Patents by Inventor Jin-Hoon Cho

Jin-Hoon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12151607
    Abstract: A brake lamp control method of a vehicle is provided. The method includes determining whether a deceleration of the vehicle based on regenerative brake through the electric motor is present in a hysteresis period between an off threshold as a reference for turning off a brake lamp and an on threshold as a reference for turning on the brake lamp. When the deceleration of the vehicle is present in the hysteresis period, the method includes determining a state of the brake lamp before the deceleration of the vehicle enters the hysteresis period. In response to determining that the brake lamp is turned on or off for a reason except for the regenerative brake before the deceleration of the vehicle enters the hysteresis period, a request for turning on the brake lamp is set or reset based on the regenerative brake in response to the determined state of the brake lamp.
    Type: Grant
    Filed: November 2, 2023
    Date of Patent: November 26, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hui Un Son, Sang Joon Kim, Kyu Hwan Jo, Sung Bae Jeon, Sung Hoon Yu, Joo Young Kim, Jin Kyeom Cho
  • Publication number: 20240365666
    Abstract: Disclosed herein is a method for fabricating an organic light-emitting diode. In the method for fabricating an organic light-emitting diode, an organic compound with a substituent in a specific structure is used as a deposition material for an organic layer, whereby the deposition temperature can be reduced, with the consequent minimization of thermal damage to the organic light-emitting diode.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 31, 2024
    Inventors: Jin-Hwi Cho, So Young Shim, Taejung Yu, Sung-Hoon Joo
  • Publication number: 20240332265
    Abstract: An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.
    Type: Application
    Filed: May 30, 2024
    Publication date: October 3, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: In Hyuk KIM, Dong Gyun KIM, Jae Hoon JUNG, Jin Oh KWAG, Hee Yeon YOO, Sung Chan JO, Jeong In CHOI, Hye Jung HONG, Jong Hyuk KANG, Dong Eon LEE, Hyun Min CHO
  • Patent number: 12103036
    Abstract: There is provided a multi-slot die coater that is easy to adjust a coating gap and can achieve widthwise deviation control of the coating gap. According to the present disclosure, a step is formed between rear surfaces of die blocks through a fixing block including a step adjustment block. The step adjustment block has a preset thickness, and the step adjustment block is mounted between any one die block and a flat plate-shaped block, and the other die block is coupled to the flat plate-shaped block, and thus the step is naturally formed between the rear surfaces of the die blocks by the coupling of the die blocks to the fixing block including the step adjustment block.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: October 1, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Taek-Soo Lee, Shin-Wook Jeon, Sang-Hoon Choy, Jin-Ho Cho
  • Patent number: 12107035
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: October 1, 2024
    Assignee: Amkor Technology Singapore Holdings Pte. Ltd.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 12088330
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: September 10, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20240253551
    Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a first ramp platform telescopically movable with respect to the housing, a second ramp platform telescopically movable with respect to the first ramp platform, a third ramp platform configured movable with respect to the second ramp platform, a hinge mechanism configured to move the first ramp platform between a stowed position and a deployed position and to allow the first ramp platform to pivot with respect to the housing in a state in which the first ramp platform is in the deployed position, and a drive mechanism configured to move the second ramp platform and the third ramp platform.
    Type: Application
    Filed: October 10, 2023
    Publication date: August 1, 2024
    Inventors: Kyu Hoon Cho, Jae Seung Lee, Jin Pyung Park, Min Jae Lee
  • Publication number: 20240253552
    Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a ramp assembly movable between a stowed position in which the ramp assembly is stowed in a cavity of the housing and a deployed position in which the ramp assembly is deployed or extended from the cavity of the housing, the ramp assembly including one or more ramp platforms telescopically connected to each other, and a front cover bridging between a leading end portion of the housing and a trailing end portion of the ramp assembly in a state in which the ramp assembly is in the deployed position.
    Type: Application
    Filed: October 10, 2023
    Publication date: August 1, 2024
    Inventors: Kyu Hoon Cho, Jae Seung Lee, Jin Pyung Park, Min Jae Lee
  • Publication number: 20240253550
    Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a ramp assembly movable between a stowed position in which the ramp assembly is stowed in a cavity of the housing and a deployed position in which the ramp assembly is deployed or extended from the cavity of the housing, the ramp assembly including one or more ramp platforms telescopically connected to each other, a hinge mechanism including a moving body movably mounted in the housing and a hinge shaft pivotally connecting the ramp assembly to the moving body, and a guide mechanism configured to guide pivoting of the ramp assembly.
    Type: Application
    Filed: October 10, 2023
    Publication date: August 1, 2024
    Inventors: Kyu Hoon Cho, Jae Seung Lee, Jin Pyung Park, Min Jae Lee
  • Publication number: 20240253553
    Abstract: In an embodiment a ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a first ramp platform telescopically moving with respect to the housing, a second ramp platform telescopically moving with respect to the first ramp platform and an upper sub-platform pivotally mounted between the first ramp platform and the second ramp platform.
    Type: Application
    Filed: October 10, 2023
    Publication date: August 1, 2024
    Inventors: Kyu Hoon Cho, Jae Seung Lee, Jin Pyung Park, Min Jae Lee
  • Patent number: 12041001
    Abstract: Aspects of the disclosure provide a front-end module for a wireless device comprising at least one transmit path configured to provide a first sounding reference signal, at least one transmit/receive path coupled to at least one antenna port, a sounding-reference-signal port configured to provide the first sounding reference signal and to receive a second sounding reference signal, an antenna switching module coupled between the at least one transmit path, the at least one transmit/receive path, and the sounding-reference-signal port, the antenna switching module being configured to provide the first sounding reference signal from the transmit path to the at least one transmit/receive path and the sounding-reference-signal port and to provide the second sounding reference signal received at the sounding-reference-signal port to the at least one transmit/receive path.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: July 16, 2024
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Srivatsan Jayaraman, Anand Raghavan, Jin Hoon Cho, Lige Wang
  • Patent number: 11855663
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: December 26, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20230412198
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20230344452
    Abstract: Radio frequency front-end systems with filter reuse. In certain embodiments, a front-end system includes a filter, a low noise amplifier (LNA), and a switch interposed between the filter and an input to the LNA. In a first state of the switch, the filter serves to filter a radio frequency signal that is amplified by the LNA. The front-end system further includes a power amplifier that is coupled to the switch. Additionally, in a second state of the switch, the filter serves to filter an amplified radio frequency transmit signal provided by the power amplifier. Accordingly, a filter along a receive path of the front-end system is reused for transmit.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 26, 2023
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20230179234
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 8, 2023
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Patent number: 11671122
    Abstract: Radio frequency front-end systems with filter reuse. In certain embodiments, a front-end system includes a filter, a low noise amplifier (LNA), and a switch interposed between the filter and an input to the LNA. In a first state of the switch, the filter serves to filter a radio frequency signal that is amplified by the LNA. The front-end system further includes a power amplifier that is coupled to the switch. Additionally, in a second state of the switch, the filter serves to filter an amplified radio frequency transmit signal provided by the power amplifier. Accordingly, a filter along a receive path of the front-end system is reused for transmit.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: June 6, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Patent number: 11601144
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 7, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20220239430
    Abstract: Aspects of the disclosure provide a front-end module for a wireless device comprising at least one transmit path configured to provide a first sounding reference signal, at least one transmit/receive path coupled to at least one antenna port, a sounding-reference-signal port configured to provide the first sounding reference signal and to receive a second sounding reference signal, an antenna switching module coupled between the at least one transmit path, the at least one transmit/receive path, and the sounding-reference-signal port, the antenna switching module being configured to provide the first sounding reference signal from the transmit path to the at least one transmit/receive path and the sounding-reference-signal port and to provide the second sounding reference signal received at the sounding-reference-signal port to the at least one transmit/receive path.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 28, 2022
    Inventors: Srivatsan Jayaraman, Anand Raghavan, Jin Hoon Cho, Lige Wang
  • Publication number: 20220069846
    Abstract: The radio frequency front-end systems herein include modules having bandwidth controllable components, such as amplifier and filters. By implementing the modules with bandwidth control, the same module can be used for operation of multiple frequency bands including a first frequency band and a second frequency band. Thus, when implementing features such as carrier aggregation, multiple-input multiple-output (MIMO), and/or sounding resource signaling (SRS) for supporting the multiple frequency bands, the total number of modules used can be reduced and/or additional feature support can be provided compared to an implementation in which each module supports a single frequency band.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 3, 2022
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho
  • Publication number: 20220069850
    Abstract: Radio frequency front-end systems with filter reuse. In certain embodiments, a front-end system includes a filter, a low noise amplifier (LNA), and a switch interposed between the filter and an input to the LNA. In a first state of the switch, the filter serves to filter a radio frequency signal that is amplified by the LNA. The front-end system further includes a power amplifier that is coupled to the switch. Additionally, in a second state of the switch, the filter serves to filter an amplified radio frequency transmit signal provided by the power amplifier. Accordingly, a filter along a receive path of the front-end system is reused for transmit.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 3, 2022
    Inventors: Lup Meng Loh, Aleksey A. Lyalin, David Richard Pehlke, Anand Raghavan, Jin Hoon Cho