Patents by Inventor Jie Xia

Jie Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12274468
    Abstract: A step-cutting thrombectomy device and a thrombectomy system is disclosed. The step-cutting thrombectomy device includes the following: multiple first cutting components capable of elastically expanding in a radial direction and configured to cut a thrombus in a longitudinal direction of a blood vessel; multiple second cutting components, capable of elastically expanding in the radial direction and configured to cut the thrombus in a circumferential direction of the blood vessel a collection device, configured to collect a crushed thrombus; and a push tube. The first cutting components, the second cutting components and the collection device are sequentially disposed on the push tube from the proximal end to the distal end.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: April 15, 2025
    Assignee: SUZHOU ZENITH VASCULAR SCITECH LIMITED
    Inventors: Liyou Guo, Shuang Li, Jie Xia
  • Publication number: 20250114117
    Abstract: A step-cutting thrombectomy device and a thrombectomy system is disclosed. The step-cutting thrombectomy device includes the following: multiple first cutting components capable of elastically expanding in a radial direction and configured to cut a thrombus in a longitudinal direction of a blood vessel; multiple second cutting components, capable of elastically expanding in the radial direction and configured to cut the thrombus in a circumferential direction of the blood vessel a collection device, configured to collect a crushed thrombus; and a push tube. The first cutting components, the second cutting components and the collection device are sequentially disposed on the push tube from the proximal end to the distal end.
    Type: Application
    Filed: November 30, 2022
    Publication date: April 10, 2025
    Inventors: Liyou GUO, Shuang LI, Jie XIA
  • Patent number: 12239024
    Abstract: A method of forming micro-electromechanical system (MEMS) device, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.
    Type: Grant
    Filed: October 11, 2023
    Date of Patent: February 25, 2025
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Jia Jie Xia
  • Publication number: 20250049872
    Abstract: The present disclosure relates to a hypoallergenic milk with immune enhancing function and a preparation method thereof. To solve the problem of milk allergy and lactose intolerance populations being unable to intake milk nutrition through traditional dairy products, the present disclosure provides a hypoallergenic milk with immune enhancing function, including raw milk, collagen peptide, and yeast ?-glucan, acerola cherry powder, maltitol, lactase, stabilizer, essence and water; and the raw milk is A2?-casein organic raw milk. The hypoallergenic milk provided by the present disclosure reduces allergenic substances and risk in terms of formula composition and production process, especially suitable for lactose intolerance and A1?-casein allergy populations. The present disclosure further adopts a triple immune science formula, retaining the active ingredients and high-quality nutrients in milk.
    Type: Application
    Filed: June 26, 2023
    Publication date: February 13, 2025
    Inventors: Yang ZHENG, Chao LIANG, Jie XIA, Zhandong WANG, Qingyun WANG
  • Publication number: 20250011165
    Abstract: A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and the second device substrates, respectively, and both bonded to the interconnect layer. A first handle substrate includes a first cavity having a first pressure, and is bonded to the first device substrate. A second handle substrates includes a second cavity having a second pressure different from the first pressure, and is bonded to the second device substrate. A hole is disposed in the second bond seal ring for pressure adjustment in the second cavity.
    Type: Application
    Filed: July 6, 2023
    Publication date: January 9, 2025
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: JIA JIE XIA, GUOFU ZHOU
  • Patent number: 12175075
    Abstract: A method for improving message storage efficiency of a network chip, a device, and a storage medium are provided. The method comprises: configuring a data memory, dividing the data memory into N small RAMs, and managing respective RAMs by means of a link list; in a case where a write data request is received on any input interface, parsing and acquiring a channel number corresponding to the input interface, accessing a channel write state memory according to the channel number to acquire channel write state information, in a case of determining, according to the channel write state information, that at least one RAM is null, writing data into the data memory; and in a case where a read-out scheduling request is received on any channel, recombining data according to memory information in a link list memory and reading the recombined data out.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: December 24, 2024
    Assignee: SUZHOU CENTEC COMMUNICATIONS CO., LTD.
    Inventors: Zixuan Xu, Jie Xia, Zhiheng Chang
  • Publication number: 20240410279
    Abstract: A method for training a coal rock interface recognition model is performed by a cloud server. The method includes receiving a sample coal rock distribution and sample multi-modal data from an edge processor, acquiring a sample load state feature based on the sample vibration data and the sample noise data; acquiring a sample cutting feature of a coal rock interface based on the sample video data.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 12, 2024
    Applicants: CCTEG BEIJING TIANMA INTELLIGENT CONTROL TECHNOLOGY CO., LTD., BEIJING CCRI-TIANMA AUTOMATION TECHNOLOGY CO., LTD.
    Inventors: Yao Cui, Sen Li, Shoubin Li, Zeyu Qin, Zhuang Ye, Jie Xia
  • Publication number: 20240351999
    Abstract: The present invention belongs to the technical field of antibacterial drugs, and discloses a pyrrolylacylpiperidylamine compound and use thereof. The present invention in particular relates to a pyrrolylacylpiperidylamine compound and a pharmaceutically acceptable salt thereof, and use thereof in the preparation of a medicament for resisting infections with bacteria, mycoplasma or chlamydia.
    Type: Application
    Filed: June 10, 2022
    Publication date: October 24, 2024
    Inventors: Song WU, Wenxuan ZHANG, Xintong ZHAO, Qingyun YANG, Jing FENG, Jie ZHANG, Chi ZHANG, Zunsheng HAN, Tianlei LI, Jie XIA, Kun ZHANG, Bo LIU, Huihui SHAO, Yue WANG, Yuhua HU, Xinyu LUO, Hanyilan ZHANG, Xu LIAN, Zihao ZHU
  • Patent number: 12099749
    Abstract: Disclosed are a data read/write method and apparatus, and an exchange chip and a storage medium. The method comprises: when the current clock cycle arrives, a kernel acquiring a read/write instruction that needs to be executed in the current clock cycle; the kernel acquiring a target storage area associated with the read/write instruction, wherein the target storage area is an unoccupied storage area in at least two storage areas in a random access memory (RAM); and the kernel performing, according to the read/write instruction, data reading and writing on the target storage area in the current clock cycle.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: September 24, 2024
    Assignee: SUZHOU CENTEC COMMUNICATIONS CO., LTD.
    Inventors: Jie Xia, Jun Xu, Guobing Teng
  • Publication number: 20240252332
    Abstract: Provided are a balloon stent mounting device and a stent mounting method. The balloon stent mounting device includes a balloon dilatation catheter and a stent release tube. The balloon dilatation catheter is provided with a first through hole along the length direction. A threading hole is disposed on the side wall of the first through hole. The micro guidewire enters the first through hole through the distal end of the balloon dilatation catheter and passes through the threading hole. An expansion part is disposed at a distal end of the balloon dilatation catheter. A self-expandable stent can be slidably mounted in the first through hole. The self-expandable stent is located at the distal end of the balloon dilatation catheter. The stent release tube is slidably disposed in the first through hole of the balloon dilatation catheter. A distal end of the stent release tube abuts against the self-expandable stent.
    Type: Application
    Filed: June 8, 2022
    Publication date: August 1, 2024
    Inventors: Liyou GUO, Jie XIA
  • Publication number: 20240235512
    Abstract: A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 11, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: JIA JIE XIA, BEVITA KALLUPALATHINKAL CHANDRAN, RANGANATHAN NAGARAJAN, RAMACHANDRAMURTHY PRADEEP YELEHANKA
  • Publication number: 20240180729
    Abstract: Provided are a balloon stent installation device and a stent installation method. The balloon stent installation device, which is used to install a self-expandable stent to a lesion site of a blood vessel, includes a balloon dilatation catheter and a stent release tube. The balloon dilatation catheter includes a first through hole with an inlet and an outlet. An expansion part is disposed at a distal end of the balloon dilatation catheter. The self-expandable stent is slidably mounted in the first through hole and located at a distal end of the balloon dilatation catheter. The stent release tube is slidably disposed in the first through hole. A distal end of the stent release tube abuts against the self-expandable stent and includes a second through hole. A micro guidewire is configured to be inserted sequentially through the outlet of the first through hole, the self-expandable stent, and the second through hole.
    Type: Application
    Filed: June 8, 2022
    Publication date: June 6, 2024
    Inventors: Jie XIA, Liyou GUO
  • Publication number: 20240140781
    Abstract: A MEMS device includes a substrate having a cavity, and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes a plurality of cantilever portions, where each cantilever portions includes a free end and an anchor end. The MEMS device further includes a membrane disposed over the MEMS structure and includes a plurality of protruding portions respectively connected to the free ends of the cantilever portions. In addition, the MEMS device includes a gap between the MEMS structure and the membrane, where the gap surrounds the protruding portions.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventor: JIA JIE XIA
  • Publication number: 20240143169
    Abstract: A method for improving message storage efficiency of a network chip, a device, and a storage medium are provided. The method comprises: configuring a data memory, dividing the data memory into N small RAMs, and managing respective RAMs by means of a link list; in a case where a write data request is received on any input interface, parsing and acquiring a channel number corresponding to the input interface, accessing a channel write state memory according to the channel number to acquire channel write state information, in a case of determining, according to the channel write state information, that at least one RAM is null, writing data into the data memory; and in a case where a read-out scheduling request is received on any channel, recombining data according to memory information in a link list memory and reading the recombined data out.
    Type: Application
    Filed: August 20, 2020
    Publication date: May 2, 2024
    Inventors: Zixuan XU, Jie XIA, Zhiheng CHANG
  • Publication number: 20240136994
    Abstract: A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: JIA JIE XIA, BEVITA KALLUPALATHINKAL CHANDRAN, RANGANATHAN NAGARAJAN, RAMACHANDRAMURTHY PRADEEP YELEHANKA
  • Patent number: 11963452
    Abstract: A method of forming a piezoelectric microphone with an interlock/stopper and a micro-bump and a resulting device are provided. Embodiments include forming a membrane over a Si substrate having a first and second sacrificial layer disposed on opposite surfaces thereof, the membrane being formed on the first sacrificial layer, forming a first HM over the membrane, forming first and second vias through the first HM, forming a first pad layer in the first and second vias and over an exposed top thin film, forming a trench to the first sacrificial layer between the first and second vias and a gap between the trench and second via, patterning a second HM over the membrane, in the first and second vias, the trench and the gap, and forming a second pad layer over the second HM and in exposed areas around the first and second vias to form pad structures.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: April 16, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
    Inventors: Jia Jie Xia, Rakesh Kumar, Minu Prabhachandran Nair, Nagarajan Ranganathan
  • Publication number: 20240116749
    Abstract: The present disclosure related to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate to extend between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 11, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventor: JIA JIE XIA
  • Patent number: 11890643
    Abstract: A PMUT includes a substrate, a stopper, and a multi-layered structure, where the substrate includes a corner, and a cavity is disposed in the substrate. The stopper is in contact with the corner of the substrate and the cavity. The multi-layered structure is disposed over the cavity and attached to the stopper and the multi-layered structure includes at least one through hole in contact with the cavity.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: February 6, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: You Qian, Joan Josep Giner de Haro, Rakesh Kumar, Jia Jie Xia
  • Publication number: 20240040932
    Abstract: A method of forming micro-electromechanical system (MEMS) device, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventor: Jia Jie Xia
  • Patent number: 11878905
    Abstract: The present disclosure related to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate to extend between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: January 23, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Jia Jie Xia