Patents by Inventor Jin-Gong Meng
Jin-Gong Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080087405Abstract: A heat spreader (100) includes a metal casing (60) formed by electrodeposition and defining a vapor chamber (40) therein, and a mesh (12b) lining an inner surface of the metal casing. A method for manufacturing the heat spreader includes: providing a core (60a) having a mesh layer (12a) including a plurality of pores and a filling material (14) filled in the pores of the mesh layer and a major space enclosed by the mesh layer; electrodepositing a layer of metal coating (60b) on an outer surface of the core; removing the filling material from the coating layer and the pores of the mesh layer; and filling a working fluid into the coating layer and hermetically sealing the coating layer to thereby obtain the heat spreader with therein a wick structure (12) formed by the mesh layer and the vapor chamber formed by said major space.Type: ApplicationFiled: March 15, 2007Publication date: April 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: JIN-GONG MENG, CHING-BAI HWANG
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Publication number: 20080023176Abstract: A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.Type: ApplicationFiled: July 31, 2006Publication date: January 31, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Jie-Bo Peng, Jin-Gong Meng, Ching-Bai Hwang, Jui-Wen Hung
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Publication number: 20080017358Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of laminar fins (121) thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow flowing through the fin assembly to take heat away therefrom. The centrifugal blower includes a housing (141), a cover (142) disposed on the housing, and a rotor (143) rotatably received in a space formed between the housing and the cover. The fins of the fin assembly are disposed in the housing of the centrifugal blower and stacked together along a direction substantially parallel to a rotation axis (A) of the rotor.Type: ApplicationFiled: July 20, 2006Publication date: January 24, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, Jin-Gong Meng
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Publication number: 20080011454Abstract: A heat dissipation apparatus (10) includes a centrifugal blower (14) defining an air outlet (148) therein; and a fin assembly (12) is disposed at the air outlet of the centrifugal blower. The fin assembly includes an arc portion (121) and a rectangular portion (122) extending from an end of the arc portion. The arc portion includes a plurality of first fins (123), whilst the rectangular portion includes a plurality of second fins (124). The first fins form a plurality of sector-shaped passages (131) therebetween, whilst the second fins form a plurality of rectangular-shaped passages (132) therebetween.Type: ApplicationFiled: December 22, 2006Publication date: January 17, 2008Inventors: CHING-BAI HWANG, JIN-GONG MENG
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Publication number: 20080011460Abstract: A heat dissipation apparatus (10) includes a heat-dissipating fan (14) and a fin assembly (12). The heat-dissipating fan includes a casing (141) and a plurality of blades (142) rotatably received in the casing. The casing defines an air outlet (148) through which an airflow generated by the blades flows. The fin assembly is disposed at the air outlet of the fan, and includes a plurality of first fins (121) and a plurality of second fins (122) disposed between the first fins and the blades of the fan. The second fins are so positioned that outer ends of the second fins are oriented toward a far side of the air outlet while inner ends of the second fins are oriented toward a near side of the air outlet. The outer ends of the second fins are located adjacent to the first fins. An airflow generated by the blades first flows to the near side and then to the far side of the air outlet.Type: ApplicationFiled: July 13, 2006Publication date: January 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, Ran Lin, Jin-Gong Meng
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Publication number: 20080011461Abstract: A heat dissipation apparatus (10) includes a centrifugal blower (12) and a fin assembly (11) having a plurality of fins (111) disposed at an air outlet (129) of the centrifugal blower. The centrifugal blower includes a first tongue (130) distant from the fin assembly, and a second tongue (131) located between the first tongue and the air outlet of the blower. The second tongue has an end (132) substantially parallel to the fins of the fin assembly to guide an airflow smoothly flowing through the fins.Type: ApplicationFiled: July 14, 2006Publication date: January 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Ching-Bai Hwang, Jin-Gong Meng, Ran Lin
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Patent number: 7304847Abstract: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.Type: GrantFiled: April 26, 2006Date of Patent: December 4, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ching-Bai Hwang, Jin-Gong Meng
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Publication number: 20070272395Abstract: A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.Type: ApplicationFiled: May 25, 2006Publication date: November 29, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, Jin-Gong Meng
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Publication number: 20070267172Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of fins (121) for thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow flowing through the fin assembly to take heat away therefrom. The centrifugal blower includes a housing (141), a cover (142) mounted on the housing with an inner space formed therebetween, and a rotor including a plurality of blades (143) rotatably disposed in the inner space. The rotor has a rotation axis (A). The fins of the fin assembly are arranged at an air outlet (151) of the centrifugal blower and stacked together along a direction parallel to the rotation axis of the rotor of the centrifugal blower.Type: ApplicationFiled: May 16, 2006Publication date: November 22, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIN-GONG MENG
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Publication number: 20070253769Abstract: A fastening device (10) for mounting a first member (12) to a second member, the fastening device includes base member (14) and a resilient spring member (15). The base member includes a contacting plate (141) contacting with the second member, and a receiving channel for (147) receiving a portion of the first member therein. The resilient spring member includes two ends for being attached to a board with the second member mounted thereon, and a middle portion contacted with the first member to sandwich the first member between the second member and the spring member.Type: ApplicationFiled: April 26, 2006Publication date: November 1, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIE-BO PENG, JIN-GONG MENG
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Publication number: 20070251675Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12), and a heat pipe (14) including an evaporator section (141) and a curve shaped condenser section (142). The evaporator section of the heat pipe thermally contacts with the heat-generating electronic component, and the condenser section of the heat pipe is disposed on the fin assembly along a longitudinal axis of the fin assembly. The condenser section has a serpentine configuration.Type: ApplicationFiled: April 26, 2006Publication date: November 1, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIN-GONG MENG, JIE-BO PENG
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Publication number: 20070251677Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat generating electronic component includes a fin assembly (14) thermally connecting with the heat-generating electronic component to absorb heat therefrom, and a heat-dissipating fan (12) for providing an airflow to take heat away from the fin assembly. The heat-dissipating fan includes a bottom housing (124), a top cover (125) mounted on the bottom housing to form a space therebetween, and a rotor with a plurality of blades (122) accommodated in the space. The top cover extends a plurality of guiding plates (127) therefrom for guiding the airflow from the blades toward the fin assembly.Type: ApplicationFiled: April 26, 2006Publication date: November 1, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIN-GONG MENG
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Publication number: 20070188992Abstract: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.Type: ApplicationFiled: April 26, 2006Publication date: August 16, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIN-GONG MENG
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Publication number: 20070068659Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component includes a base plate (11), and at least a fin assembly (14) disposed on the base plate. The fin assembly includes a plurality of fins (140) stacked together along a predetermined direction. At least a part of the fins each has a main body (141) forming an acute angle with the stack direction thereof.Type: ApplicationFiled: May 25, 2006Publication date: March 29, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JIN-GONG MENG
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Publication number: 20070017814Abstract: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.Type: ApplicationFiled: January 9, 2006Publication date: January 25, 2007Inventors: Ching-Bai Hwang, Jin-Gong Meng
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Publication number: 20070006993Abstract: A flat type heat pipe (10) is disclosed which includes a metal casing (12) and a wick structure (16) arranged inside the metal casing. The metal casing has an evaporating section (123) and a condensing section (124). The wick structure extends from the evaporating section towards the condensing section of the metal casing and has a first section in conformity with the condensing section of the metal casing and a second section in conformity with the evaporating section of the metal casing. The first section has a pore size larger than that of the second section of the wick structure. The wick structure includes a metal foam.Type: ApplicationFiled: December 28, 2005Publication date: January 11, 2007Inventors: Jin-Gong Meng, Ching-Bai Hwang