Patents by Inventor Jien-Ming Chen
Jien-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11943584Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.Type: GrantFiled: April 7, 2022Date of Patent: March 26, 2024Assignee: FORTEMEDIA, INC.Inventors: Chih-Yuan Chen, Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Nai-Hao Kuo
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Publication number: 20240015446Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.Type: ApplicationFiled: October 28, 2022Publication date: January 11, 2024Inventors: Wen-Shan LIN, Chun-Kai MAO, Chih-Yuan CHEN, Jien-Ming CHEN, Feng-Chia HSU, Nai-Hao KUO
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Publication number: 20230339742Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.Type: ApplicationFiled: August 3, 2022Publication date: October 26, 2023Inventors: Jien-Ming CHEN, Wen-Shan LIN, Chun-Kai MAO, Feng-Chia HSU, Chih-Yuan CHEN, Nai-Hao KUO
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Publication number: 20230319486Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.Type: ApplicationFiled: October 3, 2022Publication date: October 5, 2023Inventors: Chun-Kai MAO, Chih-Yuan CHEN, Feng-Chia HSU, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20230319450Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.Type: ApplicationFiled: September 19, 2022Publication date: October 5, 2023Inventors: Chih-Yuan CHEN, Feng-Chia HSU, Chun-Kai MAO, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20230308809Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.Type: ApplicationFiled: August 18, 2022Publication date: September 28, 2023Inventors: Chih-Yuan CHEN, Feng-Chia HSU, Chun-Kai MAO, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20230063234Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.Type: ApplicationFiled: April 7, 2022Publication date: March 2, 2023Inventors: Chih-Yuan CHEN, Jien-Ming CHEN, Feng-Chia HSU, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20220396469Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.Type: ApplicationFiled: December 30, 2021Publication date: December 15, 2022Inventors: Jien-Ming CHEN, Chih-Yuan CHEN, Feng-Chia HSU, Wen-Shan LIN, Nai-Hao KUO
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Patent number: 11459230Abstract: A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.Type: GrantFiled: March 31, 2020Date of Patent: October 4, 2022Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Hsin-Li Lee, Nai-Hao Kuo
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Patent number: 11259106Abstract: A micro-electro-mechanical system (MEMS) device is provided. The MEMS device includes a substrate, a backplate disposed on a side of the substrate, a diaphragm, and a dynamic valve layer. The substrate forms an opening. The diaphragm is disposed on the side of the substrate and extends across the opening of the substrate, wherein the diaphragm forms a vent hole. The dynamic valve layer is disposed on the side of the substrate and includes a flap portion, wherein the flap portion covers at least a part of the vent hole when viewed in a direction perpendicular to the diaphragm, and the flap portion deforms when air flows through the vent hole.Type: GrantFiled: November 6, 2020Date of Patent: February 22, 2022Assignee: FORTEMEDIA, INC.Inventors: Chih-Yuan Chen, Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Nai-Hao Kuo
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Patent number: 11202153Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.Type: GrantFiled: July 21, 2020Date of Patent: December 14, 2021Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Hsin-Li Lee, Nai-Hao Kuo
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Patent number: 11137590Abstract: A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.Type: GrantFiled: March 11, 2016Date of Patent: October 5, 2021Assignee: Industrial Technology Research InstituteInventors: Chia-Jung Chang, Jing-Yuan Lin, Chun-Kai Mao, Jien-Ming Chen, Yu-Sheng Hsieh
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Publication number: 20210037320Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.Type: ApplicationFiled: July 21, 2020Publication date: February 4, 2021Inventors: Jien-Ming CHEN, Feng-Chia HSU, Wen-Shan LIN, Hsin-Li LEE, Nai-Hao KUO
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Publication number: 20200339411Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.Type: ApplicationFiled: March 31, 2020Publication date: October 29, 2020Inventors: Jien-Ming CHEN, Feng-Chia HSU, Wen-Shan LIN, Hsin-Li LEE, Nai-Hao KUO
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Patent number: 10694297Abstract: A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.Type: GrantFiled: March 25, 2019Date of Patent: June 23, 2020Assignee: FORTEMEDIA, INC.Inventors: Hsin-Li Lee, Jien-Ming Chen, Wen-Shan Lin, Nai-Hao Kuo, Feng-Chia Hsu
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Publication number: 20190210866Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.Type: ApplicationFiled: July 2, 2018Publication date: July 11, 2019Inventors: Jien-Ming CHEN, Nai-Hao KUO, Wen-Shan LIN, Hsin-Li LEE
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Patent number: 10343898Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.Type: GrantFiled: July 2, 2018Date of Patent: July 9, 2019Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Nai-Hao Kuo, Wen-Shan Lin, Hsin-Li Lee
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Publication number: 20170139200Abstract: A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.Type: ApplicationFiled: March 11, 2016Publication date: May 18, 2017Inventors: Chia-Jung Chang, Jing-Yuan Lin, Chun-Kai Mao, Jien-Ming Chen, Yu-Sheng Hsieh
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Patent number: 9400224Abstract: A pressure sensor and a manufacturing method of the same are provided. The pressure sensor includes a substrate, a dielectric oxide layer, a first electrode, a dielectric connection layer, and a second electrode. The dielectric oxide layer is formed on the substrate. The first electrode is formed on the dielectric oxide layer. The dielectric connection layer is formed on the first electrode. The second electrode is formed on the dielectric connection layer. The second electrode comprises a patterned conductive layer and a dielectric layer. The patterned conductive layer has a plurality of holes, and the dielectric layer is formed on the patterned conductive layer and covers the inner walls of the plurality of holes. The first electrode, the dielectric connection layer, and the second electrode define a first chamber between the first electrode and the second electrode.Type: GrantFiled: September 12, 2014Date of Patent: July 26, 2016Assignee: Industrial Technology Research InstituteInventors: Jien-Ming Chen, Chin-Wen Huang, Chin-Hung Wang, Jing-Yuan Lin, Yu-Sheng Hsieh
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Publication number: 20160076959Abstract: A pressure sensor and a manufacturing method of the same are provided. The pressure sensor includes a substrate, a dielectric oxide layer, a first electrode, a dielectric connection layer, and a second electrode. The dielectric oxide layer is formed on the substrate. The first electrode is formed on the dielectric oxide layer. The dielectric connection layer is formed on the first electrode. The second electrode is formed on the dielectric connection layer. The second electrode comprises a patterned conductive layer and a dielectric layer. The patterned conductive layer has a plurality of holes, and the dielectric layer is formed on the patterned conductive layer and covers the inner walls of the plurality of holes. The first electrode, the dielectric connection layer, and the second electrode define a first chamber between the first electrode and the second electrode.Type: ApplicationFiled: September 12, 2014Publication date: March 17, 2016Inventors: Jien-Ming Chen, Chin-Wen Huang, Chin-Hung Wang, Jing-Yuan Lin, Yu-Sheng Hsieh