Patents by Inventor Jin-Gong Meng

Jin-Gong Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7987898
    Abstract: A heat dissipation device includes a cooling fan (15) defining an air inlet and an air outlet (157) oriented perpendicular to the air inlet; a metal foam (11) is arranged in the air outlet of the cooling fan, and a heat pipe (13) has a condensing end (131) being thermally attached to the metal foam. The metal foam forms numerous open cells (118). A plurality of guiding holes (116) are defined in the metal foam facing to a rotor (153) of the cooling fan for an airflow generated by the cooling fan to flow therethrough. The guiding hole (116) has a size larger that that of the open cell (118). The guiding hole has an outer end opened to an outside of the cooling fan (15).
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology, Co., Ltd.
    Inventors: Jin-Gong Meng, Ching-Bai Hwang
  • Patent number: 7913749
    Abstract: A thermal module (100) includes a centrifugal blower (20), a heat dissipater (10) and a plurality of heat transfer plates (34). The centrifugal blower includes a casing (22), a stator accommodated in the casing, and a rotor (24) rotatably disposed around the stator. The casing includes a base wall (224) and a sidewall (222) surrounding the base wall. The sidewall defines an air outlet (221) in front of the rotor. The heat dissipater is made of porous material and disposed at the air outlet of the centrifugal blower. The heat transfer plates extend into the heat dissipater so as to increase heat transfer efficiency between a heat generating electronic component and the heat dissipater.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: March 29, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jin-Gong Meng, Ching-Bai Hwang
  • Patent number: 7839630
    Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: November 23, 2010
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng, Cheng-Jen Liang
  • Publication number: 20100263834
    Abstract: A heat dissipation device includes a chamber, a tube, a wick structure and a plurality of fins arranged around the tube. The chamber includes a base and a cover hermetically connected to the base. An evaporation room is defined between the base and the cover of the chamber. The tube extends upwardly from the cover of the chamber, and defines a condensation room communicating with the evaporation room. The wick structure is immerged with working fluid, and includes a main portion disposed in the evaporation room and a projection extending from the main portion into the condensation room.
    Type: Application
    Filed: July 30, 2009
    Publication date: October 21, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, JUI-WEN HUNG
  • Patent number: 7802617
    Abstract: A heat dissipation apparatus (10) includes a centrifugal blower (12) and a fin assembly (11) having a plurality of fins (111) disposed at an air outlet (129) of the centrifugal blower. The centrifugal blower includes a first tongue (130) distant from the fin assembly, and a second tongue (131) located between the first tongue and the air outlet of the blower. The second tongue has an end (132) substantially parallel to the fins of the fin assembly to guide an airflow smoothly flowing through the fins.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: September 28, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng, Ran Lin
  • Patent number: 7779894
    Abstract: A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jie-Bo Peng, Jin-Gong Meng, Ching-Bai Hwang, Jui-Wen Hung
  • Publication number: 20100181048
    Abstract: A heat pipe includes a casing and a three-dimensional cross-linkage wick structure received in the casing. The three-dimensional cross-linkage wick structure has a plurality of pores therein for providing a capillary action and includes a bottom layer being attached to the casing and a plurality of protrusions extending from the bottom layer and spaced from each other. A groove is defined between two adjacent protrusions. The bottom layer has a connecting portion under the groove. The connection portion is formed between and connects with the two adjacent protrusions. The connection portions have a smaller pore size than the protrusions.
    Type: Application
    Filed: June 11, 2009
    Publication date: July 22, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, YI-SHIH HSIEH
  • Publication number: 20100155030
    Abstract: A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet perpendicular to the air inlet. The fin unit is arranged at the air outlet of the blower. The heat pipe includes a tube defining a chamber, and a wick structure disposed in the chamber. The heat pipe forms an evaporation section and a condensation section attaching to the fin unit. At least one contacting member is depressed inwardly from the evaporation section of the heat pipe for accommodating an electronic component therein. A depth of the chamber at the at least one contacting member is less than that at other portion of the evaporation section of the heat pipe without the at least one contacting member.
    Type: Application
    Filed: June 17, 2009
    Publication date: June 24, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, ZHI-HUI ZHAO
  • Publication number: 20100139895
    Abstract: A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a base, a cover, a sidewall between the base and the cover, and an impeller arranged among the base, the cover and the sidewall. An air outlet is defined in the sidewall of the blower. The fin unit is arranged at the air outlet. The heat pipe has a contacting plate integrally formed with one of the base and the cover of the blower. The contacting plate of the heat pipe includes a dissipating surface attaching to the fin unit, and an absorbing surface with different portions adapted for contacting with electronic components, wherein the different portions of the absorbing plate being at different levels.
    Type: Application
    Filed: June 10, 2009
    Publication date: June 10, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, ZHI-HUI ZHAO
  • Publication number: 20100073864
    Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.
    Type: Application
    Filed: March 3, 2009
    Publication date: March 25, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, CHENG-JEN LIANG
  • Patent number: 7651601
    Abstract: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: January 26, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng
  • Patent number: 7606036
    Abstract: A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: October 20, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng
  • Patent number: 7603775
    Abstract: A heat spreader (100) includes a metal casing (60) formed by electrodeposition and defining a vapor chamber (40) therein, and a mesh (12b) lining an inner surface of the metal casing. A method for manufacturing the heat spreader includes: providing a core (60a) having a mesh layer (12a) including a plurality of pores and a filling material (14) filled in the pores of the mesh layer and a major space enclosed by the mesh layer; electrodepositing a layer of metal coating (60b) on an outer surface of the core; removing the filling material from the coating layer and the pores of the mesh layer; and filling a working fluid into the coating layer and hermetically sealing the coating layer to thereby obtain the heat spreader with therein a wick structure (12) formed by the mesh layer and the vapor chamber formed by said major space.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: October 20, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jin-Gong Meng, Ching-Bai Hwang
  • Patent number: 7520314
    Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of laminar fins (121) thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow flowing through the fin assembly to take heat away therefrom. The centrifugal blower includes a housing (141), a cover (142) disposed on the housing, and a rotor (143) rotatably received in a space formed between the housing and the cover. The fins of the fin assembly are disposed in the housing of the centrifugal blower and stacked together along a direction substantially parallel to a rotation axis (A) of the rotor.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: April 21, 2009
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng
  • Patent number: 7492588
    Abstract: A heat dissipation apparatus (100) includes a centrifugal blower (20) and a heat dissipater (10). The centrifugal blower includes a casing (22), a stator accommodated in the casing, and a rotor (24) rotatable disposed around the stator. The casing includes a base wall (224), a sidewall (226) surrounding the base wall and a cover (222) attached to the sidewall. The sidewall defines an air outlet (221) therein. An air channel (223) is formed between blades (242) of the rotor and an inner surface of the sidewall of the casing. The heat dissipater is made of porous material and disposed at the air outlet of the centrifugal blower. The heat dissipater has a tongue portion (12) extending into a part of the air channel.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: February 17, 2009
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng, Jie Zhang
  • Publication number: 20090008066
    Abstract: A heat dissipation device includes a cooling fan (15) defining an air inlet and an air outlet (157) oriented perpendicular to the air inlet; a metal foam (11) is arranged in the air outlet of the cooling fan, and a heat pipe (13) has a condensing end (131) being thermally attached to the metal foam. The metal foam forms numerous open cells (118). A plurality of guiding holes (116) are defined in the metal foam facing to a rotor (153) of the cooling fan for an airflow generated by the cooling fan to flow therethrough. The guiding hole (116) has a size larger that that of the open cell (118). The guiding hole has an outer end opened to an outside of the cooling fan (15).
    Type: Application
    Filed: August 3, 2007
    Publication date: January 8, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIN-GONG MENG, CHING-BAI HWANG
  • Publication number: 20080314576
    Abstract: A thermal module (100) includes a centrifugal blower (20), a heat dissipater (10) and a plurality of heat transfer plates (34). The centrifugal blower includes a casing (22), a stator accommodated in the casing, and a rotor (24) rotatably disposed around the stator. The casing includes a base wall (224) and a sidewall (222) surrounding the base wall. The sidewall defines an air outlet (221) in front of the rotor. The heat dissipater is made of porous material and disposed at the air outlet of the centrifugal blower. The heat transfer plates extend into the heat dissipater so as to increase heat transfer efficiency between a heat generating electronic component and the heat dissipater.
    Type: Application
    Filed: August 16, 2007
    Publication date: December 25, 2008
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIN-GONG MENG, CHING-BAI HWANG
  • Patent number: 7434610
    Abstract: A heat dissipation apparatus (10) includes a heat-dissipating fan (14) and a fin assembly (12). The heat-dissipating fan includes a casing (141) and a plurality of blades (142) rotatably received in the casing. The casing defines an air outlet (148) through which an airflow generated by the blades flows. The fin assembly is disposed at the air outlet of the fan, and includes a plurality of first fins (121) and a plurality of second fins (122) disposed between the first fins and the blades of the fan. The second fins are so positioned that outer ends of the second fins are oriented toward a far side of the air outlet while inner ends of the second fins are oriented toward a near side of the air outlet. The outer ends of the second fins are located adjacent to the first fins. An airflow generated by the blades first flows to the near side and then to the far side of the air outlet.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: October 14, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Ran Lin, Jin-Gong Meng
  • Publication number: 20080247134
    Abstract: A heat dissipation apparatus (100) includes a centrifugal blower (20) and a heat dissipater (10). The centrifugal blower includes a casing (22), a stator accommodated in the casing, and a rotor (24) rotatable disposed around the stator. The casing includes a base wall (224), a sidewall (226) surrounding the base wall and a cover (222) attached to the sidewall. The sidewall defines an air outlet (221) therein. An air channel (223) is formed between blades (242) of the rotor and an inner surface of the sidewall of the casing. The heat dissipater is made of porous material and disposed at the air outlet of the centrifugal blower. The heat dissipater has a tongue portion (12) extending into a part of the air channel.
    Type: Application
    Filed: May 9, 2007
    Publication date: October 9, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, JIE ZHANG
  • Publication number: 20080093056
    Abstract: A thermal module (100) includes a centrifugal blower (10) including a base plate (142), a top cover (16) and a sidewall (144) disposed between the base plate and the top cover and defining two air outlets (148a, 148b) therein; two fin assemblies (20a, 20b) are disposed at the air outlets of the centrifugal blower; two heat pipes (30, 40) are thermally connected with the fin assemblies and stacked along a height direction of the thermal module, which is substantially perpendicular to the base plate of the centrifugal blower. Each of the heat pipes thermally connects with a corresponding electronic component for transferring heat of the two electronic components to the two fin assemblies to be dissipated to ambient air.
    Type: Application
    Filed: January 23, 2007
    Publication date: April 24, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, JIE ZHANG