Abstract: A method of inhibiting degradation of the metal-polyimide bond of a metal-polyimide composite due to electrochemical reduction of the polyimide while electroplating wherein the electroplating process is carried out in an ammonium ions-based plating solution.

Abstract: An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.

Abstract: An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.