Abstract: A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.

Abstract: A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer including a via hole; and a via disposed in the via hole of the insulating layer, wherein the via includes; a connection portion disposed in the via hole of the insulating layer; a first pad disposed on an upper surface of the insulating layer and an upper surface of the connection portion; and a second pad disposed under a lower surface of the insulating layer and a lower surface of the connection portion, wherein the upper surface of the connection portion has a concave shape in a downward direction, the lower surface of the connection portion has a concave shape in an upward direction, a lower surface of the first pad has a convex shape corresponding to the upper surface of the connection portion, and an upper surface of the second pad has a convex shape corresponding to the lower surface of the connection portion.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

Abstract: According to various embodiments, there is provided a wearable electronic device including a main body, at least one strap connected to at least one part of the main body, a buckle installed to an end portion of the strap, and a connection member for connecting the buckle and the strap. Accordingly, hardness and aesthetic feeling can be improved, while improving an assembling capability, reducing a manufacturing cost, and contributing to a slimness of the device.