing a first insulating layer over a semiconductor substrate and a series of conductive layers separated by a series of dielectric layers over the first insulating layer, the series of conductive layers including device electrodes and dummy metal plates. A first set of contact plugs through the series of conductive layers contacts one or more conductive layers of a first portion of the series of conductive layers. A second set of contact plugs through the series of dielectric layers avoids contact of a second portion of the series of conductive layers, the second portion of the series of conductive layers electrically floating.

Abstract: A package includes a first die and a second die. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die and is located within a span of the first die. The first capacitor is electrically connected to the second capacitor.

Abstract: A semiconductor package includes a die and a plurality of conductive patterns. The die includes a device. The conductive patterns are disposed over the device, wherein the conductive patterns are electrically connected to one another to form a first coil and a second coil surrounding the first coil.

Abstract: An extendible bay for an expansion card includes a base, an electrical connector, and an extender bracket. The base defines an interior space that is sized to receive at least a portion of the expansion card therein, and has an elongated shape with a first end and an opposing second end. The electrical connector is coupled to the base and is configured to electrically connect with a corresponding electrical connector of the expansion card. The extender bracket is slidably coupled to the first end of the base and is movable relative to the base such that the length of the extendible bay between the extender bracket and the second end of the base is adjustable to match a length of the expansion card.

Abstract: A bracket for a computing device includes a bracket backwall having a height H1, a first bracket sidewall coupled to a first corner of the bracket backwall, and a second bracket sidewall coupled to a second corner of the bracket backwall. The first bracket sidewall has a height H2,The second bracket sidewall is coupled to a second corner of the bracket backwall. The second corner is opposite the first corner along a diagonal of the bracket backwall. The second bracket sidewall has a height H2. The bracket further includes a first PCIe securing tab extending from the first bracket sidewall towards the second bracket sidewall, and a second PCIe securing tab extending from the second bracket sidewall towards the first bracket sidewall. The height H1 is approximately equal to a sum of the height H2 and the height H3.

Abstract: An imaging lens assembly has an optical axis, and includes at least one radial reduction lens element and a light blocking element. The radial reduction lens element includes an effective optical portion and a peripheral portion. The effective optical portion includes a reduction part shrinking from a portion of the effective optical portion towards the optical axis so that the effective optical portion is non-circular. The peripheral portion and the reduction part are disposed at interval. The light blocking element includes a receiving structure and an extending light blocking structure. The extending light blocking structure and the receiving structure are disposed at interval, and the extending light blocking structure is connected to the receiving structure so that the effective optical portion is non-circular.

Abstract: Disclosed is a brand value evaluation method, comprising: acquiring a brand set to be processed containing a plurality of brands to be processed; collecting evaluation data corresponding to the brand set to be processed, and identifying the brand set to be processed based on the evaluation data to obtain a reputation degree and a volume of each brand to be processed in the brand set to be processed; acquiring a brand to be evaluated, and judging whether the brand to be evaluated exists in the brand set to be processed; when it exists, determining the reputation degree and volume of the brand to be evaluated as a target reputation degree and a target volume; determining a value for the brand to be evaluated according to the reputation degree of each brand to be processed, the volume of each brand to be processed, the target reputation degree and the target volume.

Abstract: Compounds having formula (I), and enantiomers, and diastereomers, stereoisomers, pharmaceutically-acceptable salts thereof, are useful as kinase modulators, including RIPK1 modulation. All the variables are as defined herein.

Abstract: The present disclosure provides methods and apparatuses for processing video content. The method can include: determining whether a picture-header (PH) network-abstraction-layer (NAL) unit is present in a picture unit (PU); in response to the PH NAL unit being present in the PU, determining a first video-coding-layer (VCL) NAL unit of the PU to be a first VCL NAL unit following the PH NAL unit, or in response to the PH NAL unit being not present in the PU, determining that the PU has only one VCL NAL unit and the first VCL NAL unit of the PU is the VCL NAL unit in the PU; and determining whether the first VCL NAL unit of the PU is the first VCL NAL unit of an access unit (AU) containing the PU.

Abstract: A light transceiving module and a LiDAR are disclosed. The light transceiving module includes: a light emitter module emitting a detection beam and a light receiver module receiving an echo beam of the detection beam reflected by a target object. The receiving module converts the echo beam into an electrical signal. A field of view of the light emitter module overlaps vertically with that of the light receiver module. In a first direction, a size of the field of view of the light emitter module is larger than that of the light receiver module. In a second direction perpendicular to the first direction, a size of the field of view of the light emitter module is smaller than that of the light receiver module. Thus, the consistency and stability of the distance measurement capabilities of various channels can be ensured.