Abstract: Positive electrode active material for solid-state batteries, comprising Li, M?, and oxygen, wherein M? comprises: Ni in a content x between 50.0 mol % and 75.0 mol %, Co in a content y between 0.0 mol % and 40.0 mol %, Mn in a content z between 0.0 mol % and 40.0 mol %, dopants in a content a between 0.0 mol % and 2.0 mol %, Zr in a content b between 0.1 mol % and 5.0 mol %, wherein x+y+z+a+b is 100.0 mol %, wherein Zr A = b ( x + y + z + b ) , wherein the positive electrode active material has a Zr content ZrB is expressed as molar fraction compared to the sum of molar fractions of Co, Mn, Ni, and Zr all as measured by XPS analysis, wherein ZrB/ZrA>50.0, the positive electrode active material comprising secondary particles having a plurality of primary particles said primary particles having an average diameter between 170 nm and 340 nm.

Abstract: Positive electrode active material for solid-state batteries, comprising Li, M?, and oxygen, wherein M? comprises: Ni in a content x between 50.0 mol % and 85.0 mol %, Co in a content y between 0.0 mol % and 40.0 mol %, Mn in a content z between 0.0 mol % and 40.0 mol %, dopants in a content a between 0.0 mol % and 2.0 mol %, Zr in a content b between 0.1 mol % and 5.0 mol %, wherein x+y+z+a+b is 100.0 mol %, wherein Zr A = b ( x + y + z + b ) , wherein the positive electrode active material has a Zr content ZrB is expressed as molar fraction compared to the sum of molar fractions of Co, Mn, Ni, and Zr all as measured by XPS analysis, wherein ZrB/ZrA>50.0, the positive electrode active material comprising secondary particles having a plurality of primary particles said primary particles having an average diameter between 170 nm and 340 nm.

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

Abstract: A display device includes a display panel that includes a flat part and a protruding part adjacent to one side of the flat part, a touch panel disposed on the display panel, a touch connection circuit board disposed at one side of the touch panel and electrically connected to the touch panel, and a protective layer disposed on one surface of the touch connection circuit board and that overlaps the protruding part. The touch connection circuit board includes a base film, a first dummy pattern disposed on the base film and adjacent to one edge of the base film, a second dummy pattern disposed on the base film and adjacent to an other edge of the base film, and a line pattern section disposed between the first and second dummy patterns. The protective layer covers the line pattern section between the first and second dummy patterns.

Abstract: A display device includes a display panel that includes a flat part and a protruding part adjacent to one side of the flat part, a touch panel disposed on the display panel, a touch connection circuit board disposed at one side of the touch panel and electrically connected to the touch panel, and a protective layer disposed on one surface of the touch connection circuit board and that overlaps the protruding part. The touch connection circuit board includes a base film, a first dummy pattern disposed on the base film and adjacent to one edge of the base film, a second dummy pattern disposed on the base film and adjacent to an other edge of the base film, and a line pattern section disposed between the first and second dummy patterns. The protective layer covers the line pattern section between the first and second dummy patterns.

Abstract: The present disclosure describes a flexible display apparatus that includes a display substrate including a light-emitting area, and a non-emitting area including a bending area foldable in a folding direction outside of the light-emitting area, and a pad area outside of the bending area, a thin film encapsulation layer over the light-emitting area, and a driver inside a curvature portion of the display substrate at the bending area, and including a plurality of driving terminals electrically connected to a plurality of pad terminals in the pad area through penetration wirings in via holes defined by the display substrate to provide a new, thinner flexible display apparatus.

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

Abstract: A method of manufacturing a display device comprises the steps of: forming a protective film on a first surface of a first base substrate; forming a polarizer including a plurality of wire grid patterns provided on a second surface of the first base substrate facing the first surface; removing the protective film from the first surface; and forming a pixel array layer on the first surface.

Abstract: A display apparatus includes a substrate, a display unit on a first surface of the substrate, and a protection film on a second surface, opposite the first surface, of the substrate. The protection film includes a first adhesive layer having a first surface that faces the second surface of the substrate; a protection film base having a first surface that faces a second surface, opposite the first surface, of the first adhesive layer; and a light blocking layer having a first surface that faces a second surface, opposite the first surface of the protection film base.

Abstract: A polarizer includes a substrate; a plurality of metal lines on the substrate, the plurality of metal lines each having a first width and a first height and being spaced apart from and parallel to each other with a first gap therebetween; and a hydrophobic coating layer on the metal line. The polarizer may be directly formed on the substrate, allowing for manufacture of light-weight and thin film structure of display device.

Abstract: Disclosed is a fan-out wafer level packaging (FOWLP) apparatus includes a semiconductor die having at least one input/output (I/O) connection, a first plurality of package balls having a first package ball layout, a first conductive layer forming a first redistribution layer (RDL) and configured to electrically couple to the first plurality of package balls, and a second conductive layer forming a second RDL and including at least one conductive pillar configured to electrically couple the at least one I/O connection of the semiconductor die to the first conductive layer, wherein the second conductive layer enables the semiconductor die to be electrically coupled to a second plurality of package balls having a second package ball layout without a change in position of the at least one I/O connection of the semiconductor die.

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

Abstract: A display apparatus includes a substrate, a display unit on a first surface of the substrate, and a protection film on a second surface, opposite the first surface, of the substrate. The protection film includes a first adhesive layer having a first surface that faces the second surface of the substrate; a protection film base having a first surface that faces a second surface, opposite the first surface, of the first adhesive layer; and a light blocking layer having a first surface that faces a second surface, opposite the first surface of the protection film base.

Abstract: A flexible display apparatus includes a display substrate including a light-emitting area, and a non-emitting area including a bending area foldable in a folding direction outside of the light-emitting area, and a pad area outside of the bending area, a thin film encapsulation layer over the light-emitting area, and a driver inside a curvature portion of the display substrate at the bending area, and including a plurality of driving terminals electrically connected to a plurality of pad terminals in the pad area through penetration wirings in via holes defined by the display substrate.

Abstract: A semiconductor device has an interconnect structure with a cavity formed partially through the interconnect structure. A first semiconductor die is mounted in the cavity. A first TSV is formed through the first semiconductor die. An adhesive layer is deposited over the interconnect structure and first semiconductor die. A shielding layer is mounted over the first semiconductor die. The shielding layer is secured to the first semiconductor die with the adhesive layer and grounded through the first TSV and interconnect structure to block electromagnetic interference. A second semiconductor die is mounted to the shielding layer and electrically connected to the interconnect structure. A second TSV is formed through the second semiconductor die. An encapsulant is deposited over the shielding layer, second semiconductor die, and interconnect structure. A slot is formed through the shielding layer for the encapsulant to flow into the cavity and cover the first semiconductor die.

Abstract: A method of manufacturing a display device comprises the steps of: forming a protective film on a first surface of a first base substrate; forming a polarizer including a plurality of wire grid patterns provided on a second surface of the first base substrate facing the first surface; removing the protective film from the first surface; and forming a pixel array layer on the first surface.

Abstract: A polarizer includes a substrate; a plurality of metal lines on the substrate, the plurality of metal lines each having a first width and a first height and being spaced apart from and parallel to each other with a first gap therebetween; and a hydrophobic coating layer on the metal line. The polarizer may be directly formed on the substrate, allowing for manufacture of light-weight and thin film structure of display device.

Abstract: A semiconductor device is made by forming a heat spreader over a carrier. A semiconductor die is mounted over the heat spreader with a first surface oriented toward the heat spreader. A first insulating layer is formed over the semiconductor die and heat spreader. A via is formed in the first insulating layer. A first conductive layer is formed over the first insulating layer and connected to the heat spreader through the via and to contact pads on the semiconductor die. The heat spreader extends from the first surface of the semiconductor die to the via. A second insulating layer is formed over the first conductive layer. A second conductive layer is electrically connected to the first conductive layer. The carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first conductive layer.

Abstract: A gate driving circuit includes: a plurality of driving stages configured to apply gate signals to a plurality of pixels of a display panel, one driving stage of the driving stages including: a thin film transistor including a first control electrode, an active part overlapping the first control electrode, an input electrode overlapping the active part, an output electrode overlapping the active part, and a second control electrode on the first control electrode and the active part; and a control voltage generator configured to supply a control voltage determined according to a channel characteristic of the thin film transistor to the second control electrode and to include a voltage generating thin film transistor including an active part having a same channel characteristic as the active part of the thin film transistor.