Patents by Inventor Jie Wei

Jie Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153769
    Abstract: A first mask and a second mask are sequentially provided to perform a multi-step exposure and development processes. Through proper overlay design of the first mask and the second mask, conductive wirings having acceptable overlay offset are formed.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu, Ying-Ju Chen
  • Publication number: 20240153199
    Abstract: The present disclosure proposes a method and apparatus for image transmission for three-dimensional (3D) scene reconstruction. A target image may be obtained. A geometry feature and an appearance feature may be disentangled from the target image. An intermediate image may be reconstructed based on the geometry feature and a reference appearance feature. A difference between the intermediate image and the target image may be determined. The geometry feature may be transmitted to a receiving device for 3D scene reconstruction in response to determining that the difference is lower than a predetermined threshold.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 9, 2024
    Inventors: Xiao Zhang, Zheng Zhang, Tao Xu, Jie Tang, Yaobo Liang, Yanan Wei
  • Publication number: 20240140023
    Abstract: The present disclosure provides a method for photo-curing 4D printing of a multi-layer structure with an adjustable shape recovery speed, and a multi-layer structure printed thereby. The multi-layer structure printed by the method for photo-curing 4D printing of the multi-layer structure with the adjustable shape recovery speed includes a plurality of deformation units sequentially connected in series, and each of the plurality of the deformation units includes two slow layers, a fast layer, and a transition layer; and the fast layer is arranged between the two slow layers, and the transition layer is arranged between at least one of the two slow layers and the fast layer. In the present disclosure, a low cross-linking layer is doped with a nanocarbon light-absorbing material to solve the problem that the low cross-linking layer is prone to over-curing when a high cross-linking layer is printed on the low cross-linking layer.
    Type: Application
    Filed: December 16, 2022
    Publication date: May 2, 2024
    Applicant: Jiangsu University
    Inventors: Shu HUANG, Hang ZHANG, Jianzhong ZHOU, Jie SHENG, Jiean WEI, Hongwei YANG, Cheng WANG, Mingyuan SHAN
  • Patent number: 11973170
    Abstract: A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Hsien-Wei Chen, Jie Chen
  • Patent number: 11974191
    Abstract: A method (50) of, a node device (100) and a computer program product arranged for alerting node devices in a network of operatively interconnected node devices by transmitting an alerting message comprising a geographic location address of an originator node device (21) transmitting the alerting message and a moving direction (12) of an object (11) receiving service from the originator node device (21). When a receiving node device (24, 25) determines, based on its geographic location address, the geographic location address of the originator node device (21) and the moving direction (12), that the object (11) is approaching the receiving node device (24, 25), it transmits the alerting message comprising the geographic location address of the originator node device (21) and the moving direction (12).
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 30, 2024
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Lei Feng, Chang Jie Wang, Gong Ming Wei
  • Publication number: 20240131650
    Abstract: Disclosed is a roller taper grinding method for a planetary roller screw mechanism. The method includes steps as follows: step 1: determining basic parameters and a bearing capacity of a planetary roller screw mechanism to be machined; step 2: establishing deformation and force balance equations of the planetary roller screw mechanism according to the basic parameters and the bearing capacity of the planetary roller screw mechanism determined in step 1; step 3: iteratively computing an optimal grinding taper angle of roller grinding according to the deformation and force balance equations established in step 2; step 4: determining process parameters of roller grinding; and step 5: grinding a roller taper of the planetary roller screw mechanism by a machine tool according to the process parameters determined in step 4.
    Type: Application
    Filed: June 5, 2023
    Publication date: April 25, 2024
    Inventors: Peitang WEI, Rui HU, Xuesong DU, Jie ZHOU, Pengliang ZHOU
  • Patent number: 11967716
    Abstract: Disclosed is a hollow sulfide microsphere with enriched sulfur vacancies, which is prepared by a method comprising the steps of: dissolving cobalt nitrate and nickel nitrate in a mixed solution of N, N-dimethylformamide and acetone with an equal volume; then adding a chelating agent thereto, subjecting a resulting mixture to a solvothermal reaction to obtain a coordination polymer microsphere; dissolving the coordination polymer microsphere and a sulfurization agent in an organic solvent, and reacting to obtain a hollow sulfide microsphere; and subjecting the hollow sulfide microsphere to reduction treatment with sodium borohydride, centrifuging, washing and drying to obtain the hollow sulfide microsphere with enriched sulfur vacancies having a particle size of 1-2.5 ?m, a shell thickness of 15-30 nm and a specific capacity of the material of 763.4 C g?1 (current density is 1 A g?1).
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 23, 2024
    Assignee: Beijing Institute of Technology
    Inventors: Ziqiang Shao, Shuai Jia, Jie Wei, Zhen Huang, Baixue Gong
  • Patent number: 11968840
    Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yong-Jie Wu, Yen-Chung Ho, Hui-Hsien Wei, Chia-Jung Yu, Pin-Cheng Hsu, Feng-Cheng Yang, Chung-Te Lin
  • Publication number: 20240122844
    Abstract: The present disclosure relates to a carrier for sustained-release of a drug and use thereof. The carrier is used to carry a drug. The carrier is in a gel state, a semi-solid state, or a solid state. The carrier includes a polyol fatty acid ester as a main component and a hydrogenated vegetable oil dissolved in the polyol fatty acid ester. The state of the sustained-release carrier can be adjusted by adjusting the amount of the dissolved hydrogenated vegetable oil.
    Type: Application
    Filed: August 15, 2023
    Publication date: April 18, 2024
    Inventors: Lei ZHANG, Kewang LU, Yu SUN, Tuojiang WU, Xiaojun SHI, Ling ZHU, Jie WEI, Yang SONG, DAVID LUK
  • Publication number: 20240124307
    Abstract: The present disclosure provides a method for preparing lithium iron phosphate from ferric hydroxyphosphate, including: purifying ferrous sulfate to form a ferrous sulfate solution, adding hydrogen peroxide, phosphoric acid, an ammonium dihydrogen phosphate solution and ammonia water into the ferrous sulfate solution and then reacting to form a mixed slurry, holding the mixed slurry at a temperature for a period of time, and then washing with water and subjecting to press filtration to form ferric hydroxyphosphate precursors with different iron-phosphorus ratios; then flash drying, sintering at a high temperature, and pulverizing to obtain ferric hydroxyphosphate precursors with different iron-phosphorus ratios and different specific surface areas.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Jie Sun, Ji Yang, Yihua Wei, Zhonglin He, Jianhao He, Zhongzhu Xu, Jing Mei, Guangchun Cheng, Shuo Lin, Cheng Xu, Pingjun Lin, Menghua Yu, Bin Wang, Xiaoting Wang, Chao Liu, Yuan Yao
  • Patent number: 11960127
    Abstract: A semiconductor package includes a semiconductor die, a device layer, an insulator layer, a buffer layer, and connective terminals. The device layer is stacked over the semiconductor die. The device layer includes an edge coupler located at an edge of the semiconductor package and a waveguide connected to the edge coupler. The insulator layer is stacked over the device layer and includes a first dielectric material. The buffer layer is stacked over the insulator layer. The buffer layer includes a second dielectric material. The connective terminals are disposed on the buffer layer and reach the insulator layer through contact openings of the buffer layer.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen
  • Patent number: 11958863
    Abstract: The present disclosure includes compounds, kits, and assay procedures for use in determining the levels of certain types of drugs in samples that contain specific binding proteins for the drugs. The present disclosure includes analog compounds useful for displacing the drugs from their endogenous binding proteins, and kits including same, as well as methods that utilize these displacers as binding competitors in pharmaceutical assays.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 16, 2024
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Tie Wei, Zhu Teng, Martin Drinan, Jie Li
  • Publication number: 20240115713
    Abstract: Disclosed are a polyethylene glycol conjugate drug, and a preparation method therefor and the use thereof. Specifically, the present invention relates to a polyethylene glycol conjugate drug represented by formula A or a pharmaceutically acceptable salt thereof, a method for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, an intermediate for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, and the use of the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof in the preparation of a drug.
    Type: Application
    Filed: July 21, 2021
    Publication date: April 11, 2024
    Inventors: Gaoquan LI, Nian LIU, Yongchen PENG, Xiafan ZENG, Gang MEI, Sheng GUAN, Yang GAO, Shuai YANG, Yifeng YIN, Jie LOU, Huiyu CHEN, Kun QIAN, Yusong WEI, Qian ZHANG, Dajun LI, Xiaoling DING, Xiangwei YANG, Liqun HUANG, Xi LIU, Liwei LIU, Zhenwei LI, Kaixiong HU, Hua LIU, Tao TU
  • Publication number: 20240118355
    Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Applicant: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng LI, Qiancheng LV, Bing TIAN, Zejie TAN, Zhiming WANG, Jie WEI, Renze CHEN, Xiaopeng FAN, Zhong LIU, Zhenheng XU, Senjing YAO, Licheng LI, Yuehuan LIN, Shengrong LIU, Bofeng LUO, Jiaming ZHANG, Xu YIN
  • Patent number: 11953568
    Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: April 9, 2024
    Assignee: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng Li, Qiancheng Lv, Bing Tian, Zejie Tan, Zhiming Wang, Jie Wei, Renze Chen, Xiaopeng Fan, Zhong Liu, Zhenheng Xu, Senjing Yao, Licheng Li, Yuehuan Lin, Shengrong Liu, Bofeng Luo, Jiaming Zhang, Xu Yin
  • Patent number: 11951155
    Abstract: A pea-derived peptide with a muscle-building effect and a preparation method thereof, and a drug and use, are disclosed. A pea protein is subjected to enzymatic hydrolysis, and five polypeptides with muscle-building effect are obtained by separation as separate peptide fragments. In an in vitro aging skeletal muscle cell assay, changes are analyzed in a gene expression level of regulatory pathways related to skeletal muscle cell proliferation and differentiation, apoptosis and autophagy, and protein synthesis and degradation. In addition, animal experiments are conducted to study the muscle-building effect and a corresponding mechanism of the pea-derived peptide. This shows that the five polypeptide sequences have a significant muscle-building effect, usable as a polypeptide drug for the treatment of sarcopenia.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: April 9, 2024
    Assignee: Zhongshi Duqing(Shandong) Biotech Co., Ltd
    Inventors: Zhao Zhang, Jiuxun Zhang, Zheng Zhang, Jie Li, Wei Wei, Xiping Zhang, Zhongli Pei, Shuai Gu, Lizhu Niu
  • Publication number: 20240110838
    Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for calibrating a temperature of the graphene heating chip.
    Type: Application
    Filed: March 30, 2023
    Publication date: April 4, 2024
    Inventors: JIE ZHAO, LIANG LIANG, YANG WEI, QUN-QING LI, SHOU-SHAN FAN
  • Publication number: 20240114597
    Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for making the graphene heating chip.
    Type: Application
    Filed: March 30, 2023
    Publication date: April 4, 2024
    Inventors: LIANG LIANG, JIE ZHAO, YANG WEI, QUN-QING LI, SHOU-SHAN FAN
  • Patent number: 11942112
    Abstract: A method for starting hard disks, applied in an electronic device, the method includes: starting a storage in the electronic device, and the storage comprising hard disks and a backplane extension chip; sending preset request signals by the hard disks to the backplane extension chip; verifying a number of the hard disks by the backplane expansion chip according to the request signals; when the number of the hard disks is verified successfully, performing type verification on the hard disks by the backplane expansion chip; and sending a start signal by the backplane expansion chip to the target hard disks having a successful type verification according to a preset start sequence and a preset number of the hard disks, to start the target hard disks.
    Type: Grant
    Filed: April 3, 2023
    Date of Patent: March 26, 2024
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Wei Wei, Jie Yuan
  • Patent number: 11942454
    Abstract: A package includes a first die, a second die, and an encapsulant. The first die has a first interconnection structure, and the first interconnection structure includes a first capacitor embedded therein. The second die has a second interconnection structure, and the second interconnection structure includes a second capacitor embedded therein. The first interconnection structure faces the second interconnection structure. The second die is stacked on the first die. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen