Patents by Inventor Jie Chen

Jie Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12279178
    Abstract: Locations and azimuths of cells of a communication network can be estimated, determined, and validated. Cell attribute management component (CAMC) can estimate, determine, and/or validate cell locations based on analysis of timing advance (TA) measurement data and/or location data associated with devices associated with base stations associated with cells. CAMC can estimate azimuth of a cell associated with a base station based on analysis of a validated cell location of the cell and location data associated with devices associated with the cell. CAMC can determine whether a recorded azimuth of the cell is validated based on analysis of the estimated azimuth of the cell and the recorded azimuth of the cell. CAMC can tag the recorded azimuth of the cell as validated if applicable azimuth accuracy criteria is met, inaccurate if applicable azimuth criteria is not met, or omni if the cell is an omni cell.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: April 15, 2025
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Jie Chen, Wenjie Zhao, Ye Ge, Abraham George
  • Publication number: 20250119549
    Abstract: During video encoding or decoding, cross-component prediction can be used to predict a chroma sample from collocated reconstructed luma samples. The prediction can be based on a gradient of the collocated reconstructed luma samples, a down-sampled value of the collocated reconstructed luma samples, or a combination thereof. An exemplary method includes: determining a first value associated with a chroma sample, by applying a first gradient pattern to reconstructed values of a first plurality of luma samples; determining a second value associated with the chroma sample, by applying a down-sampling filter to reconstructed values of a second plurality of luma samples; and predicting the chroma sample based on the first value and the second value.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 10, 2025
    Inventors: Xinwei LI, Yan YE, Ru-ling LIAO, Jie CHEN
  • Patent number: 12272678
    Abstract: A semiconductor package includes a first chip package including a plurality of first semiconductor dies and a first insulating encapsulant, a second semiconductor die, a third semiconductor die, and a second insulating encapsulant. The plurality of first semiconductor dies are electrically connected to each other, and the first insulating encapsulant encapsulates the plurality of first semiconductor dies. The second semiconductor die and the third semiconductor die are electrically communicated to each other by connecting to the first chip package, wherein the first chip package is stacked on the second semiconductor die and the third semiconductor die. The second insulating encapsulant encapsulates the first chip package, the second semiconductor die, and the third semiconductor die.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jie Chen, Hsien-Wei Chen
  • Patent number: 12271554
    Abstract: Disclosed are a touch circuit and driving method, and a touch display panel, the touch circuit includes a plurality of touch units, each touch unit includes a touch signal line, one or more data lines corresponding to the touch signal line, a data signal line connected to the data lines, transmitting a data signal to the data lines, a common signal line connected to the touch electrode; each touch unit includes a first transistor, a control terminal of the first transistor is connected to a first control signal line, a first conducting terminal is connected to the data lines or the data signal line, a second conducting terminal is connected to the touch signal line; though the aforesaid structure, reusing of the data signal line, reducing of the number of wires in the fanout wiring area, an effect of narrow bezel in the lower bezel can be realized.
    Type: Grant
    Filed: April 9, 2024
    Date of Patent: April 8, 2025
    Assignee: HKC CORPORATION LIMITED
    Inventors: Dongmei Wei, Zhonglin Cao, Jie Chen, Yajuan Feng, Yao Li, Haijiang Yuan
  • Patent number: 12273552
    Abstract: The present disclosure provides a computer-implemented method for decoding video. The method includes receiving a bitstream including a coding unit of a video frame, the coding unit being coded in a skip mode or a direct mode; determining whether the coding units has a width greater than a threshold width or a height greater than a threshold height; in response to the coding unit having the width greater than the threshold width or the height greater than the threshold height, enabling a motion vector angular prediction process to store one or more motion vector angular prediction candidates in a candidate list storing a plurality of motion candidates associated with the coding unit; and performing an inter prediction to the coding unit according to the candidate list and an index parsed from the bitstream.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: April 8, 2025
    Assignee: Alibaba Group Holding Limited
    Inventors: Ru-Ling Liao, Jie Chen, Yan Ye
  • Publication number: 20250113053
    Abstract: Methods and apparatuses are provided for motion template-matching-based motion refinement. An exemplary method includes: dividing a target coding block into a plurality of subblocks; determining a first plurality of templates associated with the plurality of subblocks; determining a plurality of reference templates based on the first plurality of templates; performing motion compensation to the target coding block based on an affine merge candidate; and refining the motion compensation by matching the first plurality of templates and the plurality of reference templates.
    Type: Application
    Filed: September 25, 2024
    Publication date: April 3, 2025
    Inventors: Jie CHEN, Ru-Ling LIAO, Xinwei LI, Yan YE
  • Publication number: 20250113050
    Abstract: Methods and apparatuses are provided for subblock-based temporal motion vector prediction (SbTMVP). An exemplary decoding method includes: decoding a target coding unit (CU) based on a SbTMVP mode, wherein the target CU is divided into a plurality of subblocks; determining a same reference picture index for the plurality of subblocks; selecting, based on the determined reference picture index, a reference picture from a list of reference pictures; generating a plurality of predicted subblocks based on the selected reference picture; and reconstructing the target CU based on the plurality of predicted subblocks.
    Type: Application
    Filed: September 24, 2024
    Publication date: April 3, 2025
    Inventors: Ru-ling LIAO, Yan YE, Jie CHEN, Xinwei LI, Yeping ZHENG
  • Publication number: 20250112599
    Abstract: Systems, methods, apparatuses, and computer program products for network-assisted signaling for uplink digital pre-distortion (DPD). A gNB may use an uplink reference signal (RS) to measure a user equipment's (UE's) power amplifier (PA) nonlinearity, where the UE may transmit its UE-specific RS with maximum transmit (Tx) power at a PA measurement window in the uplink. The gNB may train an artificial intelligence-based model to approximate the pre-distortion function (with PA parameters). The gNB may signal DPD-related information, and the UE may determine (and adjust) its DPD function based on the gNB signalling.
    Type: Application
    Filed: June 15, 2022
    Publication date: April 3, 2025
    Inventors: Jun TAN, Athul PRASAD, Amitabha CHOSH, Gilsoo LEE, Jie CHEN
  • Publication number: 20250113052
    Abstract: Methods are provided for optical flow-based motion refinement. An exemplary method includes: receiving a bitstream; and decoding, using coded information of the bitstream, one or more pictures, wherein the decoding includes: determining whether a current block is coded by partitioning into multiple parts; and in response to the current block being partitioned into multiple parts that are inter predicted according to respective reference blocks, determining whether to apply a local illumination compensation (LIC) process to the multiple parts based on whether a coded block applies the LIC process.
    Type: Application
    Filed: September 24, 2024
    Publication date: April 3, 2025
    Inventors: Xinwei LI, Ru-ling LIAO, Jie CHEN, Yan YE
  • Publication number: 20250112126
    Abstract: In examples, a power device comprises a first wide bandgap semiconductor die including a high-side transistor; a second wide bandgap semiconductor die including a low-side transistor; and a conductive device coupled to the first and second wide bandgap semiconductor dies. The conductive device comprises a first layer including a first metal member having fingers at first and second ends of the first metal member, a second metal member having fingers interleaved with fingers of the first metal member at the first end, and a third metal member having fingers interleaved with fingers of the first metal member at the second end. The conductive device also comprises multiple layers in vertical alignment with the first layer, the first, second, and third metal members extending through the multiple layers. The conductive device also comprises a dielectric material covering the first layer and the multiple layers.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Jie CHEN, Sylvester ANKAMAH-KUSI, Rajen Manicon MURUGAN, Yong XIE, Danny Lee BRIJA
  • Patent number: 12267530
    Abstract: The present disclosure provides a computer-implemented method for encoding video. The method includes: determining whether a coded video sequence (CVS) contains equal number of profile, tier and level (PTL) syntax structures and output layer sets (OLSs); and in response to the CVS containing equal number of PTL syntax structures and OLSs, coding the bitstream without signaling a first PTL syntax element specifying an index, to a list of PTL syntax structures in the VPS, of a PTL syntax structure that applies to a corresponding OLS in the VPS.
    Type: Grant
    Filed: June 29, 2023
    Date of Patent: April 1, 2025
    Assignee: Alibaba Group Holding Limited
    Inventors: Jie Chen, Jiancong Luo, Yan Ye, Ru-Ling Liao
  • Patent number: 12267493
    Abstract: The present disclosure provides a video data processing method. The method includes: receiving a bitstream; decoding a first index from the bitstream; determining a maximum number of an adaptive loop filter (ALF) for a component of a picture based on the first index; and processing pixels in the picture with the ALF.
    Type: Grant
    Filed: November 16, 2023
    Date of Patent: April 1, 2025
    Assignee: Alibaba Group Holding Limited
    Inventors: Jie Chen, Ru-Ling Liao, Xinwei Li, Yan Ye
  • Patent number: 12267503
    Abstract: The present disclosure provides a video data processing method for cross-component sample adaptive offset (CCSAO). The method includes determining an index based on a vertical coordinate of a chroma sample within a picture; determining a luma sample based on the index; classifying the chroma sample based on a reconstructed value associated with the luma sample; determining an offset based on the classification; and adding the offset to a reconstructed value associated with the chroma sample.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: April 1, 2025
    Assignee: Alibaba (China) Co., Ltd.
    Inventors: Xinwei Li, Jie Chen, Ru-Ling Liao, Yan Ye
  • Patent number: 12266637
    Abstract: A die stack structure includes an interconnection structure, a logic die, a control die, a first insulating encapsulant, a dummy die, a memory cube and a second insulating encapsulant. The logic die is electrically connected to the interconnection structure. The logic die comprises a first dielectric bonding structure. The control die is laterally separated from the logic die and electrically connected to the interconnection structure. The first insulating encapsulant laterally encapsulates the logic die and the control die. The dummy die is stacked on the logic die, the logic die is located between the interconnection structure and the dummy die, the dummy die comprises a second dielectric bonding structure, and a bonding interface is located between the first dielectric bonding structure and the second dielectric bonding structure. The memory cube is stacked on and electrically connected to the control die, wherein the control die is located between the interconnection structure and the memory cube.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen
  • Patent number: 12264121
    Abstract: Disclosed is a 1,3-bisisocyanatomethylcyclohexane composition and an optical resin prepared therefrom. The composition comprises, based on the weight of 1,3-bisisocyanatomethylcyclohexane, a) 65%-95 wt % of trans-1,3-bisisocyanatomethylcyclohexane; b) greater than 0 and less than or equal to 0.5 wt %, preferably 0.02-0.5 wt % of 1,4-bisisocyanatomethylcyclohexane. Preferably, the 1,3-bisisocyanatomethylcyclohexane composition contains greater than 0 and less than or equal to 600 ppm of 1-isocyanatomethyl-3-methylcyclohexane, based on the weight of 1,3-bisisocyanatomethylcyclohexane. The 1,3-bisisocyanatomethylcyclohexane composition is used for preparing an optical resin, which can be applied to produce an optical lens with a better performance in preventing opacification and optical distortion.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: April 1, 2025
    Assignee: WANHUA CHEMICAL GROUP CO., LTD.
    Inventors: Fulin Zhu, Jianfeng Li, Peng Wang, Wenbin Li, Jie Chen, Qiao Wang, Qian Wu, Hao Chen, Yonghua Shang, Yuan Li
  • Publication number: 20250101028
    Abstract: Provided herein are compounds having the following structure: wherein the substituents are as defined herein, compositions comprising an effective amount of a compound, and methods for modulating activity of KRAS G12D and/or G12V.
    Type: Application
    Filed: September 19, 2024
    Publication date: March 27, 2025
    Applicant: BeiGene, Ltd.
    Inventors: Chao YU, Jie CHEN, Hanzi SUN, Huaqing LIU, Ce WANG, Zhiwei WANG
  • Publication number: 20250104667
    Abstract: The present disclosure provides a display image compensation method, a display and a storage medium.
    Type: Application
    Filed: September 27, 2024
    Publication date: March 27, 2025
    Applicant: HKC CORPORATION LIMITED
    Inventors: Peidi HUANG, Jie CHEN, Junfeng XIE
  • Patent number: 12261163
    Abstract: A package includes an interposer having a first redistribution structure; a first die directly bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; a second die directly bonded to the first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; an encapsulant around the first die and the second die; and a plurality of conductive connectors on a second side of the first redistribution structure opposite to the first die and the second die.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jie Chen, Hsien-Wei Chen, Ming-Fa Chen
  • Publication number: 20250096204
    Abstract: A stacking structure including a first die, a second die stacked on the first die, and a filling material is provided. The first die has a first bonding structure, and the first bonding structure includes first bonding pads and a first heat dissipating element. The second die has a second bonding structure, and the second bonding structure includes second bonding pads and a second heat dissipating element. The first bonding pads are bonded with the second bonding pads. The first heat dissipating element is connected to one first bonding pad of the first bonding pads and the second heat dissipating element is connected to one second bonding pad of the second bonding pads. The filling material is disposed over the first die and laterally around the second die. The first and second dies are bonded through the first and second bonding structures.
    Type: Application
    Filed: November 28, 2024
    Publication date: March 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen
  • Patent number: D1071412
    Type: Grant
    Filed: September 1, 2023
    Date of Patent: April 15, 2025
    Assignee: Hangzhou Maichi Chushi Purifying Equipment Co., Ltd.
    Inventor: Jie Chen