Abstract: An optical-electrical connector (100) includes a housing (11), a circuit board (3) received in the housing and having a transducer for bidirectional optical-electrical signal conversion, a lens member (42) mounted on the circuit board, a ferrule (43) receiving a number of optical channels and having a resisting face (431), a supporting portion (51) having a base wall (511), and a resilient member. The ferrule is situated behind the lens member within the housing and aligned with the lens member along a front-to-back direction. The resilient member is permanently maintained an invariable compressed state between the base wall and the resisting face of the ferrule to provide an invariable forward resilient force to the ferrule for fixing the ferrule to the lens member, when the optical-electrical connector is used and unused.

Abstract: The present invention provides an engagement assembly for connecting a reflector and a connecting rod. The engagement assembly has a fixing base and a fixing plate. The fixing base has a head accommodating room for holding a head portion of the connecting rod and a plate retaining space formed between two protrusion rings. The fixing plate is mounted in the plate retaining space and has a position-limiting portion and two fixing portions. The position-limiting portion has a through hole for inserting the head portion and at least two tongues. The tongues are mounted on an inner edge of the through hole for clamping the head portion of the connecting rod that has entered the head accommodating room. The engagement assembly provides a strong linking structure for the reflector and the connecting rod.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: Embodiments of the present invention relate to the field of communication technologies, and disclose a method and device for network access. The method includes: detecting whether a notification message reported by an x digital subscriber line module is received within a set time, wherein the notification message is used for indicating that the x digital subscriber line module is connected to a network successfully; if yes, establishing a connection between a service terminal and the x digital subscriber line module so that the service terminal accesses the network through the x digital subscriber line module; and if no, establishing a connection between the service terminal and a 3G data card module so that the service terminal accesses the network through the 3G data card module.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: A wireless connection method is applicable to establishing a wireless connection device between an uplink device and a downlink device, and includes obtaining uplink wireless configuration information, and configuring a downlink with the obtained uplink wireless configuration information. A wireless connection is established with the uplink device based on the uplink wireless configuration information and, after successful connection establishment, a wireless connection is established with the downlink device based on the uplink wireless configuration information.

Abstract: A home gateway is disclosed. The home gateway includes: a digital enhanced cordless telecommunications (DECT) module, configured to communicate with a DECT terminal in a local area network (LAN) covered by the home gateway and provide the DECT terminal with voice services; a digital subscriber loop (xDSL) module, configured to communicate with a data service terminal in the LAN covered by the home gateway and provide the data service terminal with data services; a power module, configured to supply power to the DECT module and/or the xDSL module; a selecting module, connected to the power module and configured to connect the power module to the DECT module and/or the xDSL module selectively. By using the home gateway of the present invention, the electricity of the power supply provided for the home gateway may be controlled and saved.

Abstract: The embodiments of the present disclosure provide a PLC apparatus and a method for controlling the PLC apparatus. The method includes: acquiring a working state and a network state of the PLC apparatus; and switching the working state of the PLC apparatus in accordance with the working state and the network state of the PLC apparatus. The PLC apparatus includes: a working state acquiring unit adapted to acquire a working state of the PLC apparatus; a network state acquiring unit adapted to acquire a network state of the PLC apparatus; a switching unit adapted to switch the working state of the PLC apparatus in accordance with the network state of the PLC apparatus acquired by the network state acquiring unit and the working state of the PLC apparatus acquired by the working state acquiring unit. The embodiments of the disclosure are used in the design of controlling the PLC apparatus.

Abstract: In a method of fabricating a semiconductor device, a first mask pattern is formed on a substrate. The first mask pattern has a first opening formed to expose the substrate. An oxidation barrier region is formed in the substrate exposed by the first opening, and the first mask pattern is patterned to form a second mask pattern having a second opening. A gate insulation layer is formed on the substrate exposed by the second opening. The gate insulation layer has a variable thickness.

Abstract: A surface acoustic wave substrate includes: a diamond layer; a piezoelectric layer of aluminum nitride; and a titanium nitride-based buffer layer sandwiched between the diamond layer and the piezoelectric layer. The titanium nitride-based buffer layer includes a graded structure or includes a first sub-layer of titanium and a second sub-layer of titanium nitride sandwiched between the first sub-layer and the piezoelectric layer.

Abstract: In a method of fabricating a semiconductor device, a first mask pattern is formed on a substrate. The first mask pattern has a first opening formed to expose the substrate. An oxidation barrier region is formed in the substrate exposed by the first opening, and the first mask pattern is patterned to form a second mask pattern having a second opening. A gate insulation layer is formed on the substrate exposed by the second opening. The gate insulation layer has a variable thickness.

Abstract: A light-emitting diode (LED) device has a shade, an active heat-dissipation device and an LED module. The shade has a cavity. The active heat-dissipation device is mounted in the cavity in the shade and has a cooling board, an evaporator, a condenser, a compressor, an expansion valve and a refrigerant. The evaporator, condenser, compressor and expansion valve connect to each other to form a loop. The refrigerant is set in the loop. The LED module is mounted to the active heat-dissipation device and has at least one LED. The active heat-dissipation device dissipates the heat from the LED and even lowers the temperature of the LED under ambient temperature.

Abstract: A deep source/drain region and a source/drain extension region may be formed in a semiconductor substrate adjacent to a gate electrode. A first silicide layer may be formed on the source/drain extension region. A gate spacer may be formed on a sidewall of the gate electrode to cover the first silicide layer. A second silicide layer may be formed on the deep source/drain region outside the gate spacer.

Abstract: A surface acoustic wave substrate includes: a diamond layer; a piezoelectric layer of aluminum nitride; and a titanium nitride-based buffer layer sandwiched between the diamond layer and the piezoelectric layer. The titanium nitride-based buffer layer includes a graded structure or includes a first sub-layer of titanium and a second sub-layer of titanium nitride sandwiched between the first sub-layer and the piezoelectric layer.

Abstract: A multilayer material useful for packaging is disclosed, comprising a foam core comprising compressed foamed starch and a facing layer bonded to a surface of the foam core. A method of making the multilayer material is also disclosed, comprising forming a core of foamed starch, compressing the foamed starch core and bonding a facing layer to a surface of the foamed starch core. Apparatus for making the multilayer material is also disclosed, comprising a first station for supplying foamed starch pieces to a transport surface, a second station, downstream of the first station, for applying a bonding agent to the surfaces of the foamed starch pieces, a compressor for compressing the foamed starch pieces downstream of the second station; and a bonder for bonding a facing layer to at least one surface of the compressed foamed starch.

Abstract: A light-emitting diode (LED) device has a shade, an active heat-dissipation device and an LED module. The shade has a cavity. The active heat-dissipation device is mounted in the cavity in the shade and has a cooling board, an evaporator, a condenser, a compressor, an expansion valve and a refrigerant. The evaporator, condenser, compressor and expansion valve connect to each other to form a loop. The refrigerant is set in the loop. The LED module is mounted to the active heat-dissipation device and has at least one LED.