Patents by Inventor Jin-Gyu Kim

Jin-Gyu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11069506
    Abstract: A sample stage includes a sample holder that accommodates a sample and a first drive module, a second drive module, and a third drive module that are radially connected to the sample holder and allow the sample holder to have translational degrees of freedom in three directions and rotational degrees of freedom in at least two directions.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: July 20, 2021
    Assignee: Korea Basic Science Institute
    Inventors: Sang-Chul Lee, Jongman Jeong, Jin-Gyu Kim, Cheolsu Han
  • Patent number: 10458597
    Abstract: The present invention is related to a corner panel of an LNG cargo that includes a main body, which constitutes a corner area of the cargo, and a stress diverging part, which reduces the convergence of stress of the main body by being integrated with an internal face of the main body and being formed with curvature. Therefore, by forming the corner area of the LNG cargo in a single body having a round-shaped curvature, convergence of stress caused by the deformation of the hull and thermal deformation can be prevented, and possibility of crack in a secondary barrier can be removed. By allowing the secondary barrier to be formed in a curved shape, the constructability of the secondary barrier can be greatly improved. Since no hardwood key or plywood is required, the thickness of a primary barrier can be reduced as the stress is decreased and the reliability of the secondary barrier is improved, and the weight can be greatly reduced over the conventional cargo corner area.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: October 29, 2019
    Assignee: SAMSUNG HEAVY IND. CO., LTD.
    Inventors: Ki-Hun Joh, Sang-Eon Chun, Chang-Seon Bang, Dai-Gil Lee, Byung-Chul Kim, Bu-Gi Kim, Jin-Gyu Kim, Soon-Ho Yoon, Sang-Wook Park, Kwan-Ho Lee, Byoung-Jung Kim, Po-Chul Kim, Ha-Na Yu
  • Publication number: 20190066970
    Abstract: A sample stage includes a sample holder that accommodates a sample and a first drive module, a second drive module, and a third drive module that are radially connected to the sample holder and allow the sample holder to have translational degrees of freedom in three directions and rotational degrees of freedom in at least two directions.
    Type: Application
    Filed: October 31, 2018
    Publication date: February 28, 2019
    Applicant: Korea Basic Science Institute
    Inventors: Sang-Chul Lee, Jongman Jeong, Jin-Gyu Kim, Cheolsu Han
  • Patent number: 10132446
    Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG HEAVY IND. CO., LTD
    Inventors: Ki-Hun Joh, Sang-Eon Chun, Chang-Seon Bang, Dai-Gil Lee, Byung-Chul Kim, Bu-Gi Kim, Jin-Gyu Kim, Soon-Ho Yoon, San-Wook Park, Kwan-Ho Lee, Seong-Su Kim, Byoung-Jung Kim, Po-Chul Kim, Ha-Na Yu, Yong-Suk Suh, Sang-Min Han, Jong-Won Yoon, Jae-Yeon Choi, Hee-Jin Son
  • Patent number: 10068878
    Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: September 4, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-gyu Kim, Ji-sun Hong, Su-jung Hyung, Hyun-ki Kim, Hyun Lee
  • Patent number: 9867283
    Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: January 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-gyu Kim, Hyun Lee, Dong-han Kim
  • Patent number: 9730323
    Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: August 8, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Gyu Kim, Jung Woo Kim, Tae Hun Kim, Kyoung Sei Choi
  • Publication number: 20170108169
    Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.
    Type: Application
    Filed: October 27, 2016
    Publication date: April 20, 2017
    Inventors: Ki-Hun JOH, Sang-Eon CHUN, Chang-Seon BANG, Dai-Gil LEE, Byung-Chul KIM, Bu-Gi KIM, Jin-Gyu KIM, Soon-Ho YOON, San-Wook PARK, Kwan-Ho LEE, Seong-Su KIM, Byoung-Jung KIM, Po-Chul KIM, Ha-Na YU, Yong-Suk SUH, Sang-Min HAN, Jong-Won YOON, Jae-Yeon CHOI, Hee-Jin SON
  • Publication number: 20170064818
    Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.
    Type: Application
    Filed: June 29, 2016
    Publication date: March 2, 2017
    Inventors: Jin-gyu KIM, Hyun LEE, Dong-han KIM
  • Publication number: 20170038007
    Abstract: The present invention is related to a corner panel of an LNG cargo that includes a main body, which constitutes a corner area of the cargo, and a stress diverging part, which reduces the convergence of stress of the main body by being integrated with an internal face of the main body and being formed with curvature. Therefore, by forming the corner area of the LNG cargo in a single body having a round-shaped curvature, convergence of stress caused by the deformation of the hull and thermal deformation can be prevented, and possibility of crack in a secondary barrier can be removed. By allowing the secondary barrier to be formed in a curved shape, the constructability of the secondary barrier can be greatly improved. Since no hardwood key or plywood is required, the thickness of a primary barrier can be reduced as the stress is decreased and the reliability of the secondary barrier is improved, and the weight can be greatly reduced over the conventional cargo corner area.
    Type: Application
    Filed: October 20, 2016
    Publication date: February 9, 2017
    Inventors: Ki-Hun JOH, Sang-Eon CHUN, Chang-Seon BANG, Dai-Gil LEE, Byung-Chul KIM, Bu-Gi KIM, Jin-Gyu KIM, Soon-Ho YOON, Sang-Wook PARK, Kwan-Ho LEE, Byoung-Jung KIM, Po-Chul KIM, Ha-Na YU
  • Publication number: 20170040293
    Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.
    Type: Application
    Filed: July 20, 2016
    Publication date: February 9, 2017
    Inventors: Jin-gyu KIM, Ji-sun HONG, Su-jung HYUNG, Hyun-ki KIM, Hyun LEE
  • Publication number: 20150270190
    Abstract: A semiconductor package is provided. The semiconductor package includes a substrate, a semiconductor chip mounted on an upper surface of the substrate, an encapsulant formed to cover sides of the semiconductor chip on the upper surface of the substrate, a heat transfer layer formed on the upper surface of the semiconductor chip and an upper surface of the encapsulant, and a heat slug including a plurality of metal plates disposed to be spaced apart from each other on an upper surface of the heat transfer layer.
    Type: Application
    Filed: September 26, 2014
    Publication date: September 24, 2015
    Inventors: Jin-Gyu KIM, Tae-Woo KANG, Tae-Hun KIM
  • Publication number: 20150245487
    Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.
    Type: Application
    Filed: September 9, 2014
    Publication date: August 27, 2015
    Inventors: Jin Gyu KIM, Jung Woo KIM, Tae Hun KIM, Kyoung Sei CHOI
  • Publication number: 20150114970
    Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Inventors: Ki-Hun JOH, Sang-Eon CHUN, Chang-Seon BANG, Dai-Gil LEE, Byung-Chul KIM, Bu-Gi KIM, Jin-Gyu KIM, Soon-Ho YOON, Sang-Wook PARK, Kwan-Ho LEE, Seong-Su KIM, Byoung-Jung KIM, Po-Chul KIM, Ha-Na YU, Yong-Suk SUH, Sang-Min HAN, Jong-Won YOON, Jae-Yeon CHOI, Hee-Jin SON
  • Patent number: 9017565
    Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: April 28, 2015
    Assignee: Samsung Heavy Ind. Co., Ltd.
    Inventors: Ki-Hun Joh, Sang-Eon Chun, Chang-Seon Bang, Dai-Gil Lee, Byung-Chul Kim, Bu-Gi Kim, Jin-Gyu Kim, Soon-Ho Yoon, Sang-Wook Park, Kwan-Ho Lee, Byoung-Jung Kim, Po-Chul Kim, Ha-Na Yu
  • Patent number: D885944
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: June 2, 2020
    Assignee: GOLFZON CO., LTD.
    Inventor: Jin-gyu Kim
  • Patent number: D892647
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 11, 2020
    Assignee: GOLFZON CO., LTD.
    Inventor: Jin-gyu Kim
  • Patent number: D892648
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 11, 2020
    Assignee: GOLFZON CO., LTD.
    Inventor: Jin-gyu Kim
  • Patent number: D892649
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 11, 2020
    Assignee: GOLFZON CO., LTD.
    Inventor: Jin-gyu Kim
  • Patent number: D892650
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 11, 2020
    Assignee: GOLFZON CO., Ltd.
    Inventor: Jin-gyu Kim