Patents by Inventor Jie Gao

Jie Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10894241
    Abstract: A method for forming polymer microparticles is disclosed. The method comprises spraying a liquid comprising a thermally-gelling polymer from a first orifice of a nozzle into air to form gelled microparticles, and collecting the gelled microparticles with a collecting device. The nozzle is positioned to have a central axis of the first orifice at a tilt angle in a range from about 10 degrees to about 170 degrees relative to a direction of gravity. The collecting device comprises at least two collecting units at different distances from the first orifice of the nozzle in a horizontal direction perpendicular to the direction of gravity. Each of the collecting unit is loaded with a liquid collecting medium. A system for forming polymer microparticles is also disclosed.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: January 19, 2021
    Assignee: Cytiva BioProcess R&D AB
    Inventors: Lin Chen, Jie Gao, Qiongqiong Huang
  • Patent number: 10897816
    Abstract: A rigid-flex circuit board includes a core substrate, a first adhesive layer, and a first outer conductive circuit layer. The core substrate includes a first and a second base layer, a first and a second conductive circuit layer respectively on the first and second base layer, and an insulating layer between the first and second base layer. The first and second conductive circuit layer are embedded in the insulating layer. The first adhesive layer is on the first base layer and defines a first opening which exposes the first opening. The first outer conductive circuit layer is on the first adhesive layer and defines an opening aligned with the first opening. A portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: January 19, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Tzu-Chien Yeh, Lin-Jie Gao
  • Publication number: 20210010904
    Abstract: The present disclosure provides a method and an apparatus for evaluating a degree of injury of a rider's head colliding with a pavement and a test method for testing the apparatus. An impact acceleration of a head model falling from a certain height and hitting the pavement is obtained through a self-made test apparatus, a TBS value is calculated after processing the obtained impact acceleration, and a possibility of the degree of the injury to the rider's head colliding on a test pavement after falling is obtained by inquiring a look-up table of possibility of injury degree of the head of the rider corresponding to the TBS provided by the present disclosure, for evaluating safety hazard when falling on the pavement.
    Type: Application
    Filed: December 13, 2018
    Publication date: January 14, 2021
    Inventors: Aimin SHA, Jie GAO, Bo LUAN, Yuqiao TAN, Zheng TONG
  • Publication number: 20210014539
    Abstract: An apparatus of embodiments, as described herein, includes one or more processors to track data associated with movement of a computing device accessible to a user, and evaluate the data and compare a latency with latency thresholds, where the data indicates the latency and the latency thresholds associated with a frame. The one or more processors are further to maintain a current video encoding rate, if the latency is lower than a first latency threshold and greater than a second latency threshold. The current video encoding rate is decreased if the latency is equal to or greater than the first latency threshold, where the current video encoding rate is increased if the latency is lower than the second latency threshold. The one or more processors are further to present the frame at the computing device including one or more of a wearable device and a mobile device.
    Type: Application
    Filed: March 30, 2018
    Publication date: January 14, 2021
    Applicant: Intel Corporation
    Inventors: Jie Gao, Wenyi Tang, Bo Qiu, Ulun Karacaoglu, Kristoffer Fleming, Yunbiao Lin, Yongfa Zhou, Yaniv Frishman, Manish Hiranandani, Xu Zhang, Sharon Talmor Marcovici, Jianwei Yang, Yu Yang, Yating Wang
  • Patent number: 10882851
    Abstract: This invention provides quinazoline derivatives represented by the structural formula: (I); wherein: R2 is hydrogen, NR?R?, C1-7 alkyl, arylC1-7 alkyl or C3-10 cycloalkyl; R4 is amino, C1-7 alkyl, C2-7 alkenyl, C3-10 cycloalkyl, C3-10 cycloalkenyl, aryl, heterocyclic, arylalkyl, heterocyclic-substituted C1-7 alkyl or C3-10 cycloalkyl-C1-7 alkyl; R5 is hydrogen or C1-7 alkyl, or R5 and R4 together with the nitrogen atom to which they are attached form a heterocyclic ring; Y is a single bond, C1-7 alkylene, C2-7 alkenylene or C2-7 alkynylene; R6 is halogen, heteroaryl or aryl; R? and R? are each independently hydrogen, C1-7 alkyl-carbonyl or C1-7 alkyl; provided that R4 is not phenyl substituted with morpholino when R2 is H and R5 is H, and provided that when NR4R5 is piperazinyl, said NR4R5 is either non-substituted or substituted with methyl or acetyl; a pharmaceutically acceptable addition salt, a stereoisomer, a mono- or a di-N-oxide, a solvate or a pro-drug thereof, for the treatment of viral infections.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: January 5, 2021
    Assignee: Gilead Sciences, Inc.
    Inventors: Ling-Jie Gao, Piet André Maurits Maria Herdewijn, Steven Cesar Alfons De Jonghe, William John Watkins, Lee Shun Chong
  • Publication number: 20200413544
    Abstract: A method for manufacturing a circuit board with a small size a communication unit comprising a radio frequency (RF) component, an antenna, and an encapsulation layer. The RF component is embedded in the encapsulation layer, the antenna is positioned on the encapsulation layer and electrically connected to the RF component. A rigid substrate is formed on a flexible substrate, and a receiving groove is defined in the rigid substrate to expose the flexible substrate. The communication unit is in the receiving groove, thus causing connection between the RF component and the flexible substrate, thereby the circuit board is formed.
    Type: Application
    Filed: July 26, 2019
    Publication date: December 31, 2020
    Inventors: LIN-JIE GAO, YONG-QUAN YANG, HAN-PEI HUANG
  • Publication number: 20200413529
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one of the electronic components. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Application
    Filed: April 21, 2020
    Publication date: December 31, 2020
    Inventors: YONG-CHAO WEI, LIN-JIE GAO, HAN-PEI HUANG
  • Publication number: 20200392332
    Abstract: A polymerizable liquid that can be used for producing three-dimensional objects by methods of additive manufacturing is disclosed. The polymerizable liquid may comprise: (a) a blocked or reactively blocked polyurethane prepolymer; (b) (optional) a reactive diluent; (c) a blocked or reactively blocked curing agent; (d) a photoinitiator; and (e) (optional) a blocked or reactively blocked diisocyanate. The method using such polymerizable liquid to form three-dimensional objects is also described.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 17, 2020
    Applicant: 3D-FAB LIMITED
    Inventors: Guang ZHU, Yisi LU, Jie GAO, Le LV
  • Patent number: 10854009
    Abstract: A method for obtaining a virtual object for a first terminal includes obtaining a first current indoor position, and obtaining a second indoor position corresponding to the first indoor position and a corresponding identifier of a virtual object. The second indoor position is a position of the virtual object corresponding to the identifier of the virtual object. The method also includes, when moving from the first indoor position into a first preset position range including the second indoor position, displaying an actual image shot by a camera and, when the actual image includes the second indoor position, displaying the virtual object at a position in the actual image corresponding to the second indoor position, obtaining a selection operation on the virtual object displayed in the actual image, and sending an obtaining request for the virtual object to a server according to the selection operation.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: December 1, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Zijie Chen, Jie Gao, Yongtao Li, Jianfeng Chen, Zhijie Xie, Shipeng Zhang, Chao Wan, Lei Zhang
  • Publication number: 20200331364
    Abstract: An automotive seat rail includes a rail and an engaging structure. The engaging structure includes a fixing frame, an engaging member and an elastic member. The fixing frame includes a fixing portion and an abutting portion fixed to and abutting an inner rail respectively. The engaging member includes an engaging section, a base section, and a stress section sequentially coupled to each other and bent with respect to each other. The base section is pivotally coupled to the fixing frame, and the engaging section is engaged between the inner and outer rails. When the stress section is controlled by an external force, the engaging section is driven to release the engagement between the inner rail and the outer rail, so as to ensure the accurate action of the engaging structure and allow the engaging member to have better structural strength, smoother control, and more accurate engagement and disengagement effects.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 22, 2020
    Inventors: Jeffrey Chung-Chiang HSI, Yu-Ching LEE, Jie GAO, Jin-Zhou XIE, Xing-He LIN
  • Publication number: 20200325029
    Abstract: A molecular sieve has a silica/alumina molar ratio of 100-300, and has a mesopore structure. One closed hysteresis loop appears in the range of P/P0=0.4-0.99 in the low temperature nitrogen gas adsorption-desorption curve, and the starting location of the closed hysteresis loop is in the range of P/P0=0.4-0.7. The catalyst formed from the molecular sieve as a solid acid not only has a good capacity of isomerization to reduce the freezing point, but also can produce a high yield of the product with a lower pour point. The process for preparing the catalyst involves steps including crystallization, filtration, calcination, and hydrothermal treatment.
    Type: Application
    Filed: October 26, 2018
    Publication date: October 15, 2020
    Inventors: Yunfei BI, Guofu XIA, Mingfeng LI, Qinghe YANG, Weiguo HUANG, Qingzhou GUO, Wenxiu FANG, Luqiang WANG, Hongbao LI, Honghui LI, Jie GAO
  • Publication number: 20200282870
    Abstract: An electric drive mechanism of a seat rail includes a front frame, a rear frame, a gear assembly, a lead screw and a bumper. The front frame and rear frame are separated from each other and fixed to an outer rail of a slide rail; the lead screw is spanned across the front frame and rear frame; the gear assembly driven by a driving device is fixed to an inner rail of the slide rail and engaged with the lead screw; the bumper is installed at the rear frame provide a buffering effect between the gear assembly and the rear frame, so as to prevent the production of abnormal sounds caused by colliding the gear assembly with the rear frame directly.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 10, 2020
    Inventors: Jeffrey Chung-Chiang HSI, Yu-Ching LEE, Jie GAO, Jin-Zhou XIE, Xing-He LIN
  • Patent number: 10772217
    Abstract: A circuit board includes a circuit substrate, a heat dissipation dielectric film and a ground circuit board stacked orderly. At least one conductive structure passes through the heat dissipation dielectric film to electrically connect the circuit substrate and the ground circuit board. An insulating layer is disposed on a side of the circuit substrate facing away from the heat dissipation dielectric film. The circuit board further includes at least one connecting unit. Each connecting unit passes through the insulating layer to be electrically connected to the circuit substrate. A height of each connecting unit is gradually increased from a center of the connecting unit to a periphery of the connecting unit. A method for manufacturing a circuit board is provided.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 8, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Lin-Jie Gao, Han-Pei Huang
  • Patent number: 10764992
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
  • Publication number: 20200254457
    Abstract: Provided is an apparatus, system and method for on-chip microfluids dispensing. The apparatus comprising a substrate; a plurality of first electrodes arranged one next to another on the substrate; a dielectric layer above and enclosing the plurality of first electrodes; and a second electrode on the substrate, wherein each of the plurality of first electrodes is in electric communication with a respective first driving signal input; wherein the second electrode is in electric communication with a second driving signal input; wherein the plurality of first electrodes define a continuous fluid path along a longitudinal direction for retaining microfluids, and wherein the second electrode is arranged within the continuous fluid path and defines a jetting position and an adjacent mixing position within the continuous fluid path.
    Type: Application
    Filed: August 1, 2018
    Publication date: August 13, 2020
    Inventors: Yanwei Jia, Haoran LI, Ren SHEN, Cheng DONG, Tianlan CHEN, Jie GAO, Pui-ln MAK, Rui Paulo da Silva MARTINS
  • Publication number: 20200235765
    Abstract: Technologies for dynamic wireless noise mitigation include a computing device having a wireless modem and one or more antennas. The computing device activates one or more components of the computing device, monitors platform activity, and measures wireless noise received by the antennas. The computing device trains a noise prediction model based on the platform activity and the measured noise. The computing device may monitor platform activity and predict a noise prediction with the noise prediction model based on the monitored activity. The computing device may mitigate wireless noise received by the wireless antennas based on the noise prediction. The computing device may provide the noise prediction to the wireless modem. Other embodiments are described and claimed.
    Type: Application
    Filed: April 6, 2020
    Publication date: July 23, 2020
    Inventors: Shahrnaz Azizi, Vinod Kristem, Jie Gao, Eduardo Alban, Kae-an Liu, Janardhan Koratikere Narayan, Xintian Lin, Ulun Karacaoglu, Atsuo Kuwahara, Timothy F. Cox, Vallabhajosyula Srinivasa Somayazulu, Maruti Gupta Hyde
  • Patent number: 10673487
    Abstract: The disclosure relates generally to method, system and apparatus to optimize wireless charging to identify a proximal Near-Field Communication (NFC) tag and prevent damage by a magnetic wireless charging field. The disclosed embodiment provide different methods for NFC tag detection without impacting A4WP wireless charging. In an exemplary method, dedicated NFC reader is used to interleave the NFC and A4WP signals on the same coil. In one implementation the signals are frequency-multiplexed. In another implementation, the signals are time-multiplexed.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Jie Gao, Songnan Yang, Anand S. Konanur, Xintian Lin, Ulun Karacaoglu
  • Publication number: 20200137894
    Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 30, 2020
    Inventors: FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU, LIN-JIE GAO
  • Publication number: 20200105504
    Abstract: This invention relates to a plasma chemical vapor deposition microwave resonant cavity, which has a high focusing ability and can be flexibly configured. The resonant cavity is a rotary body formed by two isosceles triangles intersecting at the vertex angles with a Boolean union operation. The base angles of the two triangles are 50°˜75°. Between 2n?˜(2n+0.5) ?, the base lengths of the two triangles are equal or have an n? difference, where n is an integer and ? is the microwave wavelength. The distance between the centroids of the upper and the lower isosceles triangles is 0˜4/5?. A strongly focused electric field can be formed in the cavity by adjusting the base lengths, base angles and centroid distance. Different dielectric windows, microwave coupling modes and gas inlet and outlet modes can be selected in the cavity to fit specific applications. The cavity has simple structures.
    Type: Application
    Filed: February 5, 2018
    Publication date: April 2, 2020
    Inventors: Shengwang Yu, Ke Zheng, Jie Gao, Mingjie Lu, Hongkong Wang, Liangliang Li, Mina Ren
  • Publication number: 20200077513
    Abstract: A rigid-flex circuit board includes a core substrate, a first adhesive layer, and a first outer conductive circuit layer. The core substrate includes a first and a second base layer, a first and a second conductive circuit layer respectively on the first and second base layer, and an insulating layer between the first and second base layer. The first and second conductive circuit layer are embedded in the insulating layer. The first adhesive layer is on the first base layer and defines a first opening which exposes the first opening. The first outer conductive circuit layer is on the first adhesive layer and defines an opening aligned with the first opening. A portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.
    Type: Application
    Filed: June 25, 2019
    Publication date: March 5, 2020
    Inventors: TZU-CHIEN YEH, LIN-JIE GAO