Abstract: The present invention provides restrictive-flow flow measurement devices, valve improvements and signal control devices and processes that control the flow of liquids, including control processes for single-liquid calibration.

Abstract: This invention relates to an apparatus for conditioning the temperature of a fluid by utilizing a thermoplastic heat exchanger (50) comprised of a plurality of hollow tubes. The apparatus controls the temperature of a process fluid inside the heat exchanger (50) via a controller (46) by adjustment of a control valve (64) that regulates the flow of an exchange fluid. The apparatus can be used to maintain the temperature of a chemical bath (12) and also to prepare discreet dispensed volumes of temperature controlled liquid.

Abstract: A contactor for effecting passage through a membrane from a first fluid a second fluid is provided. A cylindrical pleated membrane cartridge is positioned within a housing having a first inlet and a first outlet from a first fluid and at lest a second outlet for a second fluid. At least one baffle is positioned within a first flow path for the first fluid.

Abstract: The present invention is directed to an apparatus for combining a component from a fluid composition with a reactive fluid. The apparatus includes a hollow fiber contactor (142) having a plurality of hollow fibers contained within a housing. A reactive fluid (224), which may be on the shell or lumen side of the hollow fiber membrane, is included in the apparatus and is used for combining with a component from a fluid composition which is on the opposite side of the membrane from the reactive liquid. The reactive liquid combines with one or more components from the fluid composition and can be used for purification of the fluid composition or for the preparation of chemical reagents.

Abstract: The present invention provides restrictive-flow flow measurement devices, valve improvements and signal control devices and processes that control the flow of liquids, including control processes for single-liquid calibration.

Abstract: One embodiment of the present invention can include a flow control device comprising an inlet, an outlet, a pressure loss element between the inlet and outlet, a pressure sensor located upstream from the constriction configured to measure a first pressure of a fluid flowing through the flow control device, a pressure sensor located downstream from the constriction, configured to measure a second pressure of the fluid flowing through the flow control device; and a controller coupled to the first pressure sensor and the second pressure sensor to generate a valve drive signal. The controller can generate a valve control signal based on a differential between the first pressure and the second pressure during a first mode of operation. The controller can also generate a valve control signal based on a measured pressure at a particular pressure sensor during a second mode of operation. The mode of operation can automatically switch.

Abstract: One embodiment of the present invention can include a flow control device comprising an inlet, an outlet, a pressure loss element between the inlet and outlet, a pressure sensor located upstream from the constriction configured to measure a first pressure of a fluid flowing through the flow control device, a pressure sensor located downstream from the constriction, configured to measure a second pressure of the fluid flowing through the flow control device; and a controller coupled to the first pressure sensor and the second pressure sensor to generate a valve drive signal. The controller can generate a valve control signal based on a differential between the first pressure and the second pressure during a first mode of operation. The controller can also generate a valve control signal based on a measured pressure at a particular pressure sensor during a second mode of operation. The mode of operation can automatically switch.

Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

Abstract: One embodiment of the present invention can include a flow control device a flow control device that comprises an inlet, an outlet in fluid communication with the inlet, a pressure sensor, which may or may not be the only pressure sensor of the fluid control device, and a controller coupled to the pressure sensor. The controller can be configured to generate a valve control signal based on a measured pressure at a single pressure sensor.

Abstract: This invention relates to an apparatus for conditioning the temperature of a fluid by utilizing a thermoplastic heat exchange apparatus comprised of a plurality of hollow tubes. The apparatus controls the temperature of a process fluid inside the heat exchanger by adjustment of a control valve that regulates the flow of an exchange fluid. The apparatus can be used to maintain the temperature of chemical baths and also to prepare discreet dispensed volumes of temperature controlled liquid. The device is chemically inert and has the ability to operate at elevated temperatures and also with corrosive and oxidizing liquids.

Abstract: The present invention provides a process and liquid composition for selectively removing a metal film from a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises chemically reacting the metal film with a liquid and then removing the reaction product from the metal surfaces using a polishing pad. The present invention further provides a process to polish a metal surface in separate stages and at different rates by changing the chemical composition of the liquid.

Abstract: The present invention provides a process for forming inlaid patterns of metal into specified areas of a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises selectively removing seed layer from all surfaces save the trenches and vias and selectively electroless plating a metal into the patterned substrate where the seed layer remains. The present invention further provides an abrasive-free polishing-pad configured to planarize a metal plated surface, agitate chemical reagents and facilitate removal of gases generated by the electroless plating process.

Abstract: A process and system are provide for determining the acceptability of a fluid dispense such as a discrete volume of fluid used to coat a substrate. The fluid dispense is exposed to an energy source and the energy transmitted by the fluid dispense is detected to determine the shape of the fluid dispense. The fluid dispense shape and the timing of the beginning and end of the dispense are compared to previously generated standard dispense profiles and used to determine the acceptability of the shape and/or timing of the fluid dispense. The output from the sensor is used to control further processing of the substrate.

Abstract: The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass and the endpoint of the oxidative process detected by a sensor. Residual organics, if desired, and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment.

Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

Abstract: The present invention provides a system and method for selectively removing organic and inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass and the endpoint of the oxidative process detected by a sensor. Residual organics, and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

Abstract: A metal anode having at least a portion of which formed in a spiral configuration is disclosed. The spacing between the adjacent spirals of the anode is essentially uniform in order to provide uniform fluid flow and electrical characteristics. The anode may be formed of a metal rod or sheet or may be cast from a metal. The anode surfaces of the spiral may be flat or have a configuration such as a corrugated surface to enhance the surface area of the anode. The use of spacers, electrically conductive or insulative, within the spaces between the spirals to maintain their uniform distance is also disclosed. The use of one or more buss bars enables the anode to be supplied with a constant electrical source and may also function as a means for monitoring anode consumption over time. The anode is preferably used in an electroplating bath as the source of the metal used for plating. This is particularly of value in the electroplating of silicon wafer surfaces.

Abstract: Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps:(a) preparing a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.

Abstract: A method of inhibiting diffusion into a polyimide body by organic solvents and cations comprising applying ammonia to one or more surfaces of the body prior to exposing the surface to the solvents and cations. A composite article incorporating the diffusion barrier is also disclosed.

Abstract: Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps:(a) preparing a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.