Patents by Inventor Jin-Bae Kim

Jin-Bae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240120347
    Abstract: A display device includes first and second electrodes, light-emitting elements on the first and second electrodes, data lines extending from a pad area to a display area, connection wirings spaced apart from the data lines and extending from the pad area to a non-display area on respective sides of the display area, first pads overlapping the data lines in the pad area, and second pads overlapping the connection wirings, wherein the connection wirings include a first connection wiring overlapping a second pad, a second connection wiring not overlapping the second pad and overlapping the first connection wiring in the non-display area, and a third connection wiring overlapping the first connection wiring and electrically connected to the second pad, wherein the first and third connection wirings overlap each other in the pad area, and the first, second, and third connection wirings overlap each other in the non-display area.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 11, 2024
    Inventors: Yong Hee LEE, Jin Seon KWAK, Kyung Bae KIM, Ji Hye LEE
  • Publication number: 20240102123
    Abstract: The present invention relates to a method for manufacturing a non-oriented electrical steel sheet, and a non-oriented electrical steel sheet manufactured thereby, and the method for manufacturing a non-oriented electrical steel sheet, according to the present invention, comprises the steps of: (a) reheating a steel slab comprising 0.05 wt % or less of C, 1.0-3.5 wt % of Si, 0.2-0.6 wt % of Al, 0.02-0.20 wt % of Mn, 0.01-0.20 wt % of P, 0.01 wt % or less of S, and the balance of Fe and inevitable impurities, and then performing hot rolling on same; (b) performing hot rolling annealing heat-treatment and pickling on a hot rolled steel sheet; (c) performing cold rolling on the pickled steel sheet; (d) performing insulation coating on the cold rolled steel sheet, and then processing same; and (e) performing final heat treatment by heating, soaking and cooling the processed steel sheet, wherein soaking process is maintained and carried out at a temperature of 850° C.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 28, 2024
    Inventors: Changwoo JEONG, Jin Bae KIM
  • Publication number: 20240085788
    Abstract: An object of the present disclosure is to improve display reliability and lifetime as well as vivid colors. When there remain residues in the washing part due to incomplete removal during the developing step, it can cause dark spots or pixel off due to the residues, and thus residue-free pixels can be formed by optimizing the temperature and time for developing. Additionally, when the amount of outgas in the panel after post-baking is 15 ppm or more, it may cause a reduction in luminance and lifetime due to pixel shrinkage. Therefore, in order to minimize the amount of outgas after completion of the post-baking process, the generation of outgas in the panel state can be minimized by generating sufficient fume in the post-baking step, in addition to forming clean pixels in the developing step.
    Type: Application
    Filed: August 16, 2023
    Publication date: March 14, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Jun BAE, Changmin LEE, Yeon Soo LEE, Jun Ki KIM, Jin Hyun KIM, Ju Cheol KWON, Soung Yun MUN, Kyung Soo KIM
  • Patent number: 11926310
    Abstract: Controlling a speed limit includes determining a virtual vehicle speed as being a lower one of a vehicle speed and a target limit speed, determining a virtual APS value as being a larger one of a first APS value and a second APS value, transitioning to a second mode at a point in time at which an actual APS value and the second APS value become different, when it is expected to transition to the second mode, among a first mode for sustaining a SOC of a battery at the target limit speed and the second mode for depleting the SOC, and determining a transmission gear position by applying the determined virtual vehicle speed and the determined virtual APS value to one of a first shifting pattern and a second shifting pattern.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 12, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hui Un Son, Sang Joon Kim, Kyu Hwan Jo, Sung Bae Jeon, Sung Hoon Yu, Joo Young Kim, Jin Kyeom Cho
  • Publication number: 20240071896
    Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jin Won CHAE, Moon Gil JUNG, Kwang-Bae KIM, So Yoen PARK, Hyung Jun CHOI
  • Publication number: 20240067079
    Abstract: A brake lamp control method of a vehicle is provided. The method includes determining whether a deceleration of the vehicle based on regenerative brake through the electric motor is present in a hysteresis period between an off threshold as a reference for turning off a brake lamp and an on threshold as a reference for turning on the brake lamp. When the deceleration of the vehicle is present in the hysteresis period, the method includes determining a state of the brake lamp before the deceleration of the vehicle enters the hysteresis period. In response to determining that the brake lamp is turned on or off for a reason except for the regenerative brake before the deceleration of the vehicle enters the hysteresis period, a request for turning on the brake lamp is set or reset based on the regenerative brake in response to the determined state of the brake lamp.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 29, 2024
    Inventors: Hui Un Son, Sang Joon Kim, Kyu Hwan Jo, Sung Bae Jeon, Sung Hoon Yu, Joo Young Kim, Jin Kyeom Cho
  • Patent number: 11912672
    Abstract: A novel compound having excellent light emission and heat stability is disclosed. Also disclosed is an organic electroluminescent device having properties such as light emitting efficiency, an operation voltage, and a service life improved by including the compound in at least one organic layer of the device.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: February 27, 2024
    Assignee: SOLUS ADVANCED MATERIALS CO., LTD.
    Inventors: Hyungchan Bae, Young Bae Kim, Hoe Moon Kim, Ho Jun Son, Jin Woong Kim
  • Patent number: 11651879
    Abstract: The present disclosure relates to an iron (Fe)-based amorphous soft magnetic alloy and a method for manufacturing the soft magnetic alloy. According to the present disclosure, there is provided an Fe-based soft magnetic alloy including C and S meeting 1?a+b?6, wherein a is an atomic % content of C and b is an atomic % content of S, B meeting 4.5?x?13.0, wherein x is an atomic % content of B, Cu meeting 0.2?y?1.5, wherein y is an atomic % content of Cu, Al meeting 0.5?z?2, wherein z is an atomic % content of Al, and a remaining atomic % content of Fe and other inevitable impurities, wherein the Fe-based soft magnetic alloy includes a micro-structure, and wherein the micro-structure includes a crystalline phase with a mean crystalline grain size ranging from 15 nm to 50 nm in an amorphous base.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: May 16, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Dongwon Kang, Joungwook Kim, Jin Bae Kim
  • Publication number: 20220396848
    Abstract: Disclosed are a non-oriented electrical steel sheet and a manufacturing method therefore, the sheet ensuring excellent magnetic characteristics by having increased texture intensity of surface (100) through strict control of the content ratio of Si, Al and the like and through final annealing heat treatment in an inert gas atmosphere.
    Type: Application
    Filed: September 29, 2020
    Publication date: December 15, 2022
    Inventors: Jin Bae KIM, Dongwon KANG, Joungwook KIM
  • Patent number: 10999959
    Abstract: The present disclosure relates to a magnetic shielding sheet and a method of preparation thereof. The magnetic shielding sheet includes a magnetic layer, and a protective layer disposed on at least one surface of the magnetic layer. The magnetic layer includes a metal-ceramic composite that is metal powder, on which a ceramic coating layer is formed.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: May 4, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Jin Bae Kim, Dongwon Kang, Joungwook Kim
  • Publication number: 20200275588
    Abstract: The present disclosure relates to a magnetic shielding sheet and a method of preparation thereof. The magnetic shielding sheet includes a magnetic layer, and a protective layer disposed on at least one surface of the magnetic layer. The magnetic layer includes a metal-ceramic composite that is metal powder, on which a ceramic coating layer is formed.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 27, 2020
    Inventors: Jin Bae Kim, Dongwon Kang, Joungwook Kim
  • Publication number: 20200168376
    Abstract: Disclosed are magnetic powders, compressed magnetic powders and a preparation method thereof. The magnetic powder contains a plate-shaped particle whose aspect ratio defined in a following relationship 1 is equal to or larger than 4: [relationship 1] aspect ratio=length of long side of plate-shaped particle/length of short side of plate-shaped particle.
    Type: Application
    Filed: November 25, 2019
    Publication date: May 28, 2020
    Inventors: Dongwon KANG, Jin Bae KIM, Joungwook KIM
  • Publication number: 20200135370
    Abstract: The present disclosure relates to an iron (Fe)-based amorphous soft magnetic alloy and a method for manufacturing the soft magnetic alloy. According to the present disclosure, there is provided an Fe-based soft magnetic alloy including C and S meeting 1?a+b?6, wherein a is an atomic % content of C and b is an atomic % content of S, B meeting 4.5?x?13.0, wherein x is an atomic % content of B, Cu meeting 0.2?y?1.5, wherein y is an atomic % content of Cu, Al meeting 0.5?z?2, wherein z is an atomic % content of Al, and a remaining atomic % content of Fe and other inevitable impurities, wherein the Fe-based soft magnetic alloy includes a micro-structure, and wherein the micro-structure includes a crystalline phase with a mean crystalline grain size ranging from 15 nm to 50 nm in an amorphous base.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 30, 2020
    Inventors: Dongwon Kang, Joungwook Kim, Jin Bae Kim
  • Publication number: 20180249599
    Abstract: A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the at least one electronic component. The fence is electrically connected to a different second electrically conductive trace of the circuit board. The system further includes an electrically conductive lid conformably attached to a top side of the fence. The electrically conductive lid covers the at least one electronic component. The fence comprises a plurality of spaced apart first tabs arranged along at least a first portion of a perimeter of the fence. Each first tab has a free end and is attached to the electrically conductive lid or the circuit board.
    Type: Application
    Filed: September 19, 2016
    Publication date: August 30, 2018
    Inventors: Jin-Bae Kim, Jung-Ju Suh, Jeongwan Choi
  • Patent number: 9475001
    Abstract: The present invention relates to an extracting device supplying fixed quantity of exhaust gas for industrial facility, and more particularly, to an extracting device supplying fixed quantity of exhaust gas for industrial facility which supplies a certain amount of exhaust gas by installing a gas supply pipe, in which two blowers are arranged in a line, at a stack and operating each blower in accordance with a predetermined input value.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 25, 2016
    Assignee: KOREA DISTRICT HEATING CORP.
    Inventors: Won-Seok Chang, Chang-Jun Lee, Jin-Bae Kim, Nam-Woong Kim
  • Publication number: 20150192252
    Abstract: The present invention relates to an extracting device supplying fixed quantity of exhaust gas for industrial facility, and more particularly, to an extracting device supplying fixed quantity of exhaust gas for industrial facility which supplies a certain amount of exhaust gas by installing a gas supply pipe, in which two blowers are arranged in a line, at a stack and operating each blower in accordance with a predetermined input value.
    Type: Application
    Filed: July 16, 2014
    Publication date: July 9, 2015
    Inventors: Won-Seok CHANG, Chang-Jun LEE, Jin-Bae KIM, Nam-Woong KIM
  • Patent number: 9061478
    Abstract: A conductive single-sided tape includes a conductive, nonwoven adhesive layer and a metal layer positioned adjacent the conductive, nonwoven adhesive layer. The conductive, nonwoven adhesive layer includes a conductive nonwoven substrate having a plurality of passageways, an adhesive material positioned within at least a portion of the passageways and a plurality of metal particles dispersed within the adhesive material.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: June 23, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Jeong-Wan Choi, Jin-Bae Kim
  • Patent number: 8506123
    Abstract: Disclosed herein is an LED flash lens unit which prevents occurrence of yellow bands or yellow rings if LED light is concentrated through an LED flash lens improving manufacturing ability and mass production to have high performance and high efficiency.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: August 13, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin Eui Lee, Seung Jae Lee, Dong Seob Jang, Heung Bom Kim, Jin Bae Kim
  • Publication number: 20120295052
    Abstract: A conductive single-sided tape includes a conductive, nonwoven adhesive layer and a metal layer positioned adjacent the conductive, nonwoven adhesive layer. The conductive, nonwoven adhesive layer includes a conductive nonwoven substrate having a plurality of passageways, an adhesive material positioned within at least a portion of the passageways and a plurality of metal particles dispersed within the adhesive material.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 22, 2012
    Inventors: Jeong-Wan Choi, Jin-Bae Kim