Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer.

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract: The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.

Abstract: A method for estimating a friction coefficient between a tire of a vehicle and a road surface, which may be used in obtaining a safety distance for an adaptive vehicle, estimating the friction coefficient by using state variables that are measured by means of RPM sensors normally equipped on vehicles. A device for estimating a friction coefficient has a control section receiving signals from a braking/steering monitoring section and outputting the friction coefficient stored in a friction coefficient value storage when both or either of a braking action and a steering action are applied to the vehicle, and outputting the friction coefficient estimated by a friction coefficient estimator when the braking action and the steering action are not applied to the vehicle.

Abstract: A method for estimating a friction coefficient between a tire of a vehicle and a road surface, which may be used in obtaining a safety distance for an adaptive vehicle, estimating the friction coefficient by using state variables that are measured by means of RPM sensors normally equipped on vehicles. A device for estimating a friction coefficient has a control section receiving signals from a braking/steering monitoring section and outputting the friction coefficient stored in a friction coefficient value storage when both or either of a braking action and a steering action are applied to the vehicle, and outputting the friction coefficient estimated by a friction coefficient estimator when the braking action and the steering action are not applied to the vehicle.