Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A washing machine which performs a washing operation by heating water, a detergent, or a wash liquid using a dielectric heating method and a method of controlling the washing machine. The washing machine may include a water supply portion which supplies a wash liquid including water and a detergent, a power supply portion which supplies alternating current (AC) power, and an electric field forming portion which forms an electric field between a first electrode portion and a second electrode portion according to the AC power to heat the supplied wash liquid.

Abstract: A dryer includes a main body, a drying chamber provided inside the main body and configured to accommodate objects to be dried, a conveying unit configured to convey the objects to be dried, a sensor unit configured to sense information on states of the objects to be dried, and a control unit configured to control the conveying unit to move the objects to be dried based on the information sensed by the sensor unit.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A source driver includes a buffer unit including a plurality of unit buffers corresponding to a plurality of source lines, where each of the plurality of unit buffers includes a plurality of input terminals and an output terminal connected to at least one of the plurality of source lines, and a decoder unit configured to receive image data and a plurality of gamma voltages, and input at least one of the plurality of gamma voltages to the plurality of input terminals of each of the plurality of unit buffers, using the image data. The decoder unit inputs two or more of the gamma voltages, having different magnitudes, to the plurality of input terminals of each of first unit buffers among the plurality of unit buffers, and the first unit buffers output a gradation voltage higher than a first voltage and lower than a second voltage.

Abstract: It is an aspect of the present disclosure to provide a motor driving apparatus, and a method of controlling the same. In accordance with one aspect of the present disclosure, the motor driving apparatus includes an inverter configured to supply driving power to a motor; a sensing unit configured to sense a DC voltage supplied to the inverter and a driving current supplied from the inverter to the motor; and a controller configured to compensate for an iron loss and a copper loss by calculating a loss of the motor based on the sensed DC voltage and driving current and controlling the inverter to adjust the driving current based on the calculated loss of the motor.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A magnetic cooling apparatus may include a fixing module and a rotation module rotatably provided at the fixing module. The fixing module includes a plurality of magnetic regenerators and a thermal fluid supply apparatus allowing thermal fluid to exchange with the plurality of magnetic regenerators, and the thermal fluid supplying apparatus is configured to operate by the rotation module without an additional configuration, which enables the magnetic cooling apparatus to have a similar configuration.

Abstract: A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. The redistribution structure may include a linear portion and a bump pad, and a conductive bump on the bump pad may include a main bump and a protruding part extending toward the linear portion, where the protruding part may be smaller than the main bump.

Abstract: A motor driving device is disclosed. The motor driving device includes: a rectifier rectifying alternating current (AC) power into direct current (DC) power to output an input voltage; a first buck-boost converter including a plurality of switches for converting the input voltage and having a buck mode of stepping down the input voltage and a boost mode of stepping up the input voltage; an inverter converting a DC-link voltage transformed from the first buck-boost converter into an AC voltage and transferring the AC voltage to a motor; and a controller receiving motor information related to driving of the motor, comparing magnitudes of a desired DC-link voltage depending on the received motor information and the input voltage with each other, and performing a control to switch only any one of the plurality of switches so that the first buck-boost converter is operated in the buck mode or the boost mode.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: An artificial intelligence voice interactive system may provide various services to a user in response to a voice command.

Abstract: A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: The present invention relates to a liquid rocket engine using a booster pump driven by an electric motor, and more particularly, to a liquid rocket engine using a booster pump driven by an electric motor in which a booster pump is installed between a propellant tank and a propellant pump so that a requirement for an inlet pressure of the propellant pump may be met even in a state in which an internal pressure of the propellant tank is reduced, resulting in reduced amount of a propellant and reduced weight of the propellant tank, and the electric motor configured to drive the booster pump may be efficiently cooled through an oxidant, a cooling line, and the like.

Abstract: The present invention relates to a liquid rocket engine using a pump driven by an electric motor, and more particularly, to a liquid rocket engine using a pump driven by an electric motor instead of using a gas generator and a turbine so that a system may be simplified, and an overheated electric motor may be efficiently cooled by circulating a propellant (an oxidant or a fuel).

Abstract: A terminal may be provided with a magnetic regenerator unit using a magnetocaloric effect of magnetocaloric materials and a magnetic cooling system having the same. By a circular magnetic regenerator structure capable of evenly flowing heat transfer fluid and magnetic field and the flow of the heat transfer fluid being changed in the same way, and a magnetic band having a relative permeability, similar to a relative permeability of the magnetic regenerator, high efficiency of a flux generator may be obtained while reducing torque of a rotator. Power consumption for driving may be reduced due to the reduction of the cogging torque, and the magnetic band may be manufactured at a low cost by using inexpensive iron powder.