Patents by Inventor Ji Hoon Yun

Ji Hoon Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124301
    Abstract: Disclosed is a single process for producing hydrogen, carbon monoxide, and carbon from methane by forming gas products comprising hydrogen and carbon monoxide, and solid products comprising carbon and an iron-based catalyst from methane in a methane-containing feedstock through pyrolysis route involving auto-thermal reduction in a rotary kiln-type reactor in the presence of an iron-based catalyst and separating and recovering respective products.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Inventors: Dong Min YUN, Jung Geun JANG, Ji Hoon LEE, Ye Rhee CHA
  • Patent number: 11934990
    Abstract: Disclosed is a an apparatus for performing smart logistics monitoring including a display unit, a memory, a sensor unit sensing at least one of a temperature, acceleration, humidity, illuminance, inclination, impact, and location of an inside of a logistics vehicle, and a control unit that generates respective status information of a logistics according to a sensed result at a predetermined period, generates a respective QR code indicating the respective status information, and displays the respective QR code on a screen of the display unit. The respective QR code is converted and displayed on the screen depending on an order in which the respective QR code is generated.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: March 19, 2024
    Assignee: Willog Co., Ltd.
    Inventors: Sung Hoon Bae, Ji Hyun Yun
  • Patent number: 11876947
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: January 16, 2024
    Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventor: Ji Hoon Yun
  • Patent number: 11764336
    Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
  • Patent number: 11683460
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: June 20, 2023
    Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventor: Ji Hoon Yun
  • Patent number: 11677059
    Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
  • Publication number: 20220417487
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Application
    Filed: September 1, 2022
    Publication date: December 29, 2022
    Inventor: Ji Hoon YUN
  • Patent number: 11463670
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Grant
    Filed: November 14, 2020
    Date of Patent: October 4, 2022
    Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventor: Ji Hoon Yun
  • Publication number: 20220030208
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Application
    Filed: October 5, 2021
    Publication date: January 27, 2022
    Inventor: Ji Hoon YUN
  • Publication number: 20210351330
    Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.
    Type: Application
    Filed: July 26, 2021
    Publication date: November 11, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
  • Patent number: 11075326
    Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
  • Publication number: 20210226110
    Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Inventors: JI-HOON YUN, Jong-sup Song, Seol-young Choi
  • Patent number: 10971668
    Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
  • Patent number: 10944539
    Abstract: A backscatter communication method and apparatus based on pattern-based demodulation is disclosed. The backscatter communication method includes receiving a communication signal, and demodulating the communication signal based on a slope of the communication signal at an edge of each time interval.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: March 9, 2021
    Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Jang Jeong, Jae-Han Lim, Hwanwoong Hwang, Ji-Hoon Yun
  • Publication number: 20210067755
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Application
    Filed: November 14, 2020
    Publication date: March 4, 2021
    Inventor: Ji Hoon Yun
  • Patent number: 10911136
    Abstract: Disclosed are a communication method and communication apparatus using an ambient backscatter communication. A transmission apparatus may include generating a plurality of bitsets by fragmenting data based on a predetermined bitset length, mapping the plurality of bitsets to a plurality of switching patterns based on a data size, and controlling a reflection of a background radio frequency (RF) signal based on a corresponding mapped switching pattern, a total number of the plurality of switching patterns may be determined based on the bitset length, and each of the plurality of switching patterns may have a different length.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: February 2, 2021
    Assignees: Electronics and Telecommunications Research institute, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Jang Jeong, Woo Jin Byun, Ji-Hoon Yun, Jae-Han Lim, Wisnu Murti
  • Patent number: 10892391
    Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
  • Patent number: 10869013
    Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: December 15, 2020
    Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventor: Ji Hoon Yun
  • Publication number: 20200328329
    Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 15, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
  • Patent number: D1022734
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Willog Co., Ltd.
    Inventors: Sung Hoon Bae, Ji Hyun Yun