Abstract: The present invention can provide a flexible touch sensor including: a body in which a first circuit pattern layer, a first nanoweb layer, a base layer, a second nanoweb layer, and a second circuit pattern layer are disposed to be sequentially stacked; a flexible circuit board connected to any one of the first and second circuit pattern layers of the body; and a connection part connecting the body and the flexible circuit board, wherein the connection part includes an anisotropic conductive film, and wherein when wound around a cylindrical mandrel with a diameter of 4 mm, a crack having a length of 3 mm or more does not occur, whereby the flexible touch sensor has excellent flexibility and can be transformed into various shapes.

Abstract: A heat transfer member is provided. The heat transfer member includes a carbon-based sheet having an x-y plane, where the carbon-based sheet include: a heat transfer unit including a first part and a second part that are spaced apart from each other in an x-axis direction; and a shape deformation unit, located between the first part and the second part, that is bent by an external force which is applied so as to make the first part and the second part have different heights or plane directions. Due to this feature, the heat transfer member has excellent bending characteristics capable of connecting structures which are located on different planes or spaced apart from each other with a different in height without causing damage such as cracks.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A method for separate control of heating, ventilation, or air conditioning (HVAC) for a vehicle includes: determining if a set condition is satisfied, such that separate HVAC control is possible, when HVAC is performed; detecting a passenger count, an HVAC thermal load, and a relative humidity; performing HVAC in a first mode for front seats when no passenger is detected in the front passenger seat at the detecting step; selectively performing HVAC in a second mode for the front seats by comparing the HVAC thermal load with a set load; and adjusting a mixing ratio between inside and outside air, set depending on the relative humidity, by selectively reducing or increasing a quantity of inside air and a quantity of outside air depending on the passenger count.

Abstract: An air extractor grille duct includes: an air extractor grille configured to be selectively opened due to a pressure difference between the interior and exterior of a vehicle so that interior air is discharged; a duct housing connected to the air extractor grille and configured to provide a discharge path for the interior air; and a sound-absorbing cover connected to the duct housing, provided with an inclined surface, and configured to guide discharged interior air to flow along the inclined surface toward the discharge path.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: A method of controlling air conditioning for occupants through seating detection includes: determining whether an entire air conditioning condition is satisfied when an air conditioner is operated and performing air conditioning for the entire vehicle when the entire air conditioning condition is satisfied; detecting whether an occupant is seated on a rear seat and performing air conditioning for the entire vehicle when it is determined that the occupant is seated on the rear seat; detecting whether the occupant is seated on a front occupant seat when it is determined that the occupant is not seated on the rear seat; determining a heat load condition by comparing an outdoor air temperature and an interior temperature; and performing air conditioning control in consideration of whether the occupant is seated on the front occupant seat and the heat load condition.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: A detachable remote controller and a remote controlling method of controlling an air conditioner of an autonomous vehicle are provided. The detachable remote controller may be configured to control the air conditioner to be detachable from a console box or a front console box by a detachment button.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A composition for preventing or treating synucleinopathies, which includes nevirapine or a salt or solvate thereof and a pharmaceutically acceptable carrier, is provided. The composition is useful in preventing or treating synucleinopathies, such as Parkinson's disease, dementia with Lewy bodies, and multiple system atrophy, because the composition serves to hinder cell-to-cell transmission of ?-synuclein, prevent intracellular aggregation of ?-synuclein, and inhibit transmission of aggregated ?-synuclein.

Abstract: A composition for preventing or treating synucleinopathies, which includes efavirenz or a salt or solvate thereof and a pharmaceutically acceptable carrier, is provided. The composition is useful in preventing or treating synucleinopathies, such as Parkinson's disease, dementia with Lewy bodies, and multiple system atrophy, because the composition serves to hinder cell-to-cell transmission of alpha-synuclein, prevent intracellular aggregation of ?-synuclein, and inhibit transmission of aggregated ?-synuclein.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: An air conditioning device for a vehicle and a method of controlling the same are provided. The air conditioning device includes a touch input unit which is configured to be touched, rotated by 360 degrees, and dragged by a user. A touch sensor unit includes three channel regions formed by trisecting a rotational region of 360 degrees and is configured to detect capacitance in accordance with touch areas of a first channel, a second channel, and a third channel at predetermined positions in the three channel regions. Three channel signal output units output signals from the respective channels in accordance with the recognized capacitance.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.