Abstract: A protective photochromic barrier film for a light-sensitive printed electronic substrate. Light-sensitive semiconductor devices on a dielectric substrate are electrically connected by conductors. A barrier layer containing photochromic dyes covers some or all of the light-sensitive semiconductor devices. Upon exposure to visible, infrared, or ultraviolet light, the photochromic dyes change chemical structure and decrease the amount of visible or non-visible light that can impinge upon the light-sensitive electronic devices. Upon removal of the visible or non-visible light, the photochromic dyes either revert to their original structure or maintain their altered state.

Abstract: A method for transmitting an Electronic Service Guide (ESG) includes: sending, an ESG request message to a server; receiving information of to-be-transmitted fragments; requesting fragments required by a terminal from the server according to the information of the to-be-transmitted fragments; and receiving the required fragments sent from the server. Embodiments of the present invention further provide a system for transmitting an ESG, an ESG server and a terminal. With the solution of the present invention, a server may not be required to send a message including a large number of data to a terminal once, so that the reliability and efficiency of the transmission is improved. With solution of the present invention, it is avoided that the terminal receives invalid fragment information, so that resources are saved.

Abstract: Techniques are provided for service-oriented (SOA) process decomposition and service modeling. In one aspect of the invention, the techniques include identifying meta-data entities, attributes of the meta-data entities and relationships between stereotypes of the meta-data model, managing the meta-data model for creating, modifying and removing modeling artifacts, and creating modeling templates from the meta-data model to facilitate addressing at least one need of industry-specific applications. In another aspect the invention, the techniques include packaging the method for SOA process decomposition and service modeling, facilitating lifecycle management of modeling assets, and facilitating maintenance of the modeling assets.

Abstract: A printed electronic device and methods for determining the electrical value of the device. A dielectric material is contact printed on a substrate using a preset force. The substrate has a pressure sensitive material that is optically responsive in direct proportion to the amount of force imparted by the contact printing. The force of the contact printing causes the pressure sensitive material to form a pattern that is quantifiable to the amount of force. The pattern is then optically inspected and compared to sets of standards in order to quantify the amount of force that was used in printing. The thickness of the printed dielectric material is then calculated based on the quantified force by comparing to another set of standards. The electrical value of the printed material is calculated based on the calculated thickness of the printed dielectric material, the surface area of the printed dielectric material, and the dielectric constant of the dielectric material.

Abstract: The present invention concerns double-stranded NF-?B decoy oligodeoxynucleotide (NF-?B dsODN) molecules that contain a core sequence capable of specific binding to an NF-?B transcription factor. In a particular aspect, the invention concerns NF-?B decoy molecules that preferentially bind p50/p65 and/or cRel/p50 heterodimers over p50/p50 homodimers. In another aspect, the invention concerns NF-?B decoy molecules with improved binding affinity to p65.

Abstract: A heat dissipation apparatus (10) includes a heat-dissipating fan (14) and a fin assembly (12). The heat-dissipating fan includes a casing (141) and a plurality of blades (142) rotatably received in the casing. The casing defines an air outlet (148) through which an airflow generated by the blades flows. The air outlet has a front side (148b) and a rear side (148a). The airflow first reaches the front side and then flows towards the rear side. The fin assembly is arrangepd at the air outlet of the fan, and includes a plurality of first fins (121) adjacent to the rear side of the air outlet and a plurality of second fins (122) adjacent to the front side of the air outlet. The first fins are integrally formed with the casing of the fan, whilst the second fins consist of a stack of individually formed fins.

Abstract: Techniques are provided for representing and configuring flexible and extensible presentation patterns based on fine-grained architectural building blocks (ABBs). The techniques include defining ABBs, modeling the ABBs in a uniform manner, and creating at least one template using the ABBs, wherein the at least one template includes at least one of pre-configured static characteristics and user-specified service characteristics.

Abstract: Systems and methods for monitoring and controlling business level SLAs (Service level Agreements), and more particularly, systems and method for monitoring and controlling business level SLAs using probe points, KPIs (Key Performance Indicators) and business commitments. An XML (extensible Markup Language)-based specification referred to as BPCL (Business Process Commitment Language) is used to describe business commitments. BPCL specifications are used by a business process management (BPM) system to configure, monitor, and control business processes based on business commitments. Business Commitments and BPCL provide a path toward model-based management for dynamic e-business solutions.

Abstract: A thermal module (100) includes a centrifugal blower (10) including a base plate (142), a top cover (16) and a sidewall (144) disposed between the base plate and the top cover and defining two air outlets (148a, 148b) therein; two fin assemblies (20a, 20b) are disposed at the air outlets of the centrifugal blower; two heat pipes (30, 40) are thermally connected with the fin assemblies and stacked along a height direction of the thermal module, which is substantially perpendicular to the base plate of the centrifugal blower. Each of the heat pipes thermally connects with a corresponding electronic component for transferring heat of the two electronic components to the two fin assemblies to be dissipated to ambient air.

Abstract: An apparatus (200) such as a semiconductor device comprises a gate electrode (201) and at least a first electrode (202). The first electrode preferably has an established perimeter that at least partially overlaps with respect to the gate electrode to thereby form a corresponding transistor channel. In a preferred approach the first electrode has a surface area that is reduced notwithstanding the aforementioned established perimeter. This, in turn, aids in reducing any corresponding parasitic capacitance. This reduction in surface area may be accomplished, for example, by providing openings (203) through certain portions of the first electrode.

Abstract: Spinstand test improvement that measures Functional Byte Error Rate (F-BER) of a disk. The F-BER is correlated to the BER of a disk. The F-BER test is faster than a BER test. The F-BER test is incorporated into a spinstand tester or the software associated with a spinstand tester.

Abstract: A thermal module includes a roll cage mounted to an enclosure of an electronic product, a centrifugal blower, and a fin assembly. The centrifugal blower is disposed in the roll cage and includes a housing integrally formed with the roll cage and defining an air outlet therein, a cover attached to the housing to cooperatively define a receiving chamber therebewteen, and a rotor rotatably disposed in the receiving chamber for producing an airflow. The fin assembly is disposed at the air outlet of the blower to perform heat convection with the airflow flowing therethrough.

Abstract: The present invention provides compounds which inhibit poly(ADP-ribose) polymerase (“PARP”) compositions containing these compounds and methods for using these PARP inhibitors to treat, prevent and/or ameliorate the effects of the conditions described herein.

Abstract: The present invention discloses a composition for a desulfurizer with a high sulfur capacity and a process for making the same. The composition comprises the active components of three kinds of iron oxides and is used in the desulfurizer to remove hydrogen sulfide from the gaseous and liquid state feed stocks. The above-mentioned composition comprises cubic ferroferric oxide in the form of crystalline phase (Fe3O4), amorphous ferric oxide (Fe2O3) and amorphous ferric oxide monohydrate (Fe2O3.H2O). The composition has a sulfur capacity of at least 40%.

Abstract: A mounting device for mounting a first element onto a second element includes a plurality of fastening elements. Each of the fastening elements includes a connecting member defining a clasping groove therein, and a guiding portion adjacent to the clasping groove. A ring-shaped clipping member snaps in the clasping groove of the connecting member after moving over the guiding portion to be expanded. A fixing member is coupled to the connecting member for sandwiching the first element and the second element therebetween. A resilient member adapts for being sandwiched between the connecting member and the first element to provide resilient force to urge the first element toward the second element.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

Abstract: An electroluminescent display contains an array of dynamically addressable pixels. The pixels are arranged on one side of a carrier substrate. Conductive vias in the substrate are electrically connected to each of the pixels. Each pixel consists of a bottom electrode that is coupled to a via, an electroluminescent material, and a dielectric material. A common top electrode is disposed on the dielectric material. A driver circuit conductor or connector is situated on the other side of the substrate and is electrically coupled to each of the conductive vias and to the common top electrode, so that each pixel can be individually addressed to illuminate the electroluminescent material on individual pixels.