Patents by Inventor Jin-Ho Hong
Jin-Ho Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124627Abstract: An encapsulant composition for an optical device; comprises an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance. An encapsulant film for an optical device using the same is also provided.Type: ApplicationFiled: November 10, 2022Publication date: April 18, 2024Applicant: LG Chem, Ltd.Inventors: Jin Kuk Lee, Eun Jung Lee, Sang Eun Park, Sang Hyun Hong, Young Woo Lee, Jung Ho Jun
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Patent number: 11942279Abstract: A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO3, Al2O3, SiO2 and ZrO2, and a coating film disposed on a surface of the core.Type: GrantFiled: November 16, 2022Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho Hong, Young Seuck Yoo, Hee Sung Choi, Young June Lee
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Publication number: 20240089124Abstract: Disclosed herein are an apparatus and method for mutual authentication of quantum entities based on Measurement-Device-Independent Quantum Key Distribution (MDI-QKD). The method may include configuring a quantum input form based on an authentication key shared in advance with a counterpart entity, applying polarization modulation to the configured quantum input form, transmitting the quantum input form to which polarization modulation is applied to a quantum measurement device, and authenticating the counterpart entity by checking whether the counterpart entity configures a quantum input form according to the shared authentication key using a measurement result and information about polarization modulation.Type: ApplicationFiled: March 24, 2023Publication date: March 14, 2024Inventors: Chang-Ho HONG, Se-Wan JI, O-Sung KWON, Youn-Chang JEONG, Eun-Ji KIM, Seok KIM, Haeng-Seok KO, Dae-Sung KWON, Jin-Gak JANG
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Publication number: 20230215663Abstract: A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO3, Al2O3, SiO2 and ZrO2, and a coating film disposed on a surface of the core.Type: ApplicationFiled: November 16, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho HONG, Young Seuck YOO, Hee Sung CHOI, Young June LEE
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Patent number: 11688554Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.Type: GrantFiled: March 1, 2021Date of Patent: June 27, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Ho Hong, Hyun Sub Oh, Youn Soo Kim, Hong Kyu Shin, Hee Sung Choi
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Publication number: 20230140133Abstract: A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.Type: ApplicationFiled: June 7, 2022Publication date: May 4, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Hyun Lee, Jin Ho Hong, Hyun Sub Oh, Youn Soo Kim, Jae Bum Cho, Hee Sung Choi
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Patent number: 11521801Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.Type: GrantFiled: May 19, 2020Date of Patent: December 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho Hong, Youn Soo Kim, Oh Choon Kwon, Hyun Sub Oh
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Patent number: 11495392Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.Type: GrantFiled: September 11, 2019Date of Patent: November 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ye Eun Jeong, Jin Ho Hong
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Publication number: 20220093327Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.Type: ApplicationFiled: March 1, 2021Publication date: March 24, 2022Inventors: Jin Ho Hong, Hyun Sub Oh, Youn Soo Kim, Hong Kyu Shin, Hee Sung Choi
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Publication number: 20220013302Abstract: The present disclosure relates to a solid electrolytic capacitor, including a body comprising a tantalum wire disposed on one end thereof; a substrate, on which the body is disposed, comprising an insulating layer, first and second wiring layers respectively disposed on a first surface and a second surface, facing each other, of the insulating layer, and a via electrode penetrating the insulating layer to connect the first and second wiring layers to each other; and a connection portion connecting the tantalum wire to the first wiring layer.Type: ApplicationFiled: November 11, 2020Publication date: January 13, 2022Inventors: Youn Soo KIM, Hyun Sub OH, Hee Sung CHOI, Hong Kyu SHIN, Jin Ho HONG, Yong Sam LEE, Jung Youn KIM, Ran Suk YANG
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Publication number: 20210166886Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.Type: ApplicationFiled: May 19, 2020Publication date: June 3, 2021Inventors: Jin Ho Hong, Youn Soo Kim, Oh Choon Kwon, Hyun Sub Oh
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Patent number: 10847300Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.Type: GrantFiled: July 5, 2017Date of Patent: November 24, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Woo Choi, Jin Ho Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang, Tae Hong Min
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Publication number: 20200185141Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.Type: ApplicationFiled: September 11, 2019Publication date: June 11, 2020Inventors: Ye Eun JEONG, Jin Ho HONG
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Publication number: 20200090848Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.Type: ApplicationFiled: November 25, 2019Publication date: March 19, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sa Yong LEE, Yong Il KWON, Jin Ho HONG, Sung Han KIM, Keun Yong LEE
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Publication number: 20180130595Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.Type: ApplicationFiled: July 5, 2017Publication date: May 10, 2018Inventors: Jung Woo Choi, Jin Ho Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang, Tae Hong Min
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Publication number: 20170086292Abstract: A prepreg includes a core layer, a first resin layer including a first resin material and laminated on a first side of the core layer, the first resin material impregnating a portion of the core layer, and a second resin layer including a second resin material and laminated on a second side of the core layer, the second resin material impregnating a portion of the core layer so as to form a non-linear joint interface with the first resin material.Type: ApplicationFiled: July 5, 2016Publication date: March 23, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun-Sil KIM, Keun-Yong LEE, Seong-Hyun YOO, Sang-Hyun SHIN, Jin-Ho HONG
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Patent number: 9288902Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.Type: GrantFiled: December 4, 2013Date of Patent: March 15, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Sil Kim, Sung Han Kim, Sa Yong Lee, Jin Ho Hong, Yong Il Kwon, Sang Hyun Shin, Keun Yong Lee
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Patent number: 9236177Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.Type: GrantFiled: December 5, 2013Date of Patent: January 12, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju-Hwan Yang, Won-Chul Sim, Chang-Bae Lee, Jin-Ho Hong, Keun-Yong Lee, Sa-Yong Lee, Young-Do Kweon
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Publication number: 20150114696Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof.Type: ApplicationFiled: October 27, 2014Publication date: April 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho Hong, Keun Yong Lee, Sung Han Kim, Sa Yong Lee, Sang Hyun Shin
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Publication number: 20150114691Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof.Type: ApplicationFiled: October 27, 2014Publication date: April 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho HONG, Sang Hyun Shin, Sa Yong Lee, Sung Han Kim, Keun Yong Lee